3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
-
product
3D Metrological Software
InnovMetric PolyWorks
Powerful metrological software which can effectively process vast amounts of data from 3D scanners in real time. Due to its modular architecture the software covers a large number of applications: one-point inspection by touch measurement systems, scanned data processing and data comparison to CAD models or complete reverse engineering – CAD model creation.
-
product
Bottom-up and Top-down 3D Modular AOI
SpectorBOX
With up to 9 cameras per side (18 total), it is designed to inspect PCB’s inside solder frames from the heavy duty conveyor system suitable for assemblies up to 5kg. Inspection of PCBs without solder frames is also possible. The PowerSpector 550BTL handles PCBs with a maximum dimension of up to 550x550mm (21.6”). The PowerSpector 350BTL is designed for medium Size PCB’s up to 350x250mm (13.8″x9.8″).
-
product
3D Flexible Scanner
HDI Advance
The HDI Advance 3D scanner offers the flexibility of scanning objects of different shapes and sizes. Simply move the camera positions to change the scanner’s field of view (FOV). The 3D scanner comes with three preset camera slots to quickly modify the field of view from 165mm up to 600mm, depending on the scanner model.
-
product
Low Speed Protocol Decode/Trigger Software (I2C, SPI, RS232, I2S, JTAG)
D9010LSSP
This bundle includes powerful decoding and triggering for the following serial bus standards: I²C, SPI, Quad SPI, eSPI (including Quad eSPI), RS232/UART, Manchester, I²S, SVID, and JTAG (IEEE 1149.1). It is compatible with S-Series, V-Series, Z-Series, EXR-Series, MXR-Series, UXR-Series, 9000 Series, and 90000 Series Infiniium oscilloscopes. For detailed information on the decode and trigger settings, please refer to the datasheet.
-
product
3D Bundle
Cost effective bundle of eVision's 3D librariesIncludes Easy3D, Easy3DLaserLine, Easy3DObject and Easy3DMatch
-
-
product
Time-of-Flight 3D Camera with IP67 Protection Class, Sub-Millimeter Precision
LUCID Helios2
Time-of-flight camera with IP67 protection class;Dust and water resistant; HDRmodel available ! Sony DepthSense IMX556 CMOS sensor; Resolution 0.3 MP 640 x 480; Frequency: 30 frames / s; Price: $ 1,645.00.
-
product
3D Laser Scanning Systems
3D laser scanning is a construction, engineering, and architectural tool often used to document the existing conditions (as-builts) of any structure.
-
product
3D Design
Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
-
product
3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
-
product
3D Multibeam Scanning Sonar
ProScan™
Teledyne BlueView's 3D Multibeam Scanning Sonar user interface software. ProScan connects to the sonar and pan/tilt unit, configures each scan, generates full 3D point clouds, and optionally streams output to third party hydrographic software for fusion with other sensors. Data is recorded in multiple file formats: .son (raw acoustic data file for ProScan reprocessing), .txt (plain text record of all point locations and positional data) and .xyzi (industry standard xyzi data for 3D point cloud viewers, registration software, etc.). In playback mode, users can review and reprocess scans to modify sound speed, intensity threshold, multidetect and range settings as needed. ProScan coupled with Teledyne PDS MotionScan, pitch, roll heading and position sensors provides the capability to scan areas to collect 3D point clouds while correcting for motion.
-
product
3D Video Microscope
BVM-20102B
High-resolution CCD sensor, built-in analog/digital converter, analog and digital signal directly display on the screen, can also simultaneously display on TV and computer through corresponding interfaces; taking photo and video through software; easy operation, reducing user's fatigue and injury.
-
product
3D Software
Geomagic Wrap
Geomagic Wrap 2017 delivers a new and improved 3D scan-to-model workflow. From expanded file format support to manipulating texture maps for bringing your printed parts to life, the 3D scan data toolbox of Geomagic Wrap provides a wealth of possibilities.
-
product
USB Logic Analyzer- High Speed Data Logger -SPI / IC Analyzer
LOG Storm
Logic analyzers are key tools for that process – they offer visibility over what happens in your digital electronic system.
-
product
Simple 3D Measurement & Inspection
XG-X Series Vision System
Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
-
product
High speed 3D GPR Array vehicle-mount Solutions
ImpulseRadar Raptor system, a state-of-the-art 450 MHz or 800 MHz 3D GPR array solution. Raptor 3D Arrays are based on Real-Time sampling (RTS) technology and the unique antenna design is a milestone in the evolution of the GPR.The robust and stable construction enables simple connection to suitable survey vehicles for fast data collection in normal traffic flows as posted speed limits.Collect up to 18 channels (450 MHz) in a single swathe with one pass to reduce time and costs.
-
product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
-
product
High Precision 3D Metrology
Ensure zero-defect quality in all product deliveries and boost customer satisfaction: ISRA’s precision metrology systems measure all object and surface properties down to the nanometer level while ensuring the shortest cycle times.
-
product
TTL/I2C/SPI Expansion Kit
OP-SB85L
OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
-
product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
-
product
3D Measurement Software
PowerInspect®
3D measurement software for a range of hardware.PowerInspect software makes inspecting complex free-form surfaces simple, across all your inspection hardware. Use the right tools for the job, with one interface on all devices.
-
product
3D Scanner
Raptor3DX
Raptor3DX is a hybrid type optical scanner, enabling both the automatic and stationary modes for users. The compact, detachable scanning sensor acts as a powerful sensor engine when as automatic mode; a flexible scanner itself when used as stationary mode, providing three FOV in one.
-
product
3D Measurement And Inspection
LOTOS
LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
-
product
USB-8451, 250 kHz I2C, 12 MHz SPI I2C/SPI Interface Device
779553-01
The NI USB‑8451 is a master interface for connecting to and communicating with inter-integrated circuit (I2C), System Management Bus (SMBus), and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8451 is a portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices or toggling LEDs. The USB‑8451 can be physically located more closely to I2C/SPI devices than PCI interfaces, reducing I2C bus length and minimizing noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
-
product
Revopoint MetroX: Blue Laser Line and Full-field Structured Light 3D Scanner
4 Flexible Scanning Modesꔷ Metrology-grade Accuracy: Up to 0.03 mmꔷ Volumetric Accuracy: Up to 0.03 mm + 0.1 mm × L(m)ꔷ Up to 7,000,000 Points/s in Full-field Structured Light Modeꔷ Up to 800,000 Points/s in Multi-line Laser Mode
-
product
3D Sound Intensity Analysis Software
DS-0225A
Finding out the position where the noise is occurring, and grasping the state of acoustic propagation are important ways to find effective noise countermeasure or improvement of acoustic environment.
-
product
Teledyne PDS Liteview Freeware 3D Viewer for PDS Data Files
Teledyne PDS LiteView is a freeware 3D viewer that can be used to view Teledyne PDS data files. The viewer will read the Teledyne PDS logdata files, grid model files, 3D design model files and GeoTIFF files. The multibeam and laserscanner data will be extracted from the logdata files and will be visible in the viewer.
-
product
AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
-
product
3D Optical Surface Profiler
NewView™ 9000
The NewView™ 9000 3D optical surface profiler provides powerful versatility in non-contact optical surface profiling. With the system, it is easy and fast to measure a wide range of surface types, including smooth, rough, flat, sloped, and stepped. All measurements are nondestructive, fast, and require no sample preparation.
-
product
3D Contact Profilometer
NanoMap-LS
NanoMap-LS with large scanning range allows to generate high resolution 3D and 2D images with a press of a button.
