3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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9-Pin D-Type Male, Solder Bucket, HV
92-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - Without Backshell
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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End Face Inspection Microscopes
D SCOPE EFI – D SCOPE EFI-C – D SCOPE EFI-C LWD
The new D Scope EFI for MTP/MPO and multifibers field connectors is a cost effective microscope for inspecting fiber optic patchcords and cassettes.
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3D vision
SICK's 3D vision series offers a wide range of powerful and flexible products designed for reliable operation in harsh industrial environments. They range from versatile high-speed cameras that deliver high quality 3D and contrast images to smart and configurable stand-alone sensors that facilitate rapid development and easy integration. Their scalability ensures a perfect fit with your 3D vision application.
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9-Pin D-Type Male, Solder Bucket, HV
40-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - With Backshell
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Wide Range Film Inspection
790
For a wide range of coatings the easy-carry and easy to handle SPY Model 790 speeds inspection time with its built in Jeep meter and various other time saving and comfort features
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X-Ray Inspection System
TruView™ Fusion
The quality of your products is paramount to the success of your business. The TruView™ Fusion X-ray Inspection System allows you to "see inside" your products without destroying them, enabling unprecedented understanding of your manufacturing process. The TruView™ Fusion X-ray is the right solution if you are looking for a radiography system to inspect medical devices, printed circuit boards, electronic components, and mechanical parts.
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Building Inspection System with Moisture Hygrometer & MSX® IR Camera
FLIR MR277
The MR277 is the first FLIR building inspection system to combine the advantages of Infrared Guided Measurement (IGM) and our patented Multi-Spectral Dynamic Imaging (MSX) with advanced environmental sensors to help you quickly locate, clearly identify, and easily document problems. IGM technology and a laser pointer isolate the area where you can use the integrated pinless moisture sensor for non-invasive readings or external pin probe for invasive measurements. With automatically calculated environmental readings and a field-replaceable humidity/temperature sensor, the MR277 lets you finish the job and minimize downtime. Connect to external devices with METERLiNK® and use FLIR Tools® to enhance troubleshooting and reports.
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Cutting-edge 3D GPR array solution for efficient subsurface imaging cart solutions
Raptor
The Raptor system covers a wide range of applications and can be configurated with 450 MHz or 800 MHz antennas. Raptor 3D Arrays are based on Real-Time sampling (RTS) technology and the unique antenna design is a milestone in the evolution of the GPR. A Raptor Antenna can be arranged in different ways, which allows for both standard and more advanced GPR measurements. These include common mid-point (CMP), wide-angle reflection and refraction (WARR) and Tomography.
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3D RF Noise Measurment System
EMI-360
3D RF Noise Measurement System EMI-360 to realize the new EMC measurement.EMC measurement is possible to realize a low-cost and time reduction.
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3D inversion geophysical software for Resistivity and Induced Polarization Data
RES3DINV
This program is designed to invert data collected with a rectangular grid of electrodes. The arrays supported include the pole-pole, pole-dipole, inline dipole-dipole, equatorial dipole-dipole and Wenner-Schlumberger. The RES3DINV program uses the smoothness-constrained least-squares inversion technique to produce a 3D model of the subsurface from the apparent resistivity data alone.
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3D LaservScanners
With unsurpassed accuracy and scan quality API’s Hemispherical Scanner is ideal for use Building Information Modeling (BIM), historical preservation and forensics.
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Optical Inspection
Typically, in a standard PCB manufacturing facility, there will be a department where people perform inspection of PCBs through a manual processes, such as visual inspection with magnifiers, microscopes, etc...
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Leadframe Inspection Machine
IV-L200
The IV-L200 is a leadframe inspection machine ideal for measuring leadframe dimension and pitch. Aside from identifying leadframe warpage, it is also used to detect bent or skewed leads as well as surface defects such as scratch, ink, and contamination, among others.
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68-Pin Micro-D Male Solder Bucket
40-962A-068-SB-M
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Micro Coax, Two Piece Contact, Receiver, PCB Vertical Mount, Solder
610140109
For vertical PCB terminations. Used with standard 50 and 120 Pin Micro Coax Modules.Up to 10GHz transmission speeds (PCB design dependent). Two-piece contact that allows for pin replacement, field repairable. Mates to all existing Micro Coax contacts.
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3D Guidance®
The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.
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Wafer Inspection Machine
IV-W2000
The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Academic Suite of 3D Measurement Solutions
Creaform ACADEMIA™
Provides a complete and collaborative skill-nurturing academic solution. The suite let’s you choose from our full line of 3D scanners and portable CMM, free application software, complimentary add-ons as well as useful tools tailored to get you started with industrial 3D measurement solutions.
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25-Pin D-Type Male Solder Bucket
92-960-025-M
This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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Backplane Profiling & Inspection System
603d
A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.
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Installation of Visual Inspection of the Inner Surface of Hollow Cylindrical Parts
Create an installation that allows visual inspection of the inner surface of hollow cylindrical parts with the ability to display the resulting image on a personal computer monitor with its subsequent saving in the JPEG format.
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3D Machine Vision Systems
Whether performing a single profile measurement or scanning an entire surface in 3D, Cognex has the most powerful and robust 3D machine vision tools. Manufacturers in all industries trust Cognex technology to deliver high accuracy surface feature measurements that go beyond the capabilities of 2D machine vision technology.
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Post Wire and Die Bond Inspection Machine
IV-T3300
IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Fiber Inspection & Cleaning
ShinewayTech Fiber Inspection & Cleaning - Optical Connector Inspector, Wireless FIber Inspection Probe, Cleaning Pen, & more.
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Printing Quality Inspection Machine
TQM AVI
Landrex Technologies Co., Ltd.
Printing Quality Inspection Machine





























