SoC
A complete computer "System on a Chip".
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3U VPX 1/10/40 Gigabit Ethernet Switch
ComEth4081e
Powered by a Marvell highly integrated System-on-a-Chip (SoC) with programmable packet processors, and controlled by Switchware, the field-proven Interface Concept network management application, the ComEth4080e offers a high density of 1GbE/10GbE and 40GbE ports on a 3U footprint.
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Computer-On-Module
ETX®
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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Networking Solutions
Bluetooth Solutions
Quickly introduce Bluetooth connectivity into sports and fitness, consumer electronics, beacons and smart home applications with easy-to-use and innovative Bluetooth SoCs, modules and software from Silicon Labs.
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Automotive Infotainment SoCs
ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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Emulation Platform
Veloce
The Veloce® Emulation Platform dramatically reduces risk in the verification of today’s complex SoCs and is a core technology in the Mentor Enterprise Verification Platform™ (EVP). Mentor’s software and application solutions and continual enhancements enable a comprehensive verification environment for IP, chip, and system level verification.
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ATEX & CID2 Anti-Explosion Certified Robust DIN-rail Fanless Embedded System With Intel® Atom® Processor E3827 (1.75 GHz)/E3845 (1.91 GHz)
rBOX510-6COM (ATEX/C1D2)
The rBOX510-6COM(ATEX/C1D2) robust din-rail fanless embedded system is certified with ATEX and C1D2 for use in hazardous environments where ignitable concentrations of flammable gases, vapors or liquids might exist. The embedded system supports the dual-core Intel® Atom™ processor E3827 1.75GHz SoC with the onboard 4GB DDR3L system memory. The din-rail heavy-duty embedded PC adopts an IP30-rated aluminum and steel enclosure, and can perform in wide temperatures ranging from -40°C to +70°C. To prevent ESD and over-voltage, the compact embedded box PC is equipped with four isolated RS-232/422/485 ports, two isolated 10/100/1000Mbps Ethernet ports, and one isolated DIO (8-IN/8-OUT) port. One 2.5" SATA SSD, one mSATA and one CompactFlash™ socket are available for storage. More I/O features include one USB 3.0 port, one USB 2.0 port, two COM ports, and one VGA output. In addition, box PC comes equipped with a wide range 12 - 48VDC power input with a terminal block and has overvoltage and reverse protection. The box PC provides two watchdog timers and RTC battery function. Pre-installed with Linux, Windows® 8 Embedded and Windows® 7 Embedded, the embedded system provides programmers with a friendly environment for developing application software at a lower cost. For secure mounting, the rBOX510-6COM(ATEX/C1D2) can be easily installed on a DIN-rail mount or in an enclosure box.
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3U OpenVPX Module Xilinx Zynq UltraScale
VPX3-ZU1
Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1 is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. The Zynq UltraScale+ integrates a Quad-core ARM Cortex-A53 based Application Processing Unit (APU), a Dual-core ARM Cortex-R5 based Real-Time Processing Unit (RPU), a ARM MALI-400 based Graphic Processing Unit (GPU) and an UltraScale+ Programmable Logic (PL) in a single device. It also includes on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.
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3D-IC Solution
Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Air-Cooled Universal Test Platform
Diamondx
Diamondx semiconductor test system extends Cohu’s low-cost, high-throughput production test solution platforms to high pin count, higher site count wireless, mobility, SOC, Flat Panel Display drivers, Power Management, and microcontrollers. Designed to meet the cost drivers IC companies face, Diamondx extends Cohu’s leadership in lowering the cost of operations.
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Scienlab BMS Environment
SL101XA Series
A BMS assumes important safety, control, and regulation functions. Those functions include monitoring parameters such as voltage, current, temperature, and state of charge (SOC). A BMS also regulates thermal management, energy management, cell balancing, and performance.
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Qseven V2.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio And CAN
Q7M120
*Qseven v2.0 (70 x 70 mm)*Ultra low power consumption Cortex™-A9*2 CAN*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux 3.0.35/Android 4.3*Audio
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Automotive System-on-Chip (SoC)
R-Car
"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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ARINC 429 Bus Interfaces
AIM’s > ARINC 429 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O.
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Computer-On-Module
CM22301
LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
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Emulation Adapters
With some of the more advanced 32-bit microcontrollers and SoCs, the full program and data trace capabilities of the device are not made available on production silicon. Instead, semiconductor vendors provide special 'emulation devices'. These typically feature more pins than the production device, thereby providing the interface to the trace interface.
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Extreme Rugged PC/104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM1-BT1
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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SoC Test Systems
SoC (System on Chip) devices integrate multiple different functions into a single chip. Our SoC test systems can test all the integrated circuits in SoC devices, including logic, analog, RF, DC and imagers by flexible configuration of the cards/modules used in the test system.
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Xilinx Zynq UltraScale+ SoM
TE0808-ZU9
Sundance Multiprocessor Technology Ltd.
The Trenz Electronic TE0808 is an industrial-grade SoC module integrating a Xilinx Zynq UltraScale+, max. 4 GByte DDR4 SDRAM with 32-Bit width, max. 512 MByte Flash memory for configuration and operation, up to 256 MByte HyperFlash, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.
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Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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VS Tool Suite for Virtual Scan Synthesis and ATPG
VirtualScan
VirtualScan is SynTest's solution to combat increase in test data volume and test cycle volume. With VirtualScan (VS) an extremely large number of short scan chains within the SOC can be virtually accessed from outside the chip with a limited number of pins assigned as scan pins.
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PC/104-Plus DMP Vortex86DX3 Single Board Computer w/ Dual Ethernet
PPM-C412
WinSystems’ PPM-C412 single board computer (SBC) is a PC/104-Plus form factor SBC featuring the latest generation DMP® Vortex86DX3® SOC processor. Its small size, low power, rugged design, and extended operational temperature make it a great fit for industrial IoT applications and embedded systems in the industrial control, transportation, Mil/COTS, and energy markets. 1 GHz DMP Vortex86DX3 Processor (Dual core) CPU.
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SMARC
ROM-7421
ROM-7421 Qseven Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be Linux support ready. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
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Thin Mini-ITX Embedded Board with Intel Atom®
AmITX-AL-I
The AmITX-AL-I is a low-profile Thin Mini-ITX embedded board supporting an Intel Atom® processor E3900 series, Intel® Pentium® processor N4200, and Intel® Celeron® processor N3350 system-on-chip (SoC). The AmITX-AL-I is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Cyber Crisis Simulator
When responding to a cyber crisis, the C-Suite no longer works in a silo. Executive management continuously collaborates with incident response and SOC teams to make well-informed decisions. But tabletop exercises and conventional crisis simulation platforms do not prepare for this new reality.
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ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Functional Verification Platform
Riviera-PRO
Riviera-PRO™ addresses verification needs of engineers crafting tomorrow’s cutting-edge FPGA and SoC devices. Riviera-PRO enables the ultimate testbench productivity, reusability, and automation by combining the high-performance simulation engine, advanced debugging capabilities at different levels of abstraction, and support for the latest Language and Verification Library Standards.
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Sealed Panel PC
PPC12-427
WINSYSTEMS’ PPC12-427 is a fanless, 12.1-inch panel PC featuring the latest generation Intel Apollo Lake-I SOC processor. Its small size, low power, extended operational temperature, and IP65 rating make it a great fit for harsh environments in the industrial control, transportation, energy, and industrial IoT markets.
