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MTCA.3 Conduction Cooled MicroTCA Carrier Hub (MCH)
UTC041
The VadaTech UTC041 is the most feature-rich conduction cooled MicroTCA Carrier Hub (MCH) on the market. Its management software is based on VadaTech’s robust Carrier Manager and Shelf Manager which have been deployed for years with proven results. The MCMC manages the Power Modules, Cooling Units, and up to 12 AMCs within the chassis. It also manages PCIe Gen3 or 10GbE XAUI fabric switch as well as the standard GbE with 10GbE uplink Base Channel switch.
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NVMe-oF
NVMe/oF adoption is rapidly increasing and full NVMe specification conformance over Ethernet networks or Fibre Channel fabrics requires the ability to validate transactions over all transports.
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Rotman Lens Designer
Rotman Lens Designer (RLD) is a software tool for the design, synthesis, and analysis of Rotman Lenses and their variants. It is based on Geometrical Optics combined with the classical Rotman Lens design equations. It is intended for rapid development and analysis of Rotman Lenses given several physical and electrical input parameters. RLD generates the proper lens contours, transmission line geometry, absorptive port (dummy port) geometry, provides an approximate analysis of performance, and generates geometry files for import into Remcom's XFdtd® for further analysis and fabrication.
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FTB Ecosystem
Imagine test tools that actually help you deliver services with speed and quality. Imagine if you could institutionalize operational efficiencies, eliminate silos and make every component of your deployment, turn-up and monitoring part of one tightly woven fabric.
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DUT Boards
RTI designs and manufactures DUT boards for many types of special purpose test equipment including: ESD test systems, special purpose functional testers, automated curve trace equipment, as well as standard semiconductor test equipment. All designs are performed in-house using PCB design software (Mentor PADS, CAM350) and 3D mechanical design software (Solid Edge) if required. PCB fabrication is sub-contracted to one of our long-time fabrication partners.
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Computer Control Tensile Testing Machine
SG-L03B
These series of universal testing machine are used to test tension, compression, bend, shearing force, adhesion, peeling force, tear strength,...etc. of specimen, semi-product and finished product in the field of rubber, plastic, metal, nylon, fabric, paper, aviation, packing, architecture, petrochemistry, electric appliance, automobile,...etc. , which are the basic facilities for input quality contorl (I.Q.C), Quality Control (Q.C.), Physical Inspection, Mechanics Research and Material.
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Plasma Power Generators
Advanced Energy’s field-proven, Precision PowerTM solutions offer extreme control, peerless arc handling, and cutting-edge match technology. Unlock new fabrication processes and benefit from our plasma power generators’ comprehensive capabilities.
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Instruments
Advanced Thermal Solutions, Inc.
ATS designs and fabricates the most extensive line of thermal test instruments specifically designed for the electronics industry. These research-quality, state-of-the-art instruments include Pressure, Temperature and Velocity Measurement Systems, Airflow and Heat Flux Controllers, Micron-level Thermography Systems and Cold-Plate Thermal Characterization Systems.
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IDA Electrodes
Interdigitated Array (IDA) electrode is an electrode developed for electrochemical measurements to be performed in a very small quantity of the sample. IDA electrode could be applied for the detection and reaction analysis of the compounds in a small quantity of the sample. IDA electrode is a microelectrode pattern fabricated by using the lithography technology. The Electrodes are composed of 65 pairs. In each one of the pair has a function of the oxidation and reduction electrodes.
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CrumpleFlex Tester
TF117C
TESTEX Testing Equipment Systems Ltd.
The equipment tests a tube of fabric by twisting it through 90o stretching alternately compressing the tube at the same time. After completion of the test the fabric is tested for resistance to penetration by water. CrumpleFlex Tester is fitted with electronic pre-determined counter with automatic stop at a pre-determined number of cycles, also fitted with acrylic plastic interlock safety cover.
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Apertures
ARC possesses the machining techniques, skill and equipment to fabricate a wide variety of apertures in a similarly wide variety of materials. The aspect ratio of aperture opening to material thickness is generally limited to a 1:20 ratio. Shown on the right in Figure 1 is an aperture with a wide series of holes ranging from 15um to 960um.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Reverberation Tent
This product is a chamber made of metal flexible fabric tent assembled as a cavity that provides a periodic electro-magnetic environment randomly polarized, spatially uniform, and isotropic.
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Semiconductor
Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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ICI Mace Snag Tester
TF220
TESTEX Testing Equipment Systems Ltd.
ICI Mace Snag Tester. To determine the tendency of fabrics to snag (pull yarn loops from fabric) in normal wear (mace snag).Provided with 4 rotating test cylinders fitted with sleeves of test fabric, mace balls with tungsten carbide points and controlled by a predetermined electronic counter.
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Oscillatory / Wyzenbeek Abrasion Tester
TF212
TESTEX Testing Equipment Systems Ltd.
