Teledyne Defense Electronics
From advanced RF/Microwave systems to Hi-Voltage Interconnects & Components to comprehensive Space-qualified offerings and aerospace materials, our portfolio is sought after by technology leaders large and small worldwide. Leveraging the capabilities and the unique breadth of our many leading Teledyne Defense Electronics brands, we engineer solutions to meet your most complex specifications.
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United States of America
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Channelized Up/Down Converters
Teledyne Defence & Space (TDS) Flexible Channeliser has flexible channel frequenct allocation and integrated channel filtering. The Flexible Channeliser has been selected for supply to OneWeb for its satellite payload system designed to provide low earth orbit broadband internet access worldwide.TDS has uniquely proven experience in building solutions for RF & Microwave components, Sub-Systems & Payload integration working transparently to provide a complete payload for both high volume and bespoke mission designed products.
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BAW Devices
Teledyne RF & Microwave has been producing Bulk Acoustic Wave (BAW) delay devices since the early 1960’s. Over the years,Teledyne has constantly improved BAW technology and is currently the world’s only supplier of microwave bulk acoustic wave delay devices. Markets for BAW devices include instrumentation and radar altimeters and are available in connectorized, pin and surface mount configurations.BAW devices operate as low as 300 MHz and as high as 17 GHz, usually in sub-bands of around 10%. Depending on the delay and frequency of operation the insertion loss is in the range 30 dB to 90 dB.
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Oscillators - Voltage Controlled
Teledyne RF & Microwave offers Voltage Controlled Oscillators (VCOs) utilizing bipolar transistors & silicon varactors over the frequency range of 40 MHz to 18GHz. Many of the VCO designs incorporate internal filtering, regulation & amplifiers to meet total system requirements in a small integrated package. Additionally, our hermetic hybrid designs can be screened to the most demanding military and space applications.
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Product Support Equipment
The TTU/515E or O/I Level Test Set was developed to provide a full end-to-end test of the NACES and FAST electronic sequencers used on the NACES ejection seat. The O/ITS provides simulated inputs and measures the timing of initiator firing sequencer outputs. The O/ITS, via a serial channel in the test connector, performs discrete element diagnostics on all the sequencer's redundant electronics and verifies its full functionality.
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Relays & Coax Switches
Teledyne Relays offers high-performance relays designed to survive the rugged conditions required for oil & gas exploration, industrial control, and military & space applications. Teledyne Coax provides RF & Microwave switching solutions for SATCOM, military & space applications, test & measurement equipment, and ATE systems.
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RF Switch Matrices
For applications involving the test and measurement of multiple RF components, Teledyne Coax offers Custom Switch Matrix solutions to integrate multiple switches, along with additional components including filters, mixers, and attenuators, as required. These Custom Switch Matrix units can contain SPDT, Transfer, or Multi-Throw Switches in either Multiple Input Multiple Output (MIMO) or Multiplexer (MUX) configurations.
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Systems Integration for Circuit Card Assembly
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Semiconductor Lifecycle Management
Defense and space applications no longer drive the semiconductor industry. There is such a mismatch between the market life of a modern semiconductor, which can be measured in months to a couple of years, and the platform needs of defense and space platforms, measured in decades.Semiconductor Lifecycle Management (SLiM™) from Teledyne e2v HiRel Electronics solves this headache. We have many years of experience partnering with customers to save cost and lower risk when dealing with platform extensions.
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PHOBOS R-ESM System
Gain military advantage with the world's most compact and accessible R-ESM system. Phobos delivers increased real-time intelligence in the most complex operational environments.
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Frequency Doublers
Teledyne RF & Microwave offers several Frequency Doublers providing high fundamental suppression, broadband input/output frequencies, and low conversion loss figures for a variety of communications applications.
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Microelectronic Packaging
The key to any contract manufacturing project is the development, validation, and implementation of manufacturing processes that will guarantee the quality and reliability of your final product. Teledyne Advanced Electronic Solutions has over 50 years of experience in manufacturing leading edge microelectronic hybrids and modules and has implemented and perfected its core processes to ensure the success of your program.
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Manufacturing Services - Program Management
The Teledyne Advanced Electronic Solutions Program Manager is the primary customer interface; your voice inside our facility. From the receipt of RFQ to proposal, purchase order to materials procurement, kitting to fulfillment, through testing and shipment, a Teledyne EMS Program Manager manages each step in your product's life cycle. Teledyne EMS Program Manager leads an IPT (Integrated Program Team) to ensure thorough attention to your specific requirements, change order management, resolution of issues and compliance.
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Microelectronics - Integrated Solutions
Teledyne e2v HiRel provides microelectronics packaging and products with a full range of packaging solutions from COTS to MIL-PRF-38534 compliant (Class H & K) qualifications. HiRel provides a one stop solution for your microelectronic assembly, evaluation, test and screening requirements. Our MCM packaging technology enable our customers to meet size, weight, power and cost (SWaPC) requirements without a sacrifice in performance. Our numerous certifications including AS9100, ISO 9001, and MIL-PRF-38534 Class H accreditation, all of which are integral factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customers' stringent requirements. We are a DOD Trusted Source for Microelectronics Packaging, Assembly, and Test.
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Yitrium-Iron-Garnet (YIG) Products
The Teledyne RF & Microwave's line of Yttrium-Iron-Garnet (YIG) products includes Oscillators, Filters, Synthesizers and more available as standalone products or incorporated into higher level assemblies.
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RF/Microwave Assembly Capability
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.