DIMM
Dual In-line Memory Module.
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Product
DDR4 Registered DIMM
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a type of computer RAM that features a register (or buffer) between the memory chips and the system memory controller. This register stabilizes the electrical load, allowing servers and workstations to utilize higher memory capacities and improve overall stability compared to unbuffered RAM (UDIMM).
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Product
32G DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-D4U32N32-SBW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
DRAM SO-DIMM DDR4 Memory
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Improve performance up to 50% (compared to SO-DDR3.) with Advantech! We offer industrial grade SO-DDR4 2666/2400/2133 memory with 30μ" gold plating connector (260 pin) featuring 1.2v low operating voltage with faster burst accesses.
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Product
Test Adapter
Ramcheck 100
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This addition to the RAMCHECK memory tester provides needed support for testing of SDRAM and standard EDO/FPM DRAM 100-pin SO DIMM modules at an affordable price.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
DRAM Memory Module DDR3 Memory
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Deliver stable memory technology with Advantech! We offers DDR3 1866/1600/1333 memory with 30μ" gold plating connector (240 pin) featuring 1.35v/1.5v low operating voltage and better bandwidth. With rigorous reliability, vibration tests, and 0 ~ 95℃ (32 ~ 203℉) wide operating temperature range, our certified DIMM is suitable for edge computing, enterprise, embedded, automotive, data centers, and networking applications.
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
16GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V16GR56-SB
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SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
Micro-ATX Motherboard 6th/7th Gen Intel® Xeon® E3 Processor LGA1151
AIMB-585SV
Motherboard
Supports SUSI, WISE-DeviceOn and Edge AI SuiteSupports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)Supports PCIE Gen3, 10 x USB 3.0, 2 USB 2.0, 8 x SATAIII, 1 miniPCIe(mSATA) and dual GbE LANSupports Intel AMT 11.0 and Intel vPro competentSupports DVI-D,HDMI2.0 ,DP++,eDP,VGAdisplayFour DIMM sockets support up to 64GB DDR4 2133/2400 MHz SDRAMSupports Intel® Xeon®/ 6th & 7th Gen Core™ i7/i5/i3 processor with C236 chipset
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Product
SO-DIMM DDR2 Memory
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Enable better electrical performance and speed (compared to SO-DDR) with Advantech. We offers industrial grade SO-DDR2 800/667 memory with 30μ" gold plating connector (200 pin), featuring 1.8v operating voltage and better bandwidth.
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Product
JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
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The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Product
8G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L8GN16-SG1
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DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
