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3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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3D Inline Solder Paste Inspection System
TROI 7700 SERIES
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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High-speed 3D Solder Inspection Machine
YSi-SP
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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3D Inspection Service
The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Solder Paste Wetting Tester
SP-2
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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3D Bead Inspection
Increasing demands for product quality and, as a result, high-quality adhesive bonds are becoming ever more important in the automotive industry. With RTVision.3d from QUISS, it is now possible not only to measure the width, position, and continuity of the bead application but also its height. This provides insights into the applied material volume.
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Simple 3D Measurement & Inspection
XG-X Series Vision System
Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
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3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Advanced 3D Automatic X-Ray Inspection
V810 S2EX
V810 is "3D Automatic X-ray inspection System" that corresponds to the double side mounting SMT-PCB that is not able to be checked by a transmission-type X-ray machine. It has the ability to detect a wide range of defects, and It have 100% complete defect detection capability in the Hip-defective.And, it is the inspection machine of world's highest level that combines the ability of the ultra-fast test speed and the lowest false call positives further.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Selective Wave Soldering Optical Inspection Machine
Landrex Technologies Co., Ltd.
Selective Wave Soldering Optical Inspection Machine
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3D AOI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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SparkFun Solder-able Breadboard
Mini
This is the Mini SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our mini modular breadboards with the same connections to pins. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
