Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Product
Digital Multi Channel Analyzer
DT5770
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The DT5770 is a compact portable 16k Digital MCA for Gamma Spectroscopy, integrating analog front-end with programmable gain and possible AC coupling. It is ideally suited for high energy resolution semiconductor detectors, like HPGe and Silicon, connected to a Charge Sensitive Preamplifier (CSP). The unit can also properly operate directly connected to a PMT with inorganic scintillators (e.g. Nal or Csl scintillators), provided exponential pulse shape and decay time above 200 ns.
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Product
Scanning Electron Microscope
Verios G4 XHR SEM
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The Thermo Scientific™ Verios G4 scanning electron microscope (SEM) provides sub-nanometer resolution from 1 to 30 kV and enhanced contrast needed for precise measurements on materials in advanced semiconductor manufacturing and materials science applications, without compromising the high throughput, analytical capabilities, sample flexibility and ease of traditional Scanning Electron Microscope (SEM).
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Product
Semiconductor Authenticity Verification & Anti-Counterfeiting
JTAG Interrogator
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Top manufacturers have used JTAG tests for years to ensure electronic systems are free from defects and assembled correctly. With growing uncertainty in supply chains and the proliferation of counterfeit components, that same technology can be used to verify the authenticity of system components.The Corelis JTAG Interrogator is an affordable solution for semiconductor verification. The software and hardware system provides the means to quickly identify components on an assembled electronic product by reading available information from the JTAG chain. Components can also be scanned to discover undocumented opcodes that may indicate hidden JTAG capabilities such as backdoors and harmful or malicious functions.Fast and nonintrusive JTAG component identification has never been so easy.
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Product
SC-1 Monitor
CS-131
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The CS-131 is a high-precision chemical concentration monitor designed for use with SC-1 solutions used in cleaning processes during semiconductor manufacturing. It offers a faster response speed in a more compact size than anything available to date. The CS-131 monitors the concentrations of the individual components of the SC-1 solutions (NH3/H2O2/H2O) which is widely used to remove particles and organic substances. The monitor has a number of outputs which can be utilized to keep the concentrations of the individual elements of the SC-1 solutions within the allowable ranges; this eliminates unnecessary replacement of chemicals potentially increasing bath life time and reducing chemical cost. In addition, a model with an integrated cooling unit is available, allowing accommodation of a broader range of sample temperatures.
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Product
Programmable Parametric Tester For Discrete Semiconductors
IST-8800
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IST Information Scan Technology, Inc.
The IST-8800 is a fully programmable, low cost tester that provides parameter measurements or parametric GO/NO GO test for transistors, diodes, MOS-FETs, Regulators, Triacs, Zeners, SCRs, and J-FETs. These devices can be tested up to 5 amps or 1200 volts with a measurement range down to the nano amp range. Only four universal test fixtures are required which can test the device across a wide range of packages.
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Product
High-resolution, SWIR InGaAs camera
Wildcat+ 640 Series
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The Wildcat+ 640 series is based upon a state-of-the-art InGaAs detector with 640×512 pixels and 20 μm pixel pitch. The camera offers superior, high resolution SWIR imaging capabilities, comes in a versatile and industry-proven Wildcat camera package (GenICam compliant) and offers advanced on-board image processing.The Wildcat+ 640 camera outputs full frame images up to 300 Hz via either a CameraLink or USB3 Vision interface.The Wildcat+ 640 is suitable for semiconductor inspection, display inspection (mobile phone and TV), and laser beam analysis.Benefits & Features- Compact and industry-proven camera design- High-resolution SWIR imaging- Advanced on-board image processing performance- GenICam complaint- Flexible optical mount and lens options
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Product
Semiconductor
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The semiconductor industry faces continuous pressure to reduce device size and costs while improving performance and reliability. Semiconductor, test and assembly automation manufacturers demand the same improvements from the motion technology which drives it. Haydon Kerk Pittman continues to develop new technologies in motors, lead-screws, gears, encoders, actuators, slides, drives and complete sub-systems that increase operational speeds and accuracy while lowering the cost of ownership.
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Product
Semiconductor Equipment Manufacturers
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Integrated Dynamics Engineering
With shrinking process geometries, new structural elements and a major increase in substrate size, the challenges to improving process yield and overall throughput have increased exponentially. These demands drive a stringent requirement for system stability and overall immunity from internal and external forces.
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Product
2MP Wide Temperature Range Industrial Grade HDR Camera
E-CAM20_CU0230_MOD
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e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement.
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Product
Solid-State And Electromechanical Relay Products
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Relay is the name for a switch that is operated electro-mechanically or electronically. Their main task is to make and break connections to control the flow of current in electrical circuits. They’re used for various purposes ranging from validating semiconductors to interfacing low power computers or microcontrollers with high power machinery.
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Product
Automated Discrete Semiconductor Tester (ATE)
5300HX
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The Model 5300HX Automated Discrete Semiconductor Tester (ATE) is designed for fast, reliable testing of a wide range of discrete devices. Using an on-board Intel SBC, can provide stand alone testing capability or connected to a PC for intuitive test development and data capture.
