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Product
Computer On Modules
ETX/XTX
Computer on Module
ETX / XTX CPU module eqiupped with Intel Atom has great I/O capacity and meets both ISA and PCI needs, while supporting the Computer On Module concept for plug-in CPU modules. Advantech is a founding member of the ETX Industrial Group (ETX-IG).
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Product
SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
Computer on Module
ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
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Product
COM Express® Type 6 Reference Carrier Board in ATX Form Factor
Express-BASE6
Computer on Module
The Express-BASE6 is an ATX size COM Express Type 6 reference carrier board. Together with the COM Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
Computer on Module
Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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Product
14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
Industrial Computer
The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
Edge Computing Platform
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Product
COM Express® Type 6 R3.1 Reference Carrier Board In ATX Form Factor
Express-BASE6 R3.1
Computer on Module
Express-BASE6 R3.1 is an ATX COM-Express Type 6 Basic / Compact size module reference carrier board based on PICMG COM-Express Revision 3.1. Together with the COM-Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
Industrial Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
Computer on Module
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
MXE-1500 Series
Industrial Computer
The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
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Product
Intel® Pentium N4200/Celeron N3350 Pico-ITX SBC
MIO-3360
Single Board Computer
Embedded Intel® Pentium N4200/Celeron N3350DDR3L 1866MHz support up to 8BGIntel Gen 7 DirectX®11.1 supportDual Independent display: 48-bit LVDS, VGA, DP/HDMIExpansion: Full-size Mini PCIe, eMMC, mSATA*Rich I/O interface: 2 COM, 1 SATA, 4 USB 2.0, MIOe expansionSupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
Computer on Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
Industrial Computer
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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Product
3.5" Single Board Computer With Intel® Core™ Ultra Processors
SBC35-MTL
Single Board Computer
ADLINK SBC35-MTL, a compact 3.5" Single Board Computer equipped with Intel® Core™ Ultra Processors for efficient, high-performance computing. It features an integrated NPU to boost AI processing capabilities and includes a reserved MIPI-CSI signal pathway for easy camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
Computer on Module
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
Single Board Computer
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
Computer on Module
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
Computer on Module
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Ultra-Compact, Fanless, Low-Power Edge Computing Platform Powered By Intel® Processor N Series Or Atom® Processor X Series
MXE-230 Series
Industrial Computer
The MXE-230 Series computers, powered by the Intel® Processor N Series or Atom® Processor X Series, deliver low power consumption at just 12W. With an ultra-compact size of 165 x 120 x 62 mm (1.2L), they are ideal for space-constrained environments. The system supports up to 16GB DDR5 4800MHz memory, operates in temperatures from -20°C to 60°C, and offers two independent 4K 60fps display outputs. It also includes multiple I/O expansion options, such as M.2 and adaptive function modules, along with built-in TPM 2.0 for enhanced security.
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Product
Camera Link
R3-CL
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The R3 frame grabber family has been designed to simplify the task of interfacing today's Camera Link cameras to a wide array of imaging applications. The R3-CL can acquire from almost every Base CL camera manufactured.
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Product
3U OpenVPX ARM Cortex-A9
68ARM1
Single Board Computer
NAI’s 68ARM1 is a 3U VPX ARM® Cortex®-A9-based, Single Board Computer (SBC) that can be configured with up to three smart function modules. Ideally suited for rugged defense, commercial aerospace, and industrial applications, the 68ARM1 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.
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Product
3.5" Single Board Computer
RSB-4760
Single Board Computer
RSB-4760 is a RISC 3.5" single board computer (SBC) powered by Qualcomm ARM® Cortex®-A53 APQ8016 processor that supports full HD display and intergrades on board wireless solution – Wi-Fi, BT and GNSS. RSB-4760 also features in mini PCIe, M.2, and SIM card slots for expanding connectivity capability, like 3G, 4G/LTE modules. Equipped with complete Android, Linux and Debian BSPs, this SBC enables customers to easily develop unique application on specific OS.
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Product
Computer-On-Module
Open Standard Module (OSM)
Computer on Module
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Product
6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MXE-5500 Series
Industrial Computer
ADLINK's new Matrix MXE-5500 series of rugged quad-core fanless computers features the 6th generation Intel® Core™ i7/i5/i3 processors, delivering outstanding performance with robust construction.
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Product
Medical Box PC With IEC 60601-Compliant NVIDIA IGX Platform
MLB-IGX
Industrial Computer
- GPU: 2,048-core NVIDIA Ampere architecture with 64 Tensor Cores- CPU: 12-core Arm® Cortex®-A78AE v8.2- Up to 1,705 trillion operations per second of AI performance- NVIDIA® ConnectX®-7 smart network interface card (SmartNIC)- Ten years of NVIDIA® hardware and software support
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Product
COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
Computer on Module
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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