ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
-
Product
64-CH 16-Bit 250kS/s Multi-Function DAQ Card
cPCI-9116
Data Acquisition Module
- PICMG 2.0 Rev 2.1- 16-bit A/D and sampling rate up to 250kS/s- 64-CH single-ended or 32-CH differential input- On-board 1k-sample A/D FIFO
-
Product
mSAT SSD for Industrial Embedded Applications
mSATA SSD Series
-
ADLINK’s mSATA SSD Series with the SATA 6Gb/s interface is fully compliant with the standard mSATA form factor, also known as JEDEC MO300. Utilizing Toggle 2.0 MLC flash technology, capacities of up to 1TB are available with support for read/write speeds of up to 550MB/sec and 500MB/sec respectively . Additionally, the power consumption of the ADLINK’s mSATA modules is much lower than that of traditional hard drives.
-
Product
Advanced 8/4-axis Servo & Stepper Motion Controllers with Modular Design
PCIe-8158
Motion Controller
The PCIe-8158 delivers high-frequency pulse rates up to 6.55 MHz and hardware-controlled emergency stop, software security protection, card index switching, and simultaneous linear/ circular run, exceeding industrial cost/performance requirements. Compatible with Mitsubishi, Panasonic and Yaskawa servos and any pulse-train controlled servo and stepper drives, the PCIe-8158 allows complex moving patterns through multiple axes that move with linear and circular interpolations using continuous contouring. Applicable for a variety of linear and circular trajectories, the PCIe-8158 delivers the smoothest motion control for a wide range of manufacturing applications. Modularized configuration accommodates ADLINK extension boards for distributed I/O control and high-speed triggering functions.
-
Product
SOSA-aligned, Rugged 3U VPX Processor Blade with Intel® Xeon® W-11000E
VPX3-TL
Processor Blade
ADLINK VPX3-TL 3U VPX processor blade is powered by Intel® Xeon® W-11000E Series Processor, formerly Tiger Lake-H and delivers a greater than generational improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.
-
Product
3U CompactPCI 8HP 16.6-160VDC Input Railway Power Module
cPS-H325/WDC
Power Module
- PICMG® 2.11 CompactPCI® Power Interface compliant- 16.6 to 160VDC wide input range, 310W- 3U, 8HP CompactPCI package- EN 50155 Class S2 and C2 compliant for power stability- 40°C to 85°C operating temperature with deratin*g
-
Product
Embedded MXM GPU Module with NVIDIA RTX™ A2000
EGX-MXM-A2000
Graphics Card
- NVIDIA Ampere Architecture- Standard MXM 3.1 Type A (82x70mm)- PCIe Gen 4 x8 interface- 2560 CUDA® cores, 20 RT Cores, and 80 Tensor Cores- 8.25 TFLOPS peak FP32 performance
-
Product
2-CH Counter/Frequency Input Module
ND-6080
Data Acquisition Module
- Channels: 2 independent 32-bit counter- Input Frequency: 100 kHz max.- Isolation Voltage: 5000 VRMS- Input Pulse Width: > 10 µs*- Max. Count: 4294967295 (32-bit)
-
Product
Industrial IP69K Stainless Steel Panel PCs With 11th Gen Intel® Core™ Processor
Titan2
Panel PC
- 11th Gen Intel® Core™ i5/i3 BGA type processor- 15.6”/21.5”/23.8” FHD with projected capacitive touchscreen- Full IP69K rating for dust and water ingress- Corrosion-resistant 304 stainless steel enclosure (316 for Option)- All M12 type connectors suite for harsh environments- Optional for optical bonding and high brightness (1000 nits)- Standard VESA, Yoke/Pipe mount (optional)
-
Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
-
Product
32-CH Discrete Input Modules
HSL-DI32-M-N/HSL-DI32-M-P
-
- Slave ID consumption: 2 consecutive from odd- "N" type for NPN sinking type sensor or dry contact; "P" type for PNP sourcing type sensor or wet contact- Photo couple isolation voltage: 2500 Vrms- Input impedance: 4.7 KΩ- Input current: ± 10 mA (Max), ± 12.5 mA (Peak)- Input voltage: ± 40 V (Max)- LED indicator: Power, Link and Input status- Power supply: +10 V to +30 VDC
-
Product
8DI/8DO Modbus RTU Remote I/O
ND-6150
Data Acquisition Module
The NuDAM modules provide direct communications with a wide variety of sensors; perform signal conditioning, scaling, linearization and conversion; can acquire measurements of temperature, pressure, flow, voltage, current; and handle multiple digital signal types broadly used in IoT and other industrial applications, such as facility monitoring, environment monitoring, and industrial process control. The new ND-6117, ND-6124, ND-6150, and ND-6160 modules feature Modbus/RTU as the best remote data transmission protocol, which provides customers a comprehensive product offering.
-
Product
16-CH Discrete Input 16-CH Discrete Output Module
HSL-DI16DO16-M-NN
-
- Input voltage: ±40 V (Max)- Output switching capacity: Single channel 500 mA; all channels 60 mA at 24 VDC- Photo couple isolation voltage: 2500 Vrms- Input impedance: 4.7 KΩ- Input current: ±10 mA (Max) , ±12.5 mA (Peak)- 16-CH digital input and 16-CH digital output. "NN" type for NPN sinking type sensor input or dry contact and NPN sinking type output- Slave ID consumption: 1
-
Product
LEC-Starterkit with LEC-BASE 2.0 Carrier, SD Card and ATX Power Supply (without LEC Module and Cooling Solution), Optional LVDS Display
LEC-Starterkit 2.0
-
The LEC-Starterkit 2.0 consists of a SMARC 2.0 compliant LEC-BASE 2.0 carrier board, data media, an AC/DC adapter, power cords and is suitable for LEC-AL, LEC-BT, LEC-BTS or LEC-BW modules.
-
Product
4-Port RS-422/485 Isolated Serial Communications Card
cPCI-3544
Communications Module
- 32-bit CompactPCI®, PICMG® 2.0 Rev 2.1- Plug-and-play, IRQ & I/O address automatically assigned by PCI BIOS- Four asynchronous communications ports with intelligent buffer- Four RS-422/485 ports- 2500 VRMS isolation voltage
-
Product
2U 2 GPUs AI GPU Server
AXE-7220SR
MEC Server
- Advanced Computing Power: Featured 4th Gen Intel® Xeon® Scalable Processor to provide edge AI power computing power- High flexibility of PCIe configurations: Up to 5x PCIe x8 or 2x PCIe x16- 5G ready: Support 5G SIM card- Short-depth chassis design: Compact size 45cm only- Applications: Manufacturing-AI AOI, Telecom-AI RAN,Healthcare-CT/MRI/X-Ray image re-con, analysis, Broadcasting-- Digital transcoding






