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Product
PXIe-4162, 12-Channel, ±24 V, Precision PXI Source Measure Unit
785680-01
Analog Input Module
PXIe, 12-Channel, ±24 V, Precision PXI Source Measure Unit - The PXIe-4162 is a high-precision, high-density source measure unit (SMU) with 12 identical SMU channels. This module features 4-quadrant operation, integrated remote (4 wire) sensing in each channel for accurate measurements, as well as analog-to-digital converter technology to help you perform high-precision measurements. It also features guard terminals to remove the effects of leakage currents and parasitic capacitances. Additionally, the PXIe-4162 can maximize stability and measurement accuracy with SourceAdapt technology, which you can use to tune the transient response to match the characteristics of any load. The PXIe-4162 is ideal for a broad range of mixed-signal integrated circuits (ICs) in semiconductor production test.
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Product
Faraday Cages
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LBA's EMFaraCage® faraday cages are EMI and RFI shielding boxes and RF test enclosures that bring convenience to device testing. Faraday cages are ideal for isolating critical systems in high field RF environments or wherever RF ingress or egress must be minimized. Security, production testing, biomedical research and semiconductor testing are only a few of the many areas where EMFaraCage® faraday shielded enclosures are employed. EMFaraCage® faraday cage enclosure systems are fully featured to support a wide variety of test missions. The standard faraday cages include effective power, dataline and RF signal isolation in large test volumes. EMFaraCage® faraday cages are much more affordable than shielded room solutions and offer the convenience of portability.
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Product
Compact Semiconductor ATE
QST286
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Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST286 is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features makes it ideal for high throughput production testing of wide range of low pin count medium power ICs as listed below but not limited to Optocouplers, Isolators, LEDs, Photo diodes, Photo transistors, Photo sensors, Photo detectors , Analog Mux , Relays and more.
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
Parts Screening And Testing
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DPA Components International performs 100% screening as well as qualification testing on electronic parts supplied to the high reliability Commercial, Industrial, Space, and U.S. Military sectors. We generate software and hardware to test microcircuits, discrete semiconductors, hybrids, PEMS, and other EEE electronic components to exact customer and military specifications.
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Product
RF & Microwave Signal Generator
SMA100B
Microwave Signal Generator
The R&S®SMA100B RF and microwave signal generator delivers uncompromising maximum performance. It provides the purest output signals while maintaining the highest output power levels with the lowest harmonics, far outpacing the competition. As the world's leading signal generator, it can handle the most demanding module and system T&M tasks in the RF semiconductor, wireless communications, aerospace and defense industries.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
Multiple Camera Board For NVIDIA® Jetson AGX Xavier™
E-CAM130_CUXVR
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e-CAM130_CUXVR is a synchronized multiple 4K camera solution for NVIDIA® Jetson AGX Xavier™ development kit that has up to four 13 MP 4-Lane MIPI CSI-2 camera boards. Each camera is based on the camera module e-CAM137_CUMI1335_MOD, 1/3.2" AR1335 color CMOS image sensor from ON Semiconductor® and integrated high performance Image Signal Processor (ISP). All these four cameras are connected to the base board using 30 cm micro-coaxial cable. These four 4-lane MIPI camera modules can be synchronously streamed in 4K resolution, which will be best fit for high end multi camera solution. Customers can opt to purchase anything between single camera to four cameras as according to their requirement.
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Product
Enterprise Software
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In the race to digitize semiconductor manufacturing operations, Onto Innovation’s productivity software delivers the competitive advantage you need to capture market share. Our software connects information on a tool, within a factory, or across an entire global supply chain to capitalize on the potential of your biggest asset: your data.
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Product
VXI Digital Test Instrument
T940 Series
Test Instrument
The T940 Series for the VXIbus provides the basis for a complete state-of-the-art digital solution at the subsystem level. The T940 is the solution for both legacy digital replacement and new test stations to be built for digital test including aircraft/ avionics, weapons systems, spacecraft, semiconductors and medical devices.
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Product
Semiconductor Interconnect
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Materials that are usable in all backend BI/reliability applicationsHigh IO count capabilityFine pitch down to 0.25 The industry’s smallest DDR4 and DDR5 socket outlineAdvanced plating technologies and custom outlines
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Product
Surface Photovoltage
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The surface photovoltage spectroscopy modules are the perfect all-in-one solution for in-depth studies of light sensitive materials such as organic semiconductors, solar cells or light sensitive dyes.
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Product
Scanning Acoustic Microscope
Pulse2
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This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Product
All-in-one PMAC Brick
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Brick PMAC's combine a PMAC controller with either 4 or 8 servo drives in one package used in industrial automation and semiconductor manufacturing.
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Product
Relays & Contactors
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Panasonic Industrial Devices Sales Company of America
Relay options include Panasonic's exclusive PhotoMOS® Semiconductor Relays (otherwise known as Photo, Photo Voltaic, Solid State or MOS-FET Relays) along with Power, Signal, Automotive and High Frequency Relays.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Specialty Sources
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When conventional sources hit their limits, specialty sources step in. These custom-designed plasma and vapor sources are engineered for III-V MBE and compound semiconductor applications where unique material delivery and control are critical.
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Product
RF Power Transistors
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A specialized semiconductor device designed to amplify or switch high-frequency (Radio Frequency) signals, enabling powerful wireless communication in everything from cell phones and Wi-Fi to radar and satellite systems by handling significant power levels at speeds from kilohertz to gigahertz.
