SPI
assures volume and area of paste application.
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Product
3D SPI
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Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Product
3D SPI Series
MS-11e
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- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
TTL/I2C/SPI Expansion Kit
OP-SB85L
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OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
3D Solder Paste Inspection (SPI)
TR7007 SII
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Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Product
Process Improvement Software for SPI & AOI
SIGMA Link
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SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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Product
Beagle I2C/SPI Protocol Analyzer
TP320121
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The versatile Beagle™ I2C/SPI Protocol Analyzer is the ideal tool for the embedded engineer who is developing an I2C, SPI, or MDIO based product. The Beagle analyzer provides a high performance bus monitoring solution in a small, portable package. Perfect for engineers in the field and in the lab.
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Product
Low Speed Protocol Decode/Trigger Software (I2C, SPI, RS232, I2S, JTAG)
D9010LSSP
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This bundle includes powerful decoding and triggering for the following serial bus standards: I²C, SPI, Quad SPI, eSPI (including Quad eSPI), RS232/UART, Manchester, I²S, SVID, and JTAG (IEEE 1149.1). It is compatible with S-Series, V-Series, Z-Series, EXR-Series, MXR-Series, UXR-Series, 9000 Series, and 90000 Series Infiniium oscilloscopes. For detailed information on the decode and trigger settings, please refer to the datasheet.
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Product
I²C/SPI Interface Device
Interface
The I²C/SPI Interface Device is a master or slave interface for inter-integrated circuit (I²C), or master interface for serial parallel interface (SPI) devices. With plug-and-play USB connectivity, the I²C/SPI Interface Device is a portable solution to communicate with consumer electronics and integrated circuits. The I²C/SPI Interface Device can be physically located more closely to I²C/SPI devices than PCI interfaces, reducing I²C bus length and minimizing noise problems. The I²C/SPI Interface Device supports I²C rates up to 250 kHz and SPI rates up to 50 MHz, and it also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I²C devices or toggling LEDs.
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Product
USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
CyberOptics SE Series
SE Series
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The CyberOptics SE Series offers the most accurate and repeatable, high speed 3D solder paste inspection in the market today. Utilizing the most advanced sensing technology, CyberOptics SPI products will provide manufacturers the reliability needed to compliment your overall screen print process improvement strategy.
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Product
4 Channel ADC FMC Module
ADCFN04 – HPC
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Sundance Multiprocessor Technology Ltd.
The RFM-ADCFN04 is a four channel Analog to Digital converter FMC which complies with VITA 57.1-2010. Each channel provides DC coupled single-end analog input and digital output with DC-250KHz sampling speed based on Linear Technology’s LTC2376-16. The output is 16-bit data and it can be obtained through SPI interface on LTC2376-16 from the FPGA on the FMC carrier board. One trigger input is provided for capture control.
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Product
Semiconductors
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Meets SDIO card v2.0 specificationSupports SDIO SPI, 1-bit, and 4-bit SD modesHost clock rate from 0-50 MHzSingle SDIO function interfaceSD commands processed in hardwareReset output on completion of initializationIndication of high speed and high power enabling to application logicMaximum block size supported is 1024 bytesThree I/O mode selection pinsCRC7 and CRC16 modulesSupports direct R/W (IO52) and extended R/W (IO53) commandsAPB bus interfaceParallel bus interfaceStandard 8051 split bus interfaceGeneric 8051 bus interfaceUART interface
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Product
USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-50
Interface Module
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Product
High-Speed Multi-IO SPI Host Adapter
BusPro-S™
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The BusPro-S High-Speed Multi-IO SPI Host is designed with speed, versatility, and value in mind. Featuring a 60 MHz clock rate with up to 200 Mb/s throughput and support for standard, dual, quad, and 3-wire modes, the BusPro-S is the right tool for all SPI debugging applications-present and beyond.
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Product
MAX31855 J-Type Thermocouple Arduino Shield
SEN-30004-J03
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Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino. The MAX31855J supports a measured temperature range of -210C-1200C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Product
LCD Controllers
CP240x
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The CP240x extremely low power LCD controller devices can drive up to 128 LCD segments. These devices are easily interfaced with any microcontroller using SPI or I2C interfaces. A benefit to this approach is designers can select the best-fit MCU for the system and then add the CP240x to handle LCD requirements efficiently with respect to system size and power consumption.
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Product
ARM LPC2294 Based Board
MS 2500
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- JTAG interface- Boot Flash interface- External Flash interface for data storage- External Bus interface- SPI Interface- I2C interface- Serial port interface- CAN Interface- LPC2694 based processor board- MIL1553B Bus Interface (Dual Redundancy)
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Product
Low Phase Noise Frequency Synthesizer
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Corech’s low phase noise frequency synthesizer series generates precise and stable frequency signals across a wide frequency range, available in SPI serial interface. These cost competitive, rugged and compact module are the ideal choice for RF & Microwave systems such as communication systems, test and measurement equipment, radar systems etc.
