3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D vision
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SICK's 3D vision series offers a wide range of powerful and flexible products designed for reliable operation in harsh industrial environments. They range from versatile high-speed cameras that deliver high quality 3D and contrast images to smart and configurable stand-alone sensors that facilitate rapid development and easy integration. Their scalability ensures a perfect fit with your 3D vision application.
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3D Scanning System
CyberGage360
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Unprecedented combination of speed, accuracy and one-button simplicity for non-contact automated 3D scanning inspection.CyberGage360 dramatically Speeds Up Quality Assurance of Incoming Parts Inspection & In-Process Inspection of components on the manufacturing floor; Lowers Cost of Quality & Speeds Up Product Time-to-Market. Designed for use in general purpose metrology, the CyberGage360 has a range of potential industrial applications from automotive to aerospace to consumer electronics, where high accuracy and high speed throughput are important.
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HDI 3D Scanners
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Quickly capture high resolution digital 3D scansaccurately from objects in the physical world. The High Definition Imaging (HDI) 3D scanners use structured-light technology for capturing high-resolution digital 3D scans from real world objects. These systems are great for companies, manufacturers, academic institutions, visual effect studios, and research labs that need 3D scan data for visualization and measurement applications including: 3D modeling, documentation/archiving, reverse engineering, scientific measurement, computer-aided inspection, rapid prototyping/3D printing.
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Small Fanless 3D Control FAYb Laser Marker
LP-M Series
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Panasonic Industrial Devices Sales Company of America
The LP-M series offers a small, fan-less head design with an IP64 protection to prevent dust and water entering from any direction. The 3D Control capability allows marking on various types of products and complicated shapes to meet a large number of application needs. - 20, 50 & 100 Watt Models- Compact IP64 Rated Head- Full 3D Features- Auto Focus capable- Redundant Safety Features
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Ultra High Performance 3D CT System
UltraTom
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3D micro-tomography (CT Scan) and nano-tomography. Modular system with multiple imagers and x-ray generators. Experimentations possible in-situ. Large volume Inspection and manipulation volume.
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Precise 3D Profilometry
µscan
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Using the NanoFocus µscan technology, you can measure up to 100 times faster than with conventional probe systems. Various µscan sensors are available for the different application areas. The optical profilometers of the µscan series are suitable for the fast scanning of surface profiles with precision in the low nanometer range.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
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EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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3D Imaging Sensor
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The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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3D AOI Series
MV-6 OMNI
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- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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3D Multibeam Scanning Sonar
ProScan™
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Teledyne BlueView's 3D Multibeam Scanning Sonar user interface software. ProScan connects to the sonar and pan/tilt unit, configures each scan, generates full 3D point clouds, and optionally streams output to third party hydrographic software for fusion with other sensors. Data is recorded in multiple file formats: .son (raw acoustic data file for ProScan reprocessing), .txt (plain text record of all point locations and positional data) and .xyzi (industry standard xyzi data for 3D point cloud viewers, registration software, etc.). In playback mode, users can review and reprocess scans to modify sound speed, intensity threshold, multidetect and range settings as needed. ProScan coupled with Teledyne PDS MotionScan, pitch, roll heading and position sensors provides the capability to scan areas to collect 3D point clouds while correcting for motion.
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Universal 3D Measurement Software
Metrolog
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Get a real performance accelerator for your 3D measuring devices and more.Not only does Metrolog X4 architecture benefit from current computer and OS technologies significantly increasing the performances and metrology software throughput, but it also simplifies your day-to-day measurement workflow.
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USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-01
Interface Module
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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eviXscan 3D Suite 2.0
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eviXscan 3D Suite 2.0 is a comprehensive software platform that delivers the most powerful and user-friendly tools for scanning and mesh processing within straightforward workflow.With eviXscan 3D Suite 2.0 the scanning process is more easy to use and faster than ever before.The clear workflow will guide the user in all scanning steps from basic configuration to the final mesh processing and will enable to achieve significant productivity gain in work with eviXscan 3D products.
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High Precision 3D Metrology
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Ensure zero-defect quality in all product deliveries and boost customer satisfaction: ISRA’s precision metrology systems measure all object and surface properties down to the nanometer level while ensuring the shortest cycle times.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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3D Flexible Scanner
HDI Advance
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The HDI Advance 3D scanner offers the flexibility of scanning objects of different shapes and sizes. Simply move the camera positions to change the scanner’s field of view (FOV). The 3D scanner comes with three preset camera slots to quickly modify the field of view from 165mm up to 600mm, depending on the scanner model.
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SPI | AOI | AXI
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Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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3D Measurement Software
PowerInspect®
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3D measurement software for a range of hardware.PowerInspect software makes inspecting complex free-form surfaces simple, across all your inspection hardware. Use the right tools for the job, with one interface on all devices.
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3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
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SEMulator3D® is a powerful 3D semiconductor and MEMS process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex 3D structures created in the fab. Because the full integrated process sequence is modeled, SEMulator3D has the ability to predict downstream ramifications of process changes that would otherwise require build-and-test cycles in the fab.
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3D Sensors
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Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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3D Image Processing Software
EyeVision
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EyeVision is the base for numerous measurement and inspection tasks in image processing. Features are: Creation of inspection programs with drag and drop function. EyeVision supports all hardware platforms such as; Smart Cameras, Vision Sensors, PC & Embedded support.
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Mek Selective 3D AOI
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Every one of our desktop AOI and inline AOI systems is optimised for the demands of today’s advanced SMT applications and critical manufacturing environments. All are capable of delivering Selective 3D, using our unique stereoscopic imaging from the 9 cameras of the GTAz /GDAz optical heads.
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3D Solder Paste Inspection (SPI)
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Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Scanner
Artec Leo
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The first 3D scanner to offer onboard automatic processing, Artec Leo is able to provide the most intuitive workflow, making 3D scanning as easy as taking a video. As you scan your object, see the 3D replica being built in real time on Leo’s touch panel screen. Rotate the 3D model, check if you have captured all areas, and fill in any parts you may have missed.
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Software Module for Efficient and Accurate 3D Measurement
Verisurf Measure
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Measure part features and complex profile geometries informed by real-time deviation display between CAD and measured data for real-time decisions. Produce one-click inspection reports in standard or custom, shareable formats that feed to your quality management system.The Measure module’s device interface operates and optimizes most popular measurement systems making them more productive and ensuring a better return on your investment. You can also import externally captured data and process it against the nominal CAD model and tolerances. Even run datasets offline with feature extraction and pre-defined datums and constraints.
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SPI Isolators
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SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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3D Digital Inspection
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Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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High-Resolution 3D Seismic Solution
PIKSEL
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PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
