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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
Motherboard
ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
12th Gen. Intel® Core I7/ I5/ I3 P-Series 3.5" SBC
MIO-5377
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12th Gen. Intel® Core™ Processor up to 12 Cores, TDP 28/15WDual Channel DDR5-4800 up to 64GB4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP2 GbE, 6 USB, USB4/TBT4, 4 UART, 2 CANBus, 3 I2C3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe)Supports iManager & Software APIs, WISE-DeviceOn
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Product
Intel® 8th/9th Generation Core I 2U Fan System
EPC-P3066
Embedded PC
Intel® 8th/ 9th Gen Core™ i processor (LGA1151) with Intel C246/H310Up to 4 x extension Card by Riser Card (Optional)3 x GigaLAN and upto 8 x USB3.02 x RS-232/422/485 and 4 x RS232 serial ports, 16 bit GPIO4 x SATA (max), 1 x M.2 E key, 1 x M.2 B/M key, 2 x F/S mSATAVGA+HDMI or 2 x HDMI output (Optional)12~24V DC input power rangeSupport Advantech I Door moduleSupport SUSI, WISE-DeviceOn and Edge AI Suite
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-279 A1
Motherboard
12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR4 3200MHz, max. 64GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power InputWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
8th Gen Intel® Core™ Processor BGA 1528
AIMB-233
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Supports Intel® Core™ core i7-8665UE /i5-8365UE/I3-8145UE/Celereon 4305UE, 15W TDP, BGA 1528 16nm ProcessorSupports two 260-pin SO-DIMM up to 64GB DDR4 2400 MHz SDRAMSupports multiple display I/O supports versatile Tri display functions for HDMI,Support PCIex1, 2 M.2 (1 F/S miniPCIe), 4 USB 3.1, 2 USB 3.0 and 2 SATA IIISupport wide range 12V~24V DC Input and low profile heightSupports WISE-PasS/RMM and Embedded Software APIsSupport SUSI, WISE-DeviceOn and Edge AI
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Product
Load Testing for Evolved Packet Core (ePC/VePC)
Flare
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Linkbit Flare is designed for load testing of Evolved Packet Core (ePC) networks, and the upcoming VePC deployments. It is based on the technology initially develped for Linkbit functional testers, and as a result is extremely flexible.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Product
Ka-Band Silicon 5G Quad Core IC
AWMF-0108
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The AWMF-0108 is a highly integrated silicon quad core IC intended for 5G phased array applications. The device supports four Tx/Rx radiating elements, includes 5 bit phase and 5 bit gain control for analog RF beam steering, and operates in half duplex fashion to enable a single antenna to support both Tx and Rx operation. The device provides 26 dB gain and +9 dBm output power during transmit mode and 28 dB coherent gain, 5.0 dB NF, and -28 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, Tx power telemetry, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Product
Double DDS Core
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AllWin Instrument Science and Technology Co., Ltd.
1. Double DDS core,high accuracy and high stability2. Store more than 20 kinds of waveforms3. Frequency range: 1 Hz~120 MHz
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Product
Versatile All-In-One Medical Panel PC Family With 12th/13th Generation Intel® Core™ Processor Performance
MLC-S Series
Panel PC
- Powerful 12th/13th Gen Intel® Core™ i3/i5/i7/i9 processor- 21.5’’or 23.8’’ full HD display with PCAP multi-touch touchscreen and anti-glare coated safety glass for unsurpassed visualization capabilities- 7 illuminated soft-touch function keys on the front glass- Edge-to-edge glass surface and patented screwless design allow for easier and faster cleaning and disinfection procedures- Fully sealed aluminum housing and fan less design for high hygienic standards with IP54 rated ingress protection and antibacterial treatment- PCIe x16 internal expansion slots for storage, networking and processing cards
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® Q170, 2 HDMI, DisplayPort, 4 GbE LAN, 8 USB, 2 PCI Express Mini Card Slots
eBOX670-891-FL
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The eBOX670-891-FL supports the 7th/6th generation Intel® Core™ i7/i5/i3 and Celeron® processors with flexible I/O configurations. This outstanding embedded box PC is equipped with dual DDR4-2133 SO-DIMM slots with system memory up to 32 GB. The eBOX670-891-FL provides high flexibility with reserved I/O module space on the rear side. The embedded system integrator can expand the system quickly and easily by installing suitable I/O modules. The fanless embedded box computer features wireless communication capabilities with two internal PCI Express Mini Card slots and one SIM card slot. Four Gigabit Ethernet ports are for customers who need mass data transmission or LAN port teaming functions for each virtual machine. For storage needs, it is equipped with one easy-access CFast™ socket, one mSATA interface, and dual 2.5” SATA hard drive bays with RAID 0&1 support.
