3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D SPI
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Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
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The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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5D SPI
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On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Product
Solder Paste
MVP Versa (3D SPI)
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The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Solder Paste Inspection
3D SPI
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Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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3D Antennas
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A 3D capable printing technology designed to create printed electronics directly on 3D surfaces using modern software controlled digital process.
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3D Cameras
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*Visual assessment of distance, level or volume*Time-of-flight measurement principle*Illumination, measurement and evaluation in one unit*Output of distance and grey values*Integration by means of intuitive parameter setting software
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Process Improvement Software for SPI & AOI
SIGMA Link
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SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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3D Scanner
Artec Eva
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This structured light 3D scanner is the ideal choice for making a quick, textured and accurate 3D model of medium sized objects such as a human bust, an alloy wheel, or a motorcycle exhaust system. It scans quickly, capturing precise measurements in high resolution, which allows for almost unlimited applications, without the use of additional equipment.
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3D Software
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Along with manufacturing professional 3D scanners, Artec develops smart 3D scanning software. Meticulously designed to meet the needs of both new and experienced users alike, it is the best choice for any application.
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3D LaservScanners
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With unsurpassed accuracy and scan quality API’s Hemispherical Scanner is ideal for use Building Information Modeling (BIM), historical preservation and forensics.
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3D Sensors
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Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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3D Optical Profiler
Nexview™ NX2
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Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
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3D Scanner
Artec Leo
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The first 3D scanner to offer onboard automatic processing, Artec Leo is able to provide the most intuitive workflow, making 3D scanning as easy as taking a video. As you scan your object, see the 3D replica being built in real time on Leo’s touch panel screen. Rotate the 3D model, check if you have captured all areas, and fill in any parts you may have missed.
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3D Inspection Service
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The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Product
SPI Flammability Tester (Vinyl Material)
TF318
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TESTEX Testing Equipment Systems Ltd.
SPI Flammability Tester (Vinyl Material), to determine the ignition properties of vinyl plastic film material according to CFR 16 Part 1611 U.S.A. Flammable Fabrics Act for flammability of apparel vinyl plastic film.The rate of burning shall not exceed 1.2 in./s as judged by the average of five determinations lengthwise and five determinations transverse to the direction of processing, when specimen is placed at an angle of 45 degree and expose to the standardized flame (22# fire nozzle, 1/2 inch. In length).
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3D CT AXI
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PCB manufacturers can enjoy comprehensive, high-speed inspection with Omron’s revolutionary technology that reliably captures defects in hidden areas.
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Product
Relay Test Set Type SP-I
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Supreme Instrument Laboratories
Supreme make relay testing set is designed for site testing of protective relays which simulate in common fault conditions under which a protective relay will be called into positive function. Periodic field testing is the best way of ensuring the integrity of the protective relays. We offer our relay testing set with specific testing capacity to suit different group of protective relays. The testing set operates on single phase 230 V, A.C. 50Hz. Supply.
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3D Scanner
Raptor3DX
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Raptor3DX is a hybrid type optical scanner, enabling both the automatic and stationary modes for users. The compact, detachable scanning sensor acts as a powerful sensor engine when as automatic mode; a flexible scanner itself when used as stationary mode, providing three FOV in one.
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3D Scanning Services
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The 3D scanning services provided by our 3D scanning facilities can capture 3D measurements from objects as small as a pin head or as large as a nuclear power generation facility. When we remove the constraints imposed by conventional measurement technologies, the scope of applications becomes virtually limitless with 3D digital data in hand.
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3D Profile Sensor
Z-Trak2
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Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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3D Inspection Software
Metrolog X4
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Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Advanced 3D Graphic
Geo Surface3D PRO
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ScienceGL offers 3D visualization for extended GIS data that combines multiple layer terrain and multi-variable thematic map in one interactive 3D screen. Visualize Digital Elevation Model (DEM), land map, roads, satellite image, LIDAR data in the same screen. Combine terrain data with vector graphics, businesses thematic map, weather map, etc. Use transparancy to highlight more important data. The unique combination of GIS and multi-variable thematic maps helps to discover trends and patterns quickly and accurately. No other data presentation method comes close to expressing so much information within such a small space.
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3D Multibeam Scanning Sonar
ProScan™
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Teledyne BlueView's 3D Multibeam Scanning Sonar user interface software. ProScan connects to the sonar and pan/tilt unit, configures each scan, generates full 3D point clouds, and optionally streams output to third party hydrographic software for fusion with other sensors. Data is recorded in multiple file formats: .son (raw acoustic data file for ProScan reprocessing), .txt (plain text record of all point locations and positional data) and .xyzi (industry standard xyzi data for 3D point cloud viewers, registration software, etc.). In playback mode, users can review and reprocess scans to modify sound speed, intensity threshold, multidetect and range settings as needed. ProScan coupled with Teledyne PDS MotionScan, pitch, roll heading and position sensors provides the capability to scan areas to collect 3D point clouds while correcting for motion.
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3D Sensors
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*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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3D AOI with Revolutionary New 3D Measurement
Zenith
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The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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3D Video Microscope
BVM-20104
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The microscope is configured with 1.3M HD industrial camera. VGA image output interface, can be connected to the computer and monitor directly. clear and vivid image, taking photos, SD card storage, auto exposure. Camera is equipped with remote control panel, which makes the operation much easier. Optical lens keep parfocal under zoom, there is no deviation for center; 3D rotary observation
