ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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Product
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
Industrial Computer
- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
1 PICMG® CPU, 1 PCI-E® x16, 4 PCI-E® x1, 3 PCI™ Slots Backplane
EBP-9E5
Backplane
- Segment: 1- Slots: 1 PICMG® CPU, 1 PCI-E® x16, 4 PCI-E® x1, 3 PCI™- Support ATX power supplies- Dimension: 244 mm x 348 mm
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Product
18-Slot 3U PXI Express Chassis with AC - Up to 8 GB/s
PXES-2780
Chassis
The ADLINK PXES-2780 is an 18-slot PXI Express chassis, compliant with PXI Express and cPCI Express specifications and offering one system slot, one system timing slot, ten hybrid peripheral slots, and six PXI Express peripheral slots for a wide variety of testing and measurement applications requiring enhanced bandwidth. The PXES-2780 provides a configurable PCIe switch fabric and is configurable in two-link, and four-link PXI express deployments, with 8 GB/s system bandwidth and up to 4 GB/s slot bandwidth for dedicated peripheral slots, thanks to PCIe gen2 signaling technology.
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
Processor Blade
- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Product
Industrial Mini-ITX Motherboard With Intel® N97 Processor
AmITX-ALN
Motherboard
- Intel Alder Lake N SoC processors, N97- Single channel DDR4 3200 MHz memory up to 32 GB- Triple independent display: HDMI 2.0b, DP 1.4a (from Type C), VGA, LVDS or eDP- Dual GbE ports: 2x 2.5GbE- Expansion slots: 1x PCIe Gen3 x1, 1x USB 3.2 Gen2 Type C, 4x USB 3.2 Gen1, 6x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 1x M.2 M-key- 12 to 28V DC-in
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Product
15-CH Isolated Digital Input Module
ND-6054
Data Acquisition Module
- Channels: 15- Isolation Voltage: 5000 VRMS- Switching Level: with 24 V common power. Low (0): 22 V min.; High (1): 0-22 V- Programmable input polarity
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
96-CH 12-Bit 3 MS/s Ultra High Density Analog Input PXI Module
PXI-2208
Analog Input Module
ADLINIK PXI-2208 is an ultra high-density, highperformance analog input module. This device can sample up to 96 AI channels with various gain settings and scan sequences, making it ideal for dealing with ultra high-density analog signals with various input ranges and sampling speeds. These devices also offer a differential mode for 48 AI channels to achieve maximum noise elimination. The PXI-2208 also features analog and digital triggering and 24-CH programmable digital I/O lines. Like all the other members in the PXI-2000 family, the PXI-2208 is able to perform analog input at full speed. Multiple modules can also be synchronized through the PXI trigger bus. The auto-calibration feature adjusts the gain and offset to a specified accuracy, eliminating the need to calibrate the modules by adjusting trimpots.
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Product
1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 10 PCI™ Slots Backplane
EBP-13E2
Backplane
- Segment: 1- Slots: 1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 10 *PCI™- Support ATX power supplies- Dimension: 330 mm x 318 mm
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Product
High-Performance Gaming Platform with Backplane Architecture
ADi-SC2X
Gaming Platform
- High performance, high-end gaming platform with backplane architecture for easy maintenance- Superior, highly scalable CPU/GPU performance- Advanced security feature set and software solutions- Highly flexible system configurations that are fully in line with real project requirements- Lower costs: due to implementation of socket-type Intel® CPUs- Flexible maintenance and upgrade: slot-in machine construction, socket-type CPU support- Flexible maintenance and upgrade: slot-in machine construction, socket-type CPU support- Full-scale customization: GDDR5, V-BIOS, video ports, I/O ports, etc.- High integration: FPGA & logging controller onboard
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Product
Quiet Safety Wallmount Industrial Chassis Supports ATX Industrial Motherboard
RK-609MB
Chassis
- Supports Mini-ITX, microATX, ATX industrial motherboards- One 5.25”, two 3.5” external drive bays and one internal 3.5" or 2.5" drive bay- Two USB type A connectors on front panel- Low noise 12cm PWM controlled (Full Loading 45db)- PS2 ATX power supply
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Product
COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
Computer on Module
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Product
Edge AI Platforms
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ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.






