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Product
IC-3172, 1.80 GHz Intel Core i5 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784228-01
Controller
The IC‑3172 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3172 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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3.5” Embedded SBC With 4th/5th Generation Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® HM86 (Intel® QM87 Optional), LVDS/ VGA/Dual HDMI,Dual LANs And Audio
CAPA881
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The CAPA881 3.5-inch embedded board supports the 22nm 4th generation Intel® Core™ i7/i5/i3 processors (codename: Haswell) with Intel® HM86 or Intel® QM87 chipset (optional). The 3.5-inch single board computer comes with a DDR3L SO-DIMM socket up to 8 GB. The highly integrated 3.5-inch embedded board features high performance, graphics, power efficiency, security, and remote management capabilities (Intel® AMT), making it ideal for a broad range of intelligent systems such as embedded applications, gaming, DSA, DVR, IoT/M2M-related, network computing, and many more.
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Product
IP Core and FPGA Products
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Our FPGA offerings include development boards and IP cores for Altera FPGA devices. The IP cores include: I2C, PCIe, JPEG-LS, LVDS Camera Link and memory controllers.
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Product
NXP I.MX8M Plus Quad Core Processor Based IIoT Gateway Platform
MXA-200
IoT Gateway Platform
MXA-200 is an i.MX8M Plus based high-performance IoT gateway, which has an open platform design with Quad Core processor, two RS-232/422/485 isolated serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 port and operating temperature range of -20~70°C. It offers two M.2 slots for integrating Wi-Fi/4G/5G modules. MXA-200 enables system integrators to develop applications precisely for renewable energy, EV charger, smart city and factories which require massive data collection, cloud based application and video related monitoring solutions.
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
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Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
LV Iron Core Harmonic Filters
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Nonlinear loads such as power electronics based equipment and electric furnaces are sources of harmonic currents leading to harmonic distortion, which is one of the most important parameters for defining the power quality. Most of the commercial loads such as personal computers, photocopy machines, power supplies, and compact fluorescent lamps; and industrial loads such as AC and DC motor drives inject harmonic currents into the network that they are connected to.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With Intel® Core™ I7/i5/i3 Processor
OPS875
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*Open Pluggable Specification (OPS) compliance*Socket G2 (rPGA988B) 3rd gen Intel® Core™ i7/i5/i3 processor*Intel® HM76 chipset*DDR3-1600 SO-DIMM, up to 8GB*2 USB 3.0 ports and 1 PCIe Mini Card slot*Pluggable HDD for easy maintenance*Easy to change DRAM*HDMI for 2nd display
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Product
Dielectric Loss Tangent and Transmission Attenuation Measurement System
RTS03
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RTS03 measures relative permittivity (dielectric constant), dielectric loss tangent in the frequency range between 5GHz and 26.5GHz based on a correlation between measurement frequency and transmission attenuation as the microwave passes through the flat plane sample.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
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- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Intel® Core™ Ultra 7/5 Processors AMR Control System
AFE-R760
Computer-on-Module
Intel® Core™ Ultra 7/5 Processors, up to 16 Cores, TDP 28W. Dual Channel DDR5-5600, up to 96GB. Support 4x GMSL through 120pin B2B connector.Dedicate I/Os for AMR: 3x 2.5GbE, 2x USB-C, 2x USB-A, 4x COM, 2x CAN-FD, 8-bit GPIO.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
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- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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4CH GigE Vision Compact Vision System with 6th Generation Intel® Core™ i7/i5/i3 Processors
EOS-1300
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ADLINK’s EOS-1300 is a high performance compact vision system equipped with 6th Generation IntelR Core? i7/i5/i3 processors and four independent PoE (power over Ethernet) ports, delivering data transfer rates up to 4.0 Gb/s. EOS-1300’s FPGA based DI/O provides programmable de-bounce filter, on the fly trigger, and user wiring Sink/Source DO and Encoder functions, making it the ideal solution for machine vision applications requiring high computing power and time deterministic solutions with minimal footprint.
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Product
Metal Cored PCB
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Teledyne Labtech is at the forefront of complex metal-cored PCB design and manufacture. The PCB use a thin metal core <2 mm, which acts as isolation between the RF/Microwave circuit and the Analogue/Digital circuitry and creates an excellent thermal path.The major advantages are reduced size and no need for complex microwave feed-thru's. The ability to laser cut pockets allows the designer engineer to mount the high power MMIC directly on to the metal core.
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Product
Compact Fanless System With 8th/9th Gen Intel® Core™ I CPU Socket (LGA 1151)
MIC-770
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Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipsetWide operating temperature (-10 ~ 50 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.02 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports 2 x LAN, isolation COMs, and 32-bit GPIO modulesSupports Advantech i-ModulesSupports Advantech SUSIAccess and embedded software APIsVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)
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Product
Modular TPC - Computing Box Module With Intel® Core™ Processors (10th Gen)
TPC-B610
Panel PC
High Performance Computing Box powered by Intel® 10th Gen. Core™ i CPU Socket (LGA1200) with fanless design6 x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR4) support up to 64GB in totalComprehensive I/Os, including 6 x USB, 2 x COM, 2 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x mPCIe, 2 x M.2 (NVMe, SATA, 5G)Supports Storage via 2 x 2.5" HDD/SSD (RAID 0/1), 2 x M.2 (2242/2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
