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Product
Test Handler
M4841
Test Handler
High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs.
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Product
Tabletop Single Site Test Handler
3111
Test Handler
The Chroma 3111 is an automated pick & place handling system ideal for small lot engineering samples and/or NPI test development parts.
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Product
Test Handler
M4872
Test Handler
Improve Efficiency in High-Volume Manufacturing and Device Characterization.
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Product
6TL36 Inline Handler
AM304
Test Handler
Test handler 6TL36 able to test DUTs inside Faraday ChamberDual line (bypass)
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Product
Die Test Handler
3112
Test Handler
Chroma 3112 is a productive pick & place handler for high volume single- or multi-site bare die testing.
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
Miniature IC Handler
3270
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Chroma 3620 is an innovative system handler for high-volume multi-site IC testing, especially for CIS Testing, at the system level.
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Product
Equipment Front End Module Wafer Handler
Sigma EFEM
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Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Product
Test Handlers
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Cohu has 50+ years of semiconductor test expertise designing and manufacturing pick-and-place, gravity feed, test-in-strip handlers, MEMS test cells, and turret-based test handling and back-end finishing equipment for ICs, LEDs and discrete components.Our test handlers support a variety of package sizes and device types, including automotive, mobile, power, micro-electromechanical systems (MEMS) and microcontrollers, among others.
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Product
Wafer Test
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Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Test Handler
JOT M5
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Simple, cost-effective way to automate PCB and pallet based testingSafe, reliable product handlingQuick-adjust ease: no product-specific partsFaster handling of smart productsIndustry 4.0 autonomous interconnectivityTruly scalable for growing test needsReusable, application-specific test boxesM-TestBoxes compatible with M1 handlerBoxes are fully independent, just pull out from M5 rack and use in off-line testingFail product separation to integrated magazineSpacious service-friendly constructionErgonomic workspaceTouchscreen UI with base statistics and service capabilityEasy start-stop operabilityAutomated width adjustment
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Product
WAFER MVM-SEM
E3300 Family
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The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Product
Wafer Prober
Prexa MS
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The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Product
Tri-Temp Octal Sites Handler
3160-C
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Chroma 3160-C is a productive pick & place system for high volume multi-site IC testing.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
High-Performance Strip Handler
MCT SH-5300
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SH-5300™ high-performance strip handler for testing advanced semiconductor packages, LEDs, MEMS sensors, and traditional ICs. It can handle a vast array of strip and laminate lead-frame sizes. Capable of tri-temp testing -55˚C to +160˚C and ambient testing to +160˚C.
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Product
Pick And Place Test Handlers
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Cohu offers a broad range of IC pick-and-place test handling solutions for the automotive, mobile, and computing markets. Our commitment is to provide world-class innovative products that incorporate thermal, vision and factory 4.0 automation options to meet your existing and future IC handling needs.
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Wafer Edge Profile Measurement
WATOM
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WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Product
Single Site Test Handler
3210
Test Handler
Chroma Single Site Test Handler 3210 supports various package types such as BGA series, QFP series, QFN, TSOP, and more. The handler is primarily designed for early device design and engineering validation.
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
High-Throughput Film Frame Handler
MCT FH-1200
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FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
