Wafer Mapping
Identify semiconductor performace across a wafer.
See Also: Wafer, Mapping, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Probes, Wafer Probers, Wafer Inspection, Wafer Maps
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Product
Wafer Mapping Sensor
M-DW1
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Panasonic Industrial Devices Sales Company of America
To provide better safety and improved sensing accuracy, Panasonic studied the requirements for future Wafer Mapping Sensors to ultimately develop the LED Beam Reflective Type Wafer Mapping Sensor, M-DW1. This Sensor uses LEDs as a light source for safe operation and a 2-segment receiving element for higher accuracy in wafer detection.
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Product
Automated Discrete Semiconductor Tester (ATE)
5000E
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Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Product
STDF Test Data Analysis Tool
DataView
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DataView is a low‐cost test data analysis tool that is used by test and product engineers to perform characterization of integrated circuit devices. DataView reads in industry standard STDF or ATDF files and can produce reports, histograms, and wafer maps in multiple formats including Excel. DataView is ideal for the test or product engineer who needs a fast and simple tool to analyze characterization data.
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Product
Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
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Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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Product
Multisite Probe Card
T300 ButtonTile™
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The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
DUV-NIR Spectroscopic Reflectometry
FilmTek 2000
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Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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Product
MAPS Core
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An all-in-one core package includes the ADLINK products’ driver, device management utility-ACE and, PXI configuration setting utility
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Pressure Mapping
NIP PRESSURE MEASUREMENT SYSTEM
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A completely wireless system for measuring nip pressure between rollers in real-time
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Product
Headspace MAP Gas Analyzers
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Headspace analysis is conducted to ensure that the residual oxygen in a product complies with predefined limits. This is a vital part of the Quality Control of Modified Atmosphere Packaging (MAP) products. For packaged foods and other goods, exceeding these limits increases the risk of growth and proliferation of bacteria or mould, which causes spoilage and results in shorter product shelf-life.
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Product
On-line MAP Gas Analyzers
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Our online MAP gas analyzers continuously extract and monitor packaging gas from the Modified Atmosphere Packaging line to ensure that the equipment and gas mixing system deliver a desirable protective atmosphere which meets the requirements for prolonged shelf-life products within the food & beverage and pharmaceutical industries.
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Product
Wafer Probe Heads
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WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Product
Pressure Mapping Sensors
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The pressure sensors listed below are available in a wide range of shapes, sizes, pressure ranges, and resolutions. Over 200 different pressure sensors are available. High Temperature pressure mapping sensors are also available in certain sensor models. Custom tactile pressure sensors and pressure ranges can also be created to meet your specific application requirements. Please note, the sensors listed in this catalog are matrix sensors designed to be used with one of Tekscan's pressure mapping systems. If you need single-point force sensors for testing, or custom force sensors for embedded/OEM applications, please refer to our FlexiForce™ products. For more application and industry details, see some of our key sensor application and industry solutions.
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Product
Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Product
Locate and Map Underground Utilities
UtilityScan DF
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Geophysical Survey Systems, Inc.
UtilityScan DF incorporates our innovative dual-frequency digital antenna (300 and 800 MHz) and an easy-to-use touchscreen interface to view shallow and deep targets simultaneously in a single scan.
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Product
PORTABLE PRESSURE MAPPING
I-SCAN® HANDHELD SYSTEM
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Handheld pressure measurement system for collecting tactile pressure data.
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Product
Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
Silicon & Compound Wafers
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Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Product
Concrete Corrosion Mapping System
15620
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Our Concrete Corrosion Mapping System (CCMS) can be used to satisfy the ASTM C-876 standard test method and the kit contains all equipment items that are needed to perform a corrosion survey on virtually all types of reinforced concrete structures, such as bridges, highway slabs and parking garages.
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Product
Thermal Wafer Chuck
HC4000 Series
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American Probe & Technologies, Inc.
A specialized hardware component used in semiconductor testing to hold and heat or cool silicon wafers during analytical probing.
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Product
Film Thickness Mapping Systems
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Angstrom Sun Technologies, Inc.
Spectroscopic reflectometer mapping (SRM) tools are for industry or lab routine thin film uniformity measurement. This is relatively low cost and easy to use setup. Mapping size can be configured from 2" to 18" if needed. Dependent on film thickness range, a broad wavelength range can be configured within DUV, Vis and/or NIR range. A user-friendly software interface allows you to define various mapping patterns to map. A CCD array based detecting and data acquisition mechanism offers fast measurements. 2D/3D data presentation gives user option to quickly generate reports.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Magnetic Field Camera: mapping for MRI applications
MFC2046
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MRI and NMR spectroscopy applications require a highly uniform magnetic field, within at most a few ppm. NMR is the only magnetic measurement technique capable of providing a field map with that degree of precision. Introduced 25 years ago, Metrolab’s NMR Magnetic Field Cameras have revolutionized field mapping for MRI magnets. They reduced acquisition times from hours to minutes, positioning errors to fractions of a millimeter, and they rendered human and drift errors negligible. Now, meet the latest generation NMR Magnetic Field Camera, the MFC2046! Map any magnet with the New generation of MFC probe arrays. Magnetometer Teslameter Gaussmeter
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Product
Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
