Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
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Air Micrometers
As the pioneer of air micrometers and electric micrometers in Japan, we respond to a variety of needs for high precision production line measurements.
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CMP
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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Optical Shaft Measuring System
The measurements and shape of the shaft or rotating partsare measured in an overwhelmingly short time. In our lineup, we can handle inspection and automation during production processes, so we can contribute to increased productivity at your company.
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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X-ray CT System
The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
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Coordinate Measuring Machines
Tokyo Seimitsu is the pioneer that developed “Japan’s first coordinate measuring machine.” We respond to every need with a varied lineup to which we have added Carl Zeiss products linked to our products.
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Precision ACCRETECH Dicing Tools
Precision ACCRETECH Dicing Tools for precision cutting are derived from our unique development technology as well as our diverse application technology. We offer products that can cut a variety of materials, cover diverse cutting applications and satisfy today's requirement of "high quality & low cost".
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Dedicated Measuring Machine
We offer measurement systems optimized for various production sites. We design and manufacture high precision, stable specialized measuring instruments to match requested specifications and requested performance.
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Dicing Machines
Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process.
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Surface Texture And Contour Measuring Instruments/Systems
We provide high performance, easy-to-use systems from highly efficient hybrid types that can measure the surface roughness and the contour in one trace, to portable types that can be used even on the production site.
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Laser Interferometers
Measurements of the length displacement or yawing and pitching, measurements of rotation angles, measurements of overshoots during vibrations or when stopped and of uneven speed, etc. can be handled. Length measuring instruments can be used for a variety of purposes, including precise inspection of heavy duty equipment.
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*CNC Surface Texture Measuring Instrument
Surfcom C5
SURFCOM C5 allows customization of the workpiece feed unit and jig production to suit particular needs.Basic specifications are Type-C (mainly for cylinder heads, cylinder blocks, and other workpieces wherea 5-direction approach is required) and Type-S (for camshafts and other shaft workpieces that require arotary axis).
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Auxiliary Equipment For Probing Machines
We have a lineup of products that support the probing process.
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Polish Grinders
The polish grinder is a single machine that can both slice various device wafers and remove damage,which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu. In recent years, the grinder also contributes to various grinding and polishing processes required for advanced packaging technologies such as laminated memory and FO/2.5D/3D.
