Scientific Computing International
SCI is a leading innovator and provider of advanced metrology systems and analysis software to major companies in the semiconductor, optoelectronics, data storage, display, MEMS, and optical coating industries.
- (760) 634-3822
- info@sci-soft.com
- 6355 Corte Del Abeto
Suite C-105
Carlsbad,, CA 92011
United States of America
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Thin Film Design Software
Scientific Computing International
SCI offers software tools for optical thin film design, material analysis, ellipsometry, and spectrophotometry. SCI’s current standalone optical thin film software includes:
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Photonics & Telecom
Scientific Computing International
photonic integrated circuit manufacturing delivers unmatched measurement accuracy.
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Micro-spot DUV Reflection and Transmission Spectrophotometry
FilmTek 3000 PAR
Scientific Computing International
Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.
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LED
Scientific Computing International
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it.
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Flat Panel Display
Scientific Computing International
Is an electronic display used to display visual content such as text or images.
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Solar Photovoltaic
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film.
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Benchtop Metrology Solution
FilmTek 2000 PAR-SE
Scientific Computing International
Our most advanced benchtop metrology solution, engineered to meet the needs of nearly any advanced thin film measurement application, from R&D to production. Combines spectroscopic ellipsometry and DUV multi-angle polarized reflectometry with a wide spectral range to deliver the highest accuracy, precision, and versatility in the industry. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Reflection/Transmission Spectrophotometry
FilmTek 3000 PAR-SE
Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Advanced Packaging & TSV
Scientific Computing International
System providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements.
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DUV-NIR Spectroscopic Reflectometry
FilmTek 2000
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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Advanced Packaging & TSV
FilmTek 2000M TSV
Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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Multiple Angle Reflectometry
FilmTek 4000
Scientific Computing International
Fully-automated wafer metrology optimized for photonic integrated circuit manufacturing. Delivers unmatched measurement accuracy, with a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems. Designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
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Compound Semiconductor
Scientific Computing International
Semiconductors that are made from two or more elements.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Data Storage
Scientific Computing International
Refers to magnetic, optical or mechanical media that records and preserves digital information for ongoing or future operations.
