Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Manual Contactless Wafer Detector
HS-NCS-300
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Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Product
Edge Press Technology Bed of Nails Testers
Protector Edge Press Family
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Designed for testing heavy massive boards. Boards with heavy components like large transformers and inductors can destroy normal test fixtures. This design utilizes a 3 plate system where an internal lever actuated sub plate containing the test pins raises to probe the circuit board when the handle is pulled. Heavy boards can bend and break exposed test pins. Similarly large boards which need to be probed by very small delicate test pins can also benefit from this protected test fixture design. This fixture is recommended in situations where there is a high board mass to pin size ratio and pin protection is required. Front and rear panel modular inserts allow for easy updates and customizations to the user hardware interface.
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Product
Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Edge Press Technology Bed of Nails Testers
Rand Edge Press Family
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Designed for Research & Development and Pre-Production environments to support often reoccurring product design changes. The primary design focus for this fixture is ease in applying engineering changes and resilience to the abuse of applying multiple engineering changes without damage. In R&D and Preproduction, design changes and updates can occur every week. This Rand fixture, unlike normal test fixtures was designed to be easily taken apart and updated. Constantly disassembling modifying and reassembling a normal bed of nails test fixture over and over again can be a major disaster with wire breakage and test pin bending issues. The modular design of the Rand fixture allows for easy disassembly without flexing the wires or risk of bending test pins. The Rand fixture provides complete easy access for multiple updates requiring machining, drilling and wiring changes.
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Product
Edge Gateway
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The Edge Gateway provides a solution to manage distributed wireless sensors. On the one hand, new sensors can be added to the measurement systems easily and on the other hand, the gateway is powerful enough to evaluate the measurements and detect irregularities.
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Product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
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Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
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Product
Edge Connector Fixture
EDGE
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An edge connector fixture can be a low cost alternative to a bed of nails fixture. The most important features of this Edge Connector Tester is its portablility, ease of use, intuitive control functions, and durability in a production environment.
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Product
Wafer Prober
Precio octo
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200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Product
High Resolution Thickness & Surface Profiler for as-sawn Wafers
MX 70x
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The MX 70x series measure Thickness, Warp, Waviness, Roughness and are usable for nanotopography.
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Product
In-Process Wafer Inspection System
7945
System
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
Edge Gateway
EPC-R6410
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EPC-R6410 is the RISC based box computer which integrated NXP i.MX6D/Q Cortex-A9 1.0GHz high performance processor. It is designed for the applications that require high performance and rich I/O but low power consumption. It supports dual display via HDMI and VGA up to 1080p, 1 Gigabit Ethernet, 6 USB 2.0 and 4 serials, as well as mini-PCIE for 4G/3G and M.2 for WiFi/BT. With wall mount brackets, fanless and dust-proof design, you can easy install in rugged environment.
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Product
WDXRF Wafer Analyzer
2830 ZT
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The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
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Product
Compact Edge AI Platform For Various AI And AMR Applications
DLAP-411-Orin
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ADLNK DLAP-411-Orin Edge AI Inference Platform powered by NVIDIA® Jetson AGX Orin™ is a high-performance platform designed for deployment of AI-powered systems at the edge, providing the computing power needed for demanding AI applications.
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Product
Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
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*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Photonics Wafer Probing Test System
58635
Test System
The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
Wafer Level Multi-Die Test System
ITC55WLMD
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The ITC55WLMD series of test systems has been developed by ITC to be stand-alone UIL test systems configured specifically to test on wafer. The systems include an ITC55series UIL tester and inductor box, a current limiter module and a system controller
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Product
Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
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*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Product
Semi-Automatic Contactless Wafer Detector
NCS-200SA
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Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Product
Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
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*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
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Product
Wafer Internal Inspection System
INSPECTRA® IR Series
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An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Product
Azure SQL Edge
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Bring the security and performance of the Microsoft SQL engine to the edge with Azure SQL Edge running on ARM64 and x64 architecture. This productivity tool for edge computing combines new capabilities such as data streaming and time series with in-database machine learning and graph features. Develop your application once and deploy anywhere across the edge, your datacenter, and Azure. Get the Microsoft SQL database engine optimized for the edge for as low as USD60 per device.
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Product
System to Handle Wafer Levels
AMI AW Series
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Operator-Free Wafer Inspection, Analysis and Sorting The AW Series are advanced high-capacity, high throughput automated wafer C-SAM® instruments specialized to deliver maximum sensitivity for the evaluation of wafer and device level applications.
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Product
Edge AI & Intelligence Solutions
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Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers, and IoT gateways to accelerate AIoT development.
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Product
Leading Edge Sensors
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The LaserGauge® Leading Edge Profiling System consists of a handheld or benchtop sensor and the Leading Edge software application. Designed to scan both sides of the blade simultaneously, the sensor returns a complete profile around the radius of the blade, which allows accurate measurements of the thickness and the plotting of the blade profile for comparison to its engineering design.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
NVIDIA® Jetson Xavier™ NX Edge AI Vision Inference System
EOS-JNX Series
System
The EOS-JNX series has a built-in Smart PoE feature to control PoE power remotely to reduce maintenance efforts in challenging environments and provides PoE power loss detection to alert of any unexpected PoE disconnection. The EOS-JNX-I is designed as an AI PoE switch for connecting to IP cameras to enable AI inferencing, and also provides an uplink port to connect to a network video recorder (NVR) for recording video streams, making upgrading existing surveillance systems easy. The EOS-JNX-G is designed for industrial AI machine vision applications, providing a dedicated bandwidth of 1Gb per channel with a GigE camera connection, which is crucial for production line and manufacturing applications.