Wyzenbeek Abrasion Tester. Modern ergonomic design to determine the abrasion resistance of fabrics when rubbed against a standard abrasive or a wire mesh screen with a backward and forward motion over a curved surface. Wyzenbeek abrasion tester applies to automotive and furniture industry fabric manufacturers working to US Standards Motor driven with 4 abrasion heads and electronic digital counter to control the number of cycles.
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Lab Thermosol Range
TD640
TESTEX Testing Equipment Systems Ltd.
The fabric samples are padded by the horizontal pneumatic type padder is held on both ends by special clip bars, this complete sample holder is mounted on the chamins which are running endlessly through the machine.
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Electronic Moisture Analyzer
MOC-120H
The moisture content of a variety of samples can be measured using an array of drying modes. The drying status can be seen at-a-glance with the fluctuation range display. Active in a variety of fields (cereals, starch, flour, noodles, brewed products, sea foods and marine products, meat products, spices, sweets, dairy products, dried foods, vegetable oils and other food articles; pharmaceuticals; ores; cokes; glass materials; cement; chemical fertilizers; pulp and paper; cotton; various fabrics and other industrial goods); enabling measurement of samples (cereals, foods, and chemical products) under various conditions (powder, particles, paste, and liquid).
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88-lane, 44-port, PCI Express
PEX89088
The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems supporting ML/AI and Server/Storage applications.
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Bipolar Supply Voltage Output D/A Converters
Analog Devices is an industry-leading provider of bipolar d/a converter solutions offering exceptional 1 ppm performance and optimized feature sets to ensure quick and easy deployment of bipolar converters across a range of end applications. With a comprehensive portfolio of bipolar DACs fabricated using proprietary iCMOS® process technology, ADI has enabled the development of high performance ICs at high voltage levels while simultaneously reducing package size and power consumption. By bringing together the many benefits of integration, ADI’s bipolar DACs reduce design time and system complexity.
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Coefficient Of Friction Tester
COF-02
Jinan Leading Instruments Co., Ltd.
COF-02 Coefficientof Friction Tester is applicablein static and kinetic coefficient of friction tests of plastic films, sheets,rubber, paper, PP woven bags, fabric style, metal-plastic composite strips/belts for communication cable, conveyor belts, wood, coatings, brakepads, windshield wipers, shoe materials and tyres, etc. With the materialsmoothness testing, users can control and adjust material quality technicalindexes to meet application demands. Besides, this tester is applicable for thesmoothness measurement of cosmetics, eye drop and other daily chemistry.
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CCD Foundry Services
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Infrared Simulation Services
INO offers a simulation service to assist with the hardware and software design of infrared and electro-optical devices. Precise performance predictions help integrators understand application requirements and bring application performance in line with client specificationsbefore the advance design and fabrication phases. For a minimal investment, infrared simulations help minimize risk in the early stages of development.
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Custom Vibration Testing Fixtures
Paragon Systems is unique in being able to not only perform your vibration test, but also to design, fabricate and qualify your vibration testing fixtures. Usually all we need from a client is their vibration test profile, a CAD model and the GD&T of the DUT.
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XMC
LinkedHope Intelligent Technologies Co.,Ltd.
XMC is a PMC with high-speed serial fabric interconnect defined by the VITA 42 standard.
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Auto Bursting Strength Tester
TF142A/B
TESTEX Testing Equipment Systems Ltd.
Auto Bursting Tester, to determine the bursting strength of fabric, woven or knitted fabrics, non-woven, paper and board by the Application of hydraulic load under a rubber diaphragm of a specific area.
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Multi-element Hydrophones
We have designed and fabricated a wide variety of multi-element sensors based upon our PVdF lamination technology.
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Water Vapour Permeability Tester
TESTEX Testing Equipment Systems Ltd.
Water Vapour Permeability Tester, to determine the resistance of textiles and textile composites (particularly action wear fabrics) to water vapour penetration. Water Vapour Permeability Tester complies with BS 3424/7209, etc.
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Advanced Aggregators
Aggregators are devices designed to increase efficiency and port utilization of network packet brokers. They are commonly used at the network edge or in TOR applications where port utilization tends to be low. Aggregators are also capable of pre-filtering traffic prior to sending out to Network Packet Broker’s for advanced filtering or taking the place of packet brokers in applications where only L2-L4 filtering is required. Aggregators improve ROI by reducing the total cost of a network visibility fabric and increasing the efficiency of existing infrastructure.
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3U CompactPCI Serial Blades
The PICMG CPCI-S.0 CompactPCI Serial standard, which evolved from the PICMG 2.0 specification, is the fastest, most versatile, most cost-effective open standard for CompactPCI (CPCI). The Serial standard is mechanically and electronically compatible with 3U and 6U euro-cards, defining an interface for high-speed switched fabrics with a star topology. Point-to-point connectors allow up to eight peripherals on one system slot without switches or bridges. Ethernet data transfer can be configured with full mesh topology, which allows up to 1000Base-T connections to all peripheral slots for redundant, safety-critical systems.
