Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
-
Product
SOIC and SOJ-to-DIP Adaptor
Series 35000X
-
SOIC & SOJ to DIP Adapters. A cost effective means of upgrading to SOJ or SOIC...without changing your PCB layout.
-
Product
Fusion Bonded Cable Jumpers
Series 152FB
-
Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
-
Product
Yellow Streak Jumpers on 0.100 [2.54] Centers
Series 154
-
Yellow Streak Jumpers on .100 [2.54] Centers. A low-cost jumper available with (Series 154YP) or without (Series 154YS) pitch bars.
-
Product
DIP Jumpers
Series 100 thru 111
-
DIP Jumpers. Aries offers a wide array of DIP jumper configurations and wiring possibilities for all your programming needs. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
-
Product
n-Line Jumpers on 0.100 [2.54] Centers
Series 152, 156 & 157
-
In-Line Jumpers on .100 [2.54] Centers. End connectors have Gold plated, solid Brass pins on .100 [2.54] centers. Available single-ended (Series 156), double-ended (Series 157), or bare-ended (Series 152). Reliable, electronically tested solder connections.
-
Product
SOIC-to-SOWIC Adaptor
XX-666000-00
-
SOIC to SOWIC Adapter. Allows the use of a narrow package IC in place of a wide one.
-
Product
Elevator Socket with Bifurcated Contacts
Series 8XXX
-
Elevator Sockets with Bifurcated Contacts. Ideal for elevating devices (displays, switches, etc.) to desired level with .260 to 1.250 [6.60 to 31.75] height extension.
-
Product
Lo-PRO®file Collet Socket with Wire Wrap Pins
Series 503
-
LO-PRO file Collet Sockets with Wire Wrap Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12011 for solder tail pins. Choose from several sizes and plating options.
-
Product
Open-Frame Collet Socket with Wire Wrap Pins
Series 508
-
Open Frame Collet Sockets with Wire Wrap Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. 2 and 3 level wire wrap pins available. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
-
Product
160-Position QFP-to-PGA Adapter
96-160M65
-
QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
-
Product
SSOP-to-DIP Adaptor
Series 651000
-
SSOP IC to DIP Adapter. Allows the use of .65mm pitch surface mount ICs in thru-hole designs. Ideal for prototyping and testing/evaluating SSOP ICs. Adapter can be cut to smaller sizes by end user. Consult factory for panelized form or for mounting of consigned ICs.
-
Product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
-
Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
-
Product
DIP Adaptor
-
48Pin .5mm QFP to 48Pin .6 Dip Adapter. Makes 48 pin QFP prototype circuits with a standard bread board easy.
-
Product
QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adaptor
96-208M50
-
QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
-
Product
DIP Header with Coined Contacts
Series 600
-
DIP Headers with Coined Contacts. Aries offers a full line of DIP headers, available with either coined or screw machine contacts. Consult Data Sheet No. 12035 for screw machine contacts. Snap-on, protective covers are available for all sizes shown below and accommodate .125 [3.18] to .750 [9.05] component heights. Consult Data Sheet No. 12033 for protective covers.