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Product
Arduino CAN Shield
IFB-10003-IWP
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CAN (Controller Area Network) communication has become ubiquitous in industry. It is used in automotive applications (part of OBD and many other datalinks), on-highway trucks (J1939), industrial machinery and instrumentation, and equipment applications (factory automation). This shield is designed to provide a CAN 2.0 front-end interface for 5V Arduino modules (Uno, Mega, etc). The module uses SPI to communicate to the Arduino, and requires an aditional chip select pin. An optional interrupt line to the MCP2515 and two LEDS are also provided. The chip select and interupt lines are selected via zero ohm resistors and have several configuration options for flexibility stacking additional shields. A set of stackable headers is included with this board, not installed. An optional on-board voltage regulator may be used to supply 7.5V to the Arduino's 'Vin' pin (which is regulated to 5V by the Arduino's on-board LDO). The CAN shield regulator supports a wide input range of 9V to 32V. This makes it possible to cleanly build a stand-alone CAN node (remote sensor) without the need for a separate Arduino power supply!
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Product
MAX31855 J-Type Thermocouple Sensor Breakout
SEN-30003-J
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Breakout board for the MAX31855J digital thermocouple interface ICs by Maxim. Measured temperature range is -210C-1200C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 2x5 pin header (8-pins used), has four vertical mini thermocouple connectors and four mounting holes for standoffs and 4-40 screws. The SEN-30003 is interfaced via 3 or 4-wire SPI with a data-ready output for specific operating modes. An LDO and a high-speed level shifter are included to allow interfacing with microcontroller devices between 3.0V and 5V (all Arduinos, Raspberry PI, etc) without sacrificing device performance (many other level shifters reduce data rates to below 500 kHz).
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Product
Multibus Ethernet Card
MS 1750
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- Processor: LPC3250 processor with ARM 9 core running at 266 MHz- SDRAM Memory: DDR2 256 MB (scalable to 512 MB)- Flash Memory: NAND flash 512 MB- Display & Graphics: Programmable color LCD controller supports up to a TFT interface- Touch screen: Integrated touch screen controller- Network Support: 10/100 Base-T Ethernet PHY- PC Interface: One USB 2.0 high-speed On-the-Go interface- Multibus Interface- Serial Interfaces: Up to four external UARTs- CAN 2.0B controller- Three I2C ports- Three SPI ports- GPIO: Programmable I/O depending on peripheral requirements
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Product
SparkFun TFT LCD Breakout
1.8" (128x160)
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The SparkFun TFT LCD Breakout is a versatile, colorful, and easy way to experiment with graphics or create a user interface for your project. With a 4-wire SPI interface and microSD card holder, you can use this breakout to easily add visual display/interface capabilities to a project as well as providing all the storage you might need for multimedia files.
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Product
MAX31855 T-Type Thermocouple Arduino Shield
SEN-30004-T03
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Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino.Each order comes with one board and a set of four female, long extension, headers that can be soldered to the board. If stacking two of these modules on top of each other, please order both a Ch 0-3 and a Ch 4-7 board, as well as an additional set of headers for stacking. We're working on sourcing even longer headers, but the ones currently available are not long enough to stack as-is (they need to be double-stacked).The MAX31855T supports a measured temperature range of -270C-400C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or MegaNote: we also offer a universal version of this board in a smaller for factor, the SEN-30003-T.FeaturesType-specific, miniature-sized vertical thermocouple connectors (vertical flat blades, see pics)Measures four (4) thermocouple channels, full extended range.Boards are stackable. Up to 8 thermocouple channels may be connected to an Arduino.14-bit SPI interfacePlugs directly into an Arduino Uno or Mega form factor with built-in voltage level translation on-board.Standard Arduino female headers required for easy configuration, one set included with order (1-6x1, 2-8x1, 1-10x1 0.1" female stackable headers), not soldered on.Detects shorts to GND or VccDetects open thermocoupleOther versions available (K, J, and T stocked). Contact Customer Service to place a custom order.Mounting holes for 4-40 sized screwsConnections are spaced for 0.1" pin headerDesigned, manufactured, tested and shipped from the USA The MAX31855T supports a measured temperature range of -270C-400C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Product
Linux-based Development Platform For The GridARM™ ΜController
PEAK gridARM Evaluation Board
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The ARM7 microcontroller gridARM™ was developed by Grid Connect® as a system on a chip solution (SoC) for the implementation of embedded applications with a focus on industrial communication. The Evaluation Board PEAK-gridARM is a Linux-based development platform for the gridARM™ microcontroller. It has connections for Gigabit Ethernet, high-speed CAN, USB 2.0, RS-232, SPI and I²C. The digital and analog inputs of the evaluation board can be manipulated with buttons and potentiometers. The states of the microcontroller, the supply and the message traffic are displayed via LEDs. A board support package for Linux enables access to the hardware resources of the PEAK-gridARM evaluation board.
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Product
MAX31855 J-Type Thermocouple Arduino Shield
SEN-30004-J47
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Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino. The MAX31855J supports a measured temperature range of -210C-1200C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Product
SOM Module
TEO820-ZU3EG
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784EZU3EG (optional ZU5EV) 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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Product
Miniature Spectrometer
Ocean HDX
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Ocean HDX is anchored by High Definition Optics for high throughput, low stray light and great thermal stability. Its X-Platform Electronics include powerful onboard processing and communications including Gigabit Ethernet, SPI and Wi-Fi. The Ocean HDX is compact, robust and ideal for integrated, industrial and research applications.
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Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
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Saki's 3D SPI identifies critical defects and assists with process improvement.
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Product
Solder Paste Inspection System
LaserVision SP3D Mini
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The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
