Scanning Electron Microscopy
surface imaging from 1 to 5 nm in size.
See Also: Scanning Electron Microscopes, SEM
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Scanning Electron Microscopy
SEM
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Materials Evaluation and Engineering
JEOL JSM-6610 LV LaboratoryScanning electron microscopy (SEM) uses electrons for imaging to obtain higher magnifications and greater depth of field than light microscopes. The instruments at MEE are capable of variable-pressure, or low vacuum, SEM (VPSEM), as well as traditional high-vacuum conditions for sample observation. VPSEM is a specialized method using a variable-pressure sample chamber that allows direct evaluation of samples that are not readily examined with a traditional high-vacuum SEM. Nonconductive or vacuum sensitive samples that would typically require additional sample preparation can be directly analyzed in VPSEM without the need for additional sample preparation, such as carbon or metallic conductive coatings. This reduces both sample preparation time and distractions in microanalysis. Our laboratory also has a field emission SEM (FESEM) for critical high-magnification work and low-voltage (LVSEM) applications. Each instrument has a spacious sample chamber that can accommodate large and irregularly-shaped specimens and accessories for feature dimensional analysis and chemical microanalysis.
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Analytical Services
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IGC: Inverse Gas Chromatography; Understand surface energies, polarities, acid/base properties and nanomorphology on powders and fibers. ToF-SIMS: Time-of-Flight Secondary Ion Mass Spectrometry. Localize your molecules at the first nanos! 2D imaging with resolution up to 200 nm. Highest sensitivity up to 10 ppm. CM: Quarz Crystal Microbalance In-situ observation of thickness and stiffness of any films in liquid environmentSEM: Scanning Electron Microscopy Images say more than words, especially with an artistic eye XPS/ESCA: X-ray Photoelectron Spectroscopy/Electron Spectroscopy for Chemical Analysis.
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Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Scanning Electron Microscopy (SEM Analysis)
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Rocky Mountain Laboratories, Inc.
Scanning Electron Microscopy (SEM Analysis) can produce images of almost any sample at magnifications of 15-300,000X. The SEM has tremendous depth of field allowing for imaging that cannot be accomplished using optical microscopy. Conductive and nonconductive samples can be imaged. When operated in the backscatter (BSE) detection mode, differences in material composition can be observed. Elemental analysis can be performed on any feature observed with an integrated Energy Dispersive Spectroscopy (EDS) detector.
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TEM Lamella Preparation And Volume Imaging Under Cryogenic Conditions
ZEISS Correlative Cryo Workflow
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ZEISS Correlative Cryo Workflow connects widefield, laser scanning, and focused ion beam scanning electron microscopy in a seamless and easy-to-use procedure. The solution provides hardware and software optimized for the needs of correlative cryogenic workflows, from localization of fluorescent macromolecules to high-contrast volume imaging and on-grid lamella thinning for cryo electron tomography.
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Integrated AI-ADAS ECU And Cameras For Large Commercial Vehicle
ADM-TJ30
Electronic Control Unit
The integrated AI-ADAS ECU is connected to 8 cameras and powered by the vision-AI algorithm. It can detect and classify different kinds of vehicles/ pedestrians/ two-wheeler riders/ lane marking and other objects to perform multiple ADAS functions.
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Autonomous Driving AI Decision Making ECU
ADM-AL30
Electronic Control Unit
ADM-AL30 is dedicated to Autonomous Driving Applications. Powered by Intel® 12th Gen Core i9/i7 CPU and the NVIDIA RTX 4000 SFF Ada GPU, this AI computing platform can process huge amounts of data and make crucial decisions for autonomous vehicles. Equipped with 2 x 10G Base-T and 8 x 1G Base-T1 automotive ethernet ports, as well as 8 x CAN FD and 4 x CAN 2.0 interfaces, it seamlessly integrates into any automotive ecosystem. Plus, its ISO 16750-2 and ISO 7637-2 ensure reliability and safety under the most demanding conditions.
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NVIDIA GPU And Intel® Xeon® AI Computing Platform For Autonomous Drive Applications
AVA-3510
Electronic Control Unit
The AVA-3510 Series is powered by an Intel® Xeon® E processor coupled with workstation-grade Intel®C246 chipset to support up to 64 GB ECC DDR4 memory. The system incorporates one 2.5" SSD 256G for easy installation as optional accessories for fast read/write performance.
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Cathodoluminescence Solutions for Electron Microscopy
CLUE Series
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HORIBA Scientific's Cathodoluminescence Universal Extension enhances any SEM’s analytical capabilities while maintaining its original functionality. Since the sample is able to remain in the same spot, CLUE can easily be combined with other microscopy applications, such as EDS and EBIC.
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Scanning Probe Microscopy
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SPECS Surface Nano Analysis GmbH
As Scanning Probe Microscopy (SPM) is a key tool for nanotechnology, SPECS offers dedicated solutions for highly demanding requirements.In UHV, strong emphasis lies on spectroscopic methods such as scanning tunneling spectroscopy and inelastic tunneling spectroscopy as well as single atom and molecule manipulation. With the invention of a Joule-Thomson cryostat by Prof. Wulf Wulfhekel, SPECS now offers the JT-STM , operating sample and sensors in thermal equilibrium below 1K with optional high magnetic field.
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Scanning Thermal Microscopy Module
VertiSense™
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SThM module for thermal conductivity contrast and a temperature contrast imaging. Supports Contact, Tapping™ and Peak Force Tapping modes. Plug-in module, compatible with most commercial AFMs. Real temperature measurements up to 700° C. Ultra-low noise, high speed amplifier. Innovative probe design.
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Nanoscale Microscopy Standards
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The nanoscale AFM-CD standard (CD, critical dimension) contains structures to calibrate line widths and periods of AFM (atomic force microscopy) devices.
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Scanning Electron Microscope
JSM-IT510
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Scanning electron microscopes (SEMs) are indispensable tools not only for research but also for quality assurance and manufacturing sites.At those scenes, the same observation processes need to be performed repeatedly and there has been a need to improve the efficiency of the process.
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Microscopy and Nanotechnology Labs
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Integrated Dynamics Engineering
IDE, with the most vibration isolation and EMI cancellation systems in use today, is no stranger to nanotechnology. For over twenty years, IDE has been addressing the special needs of research environments with advanced isolation solutions. IDE’s influence and global reach can be seen in the most cutting edge labs pushing physical boundaries to extremes in advanced materials, surface science, microbiology and more.
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Laser Raman Microscopy System
RAMANforce/RAMANtouch
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Nanophoton is the pioneer of confocal laser scanning microscopy and spectroscopic analysis. To celebrate, we relaunch our fastest and highest resolution confocal Raman microscope RAMANtouch/RAMANforce. With a newly designed spectrograph and the latest optical technologies, RAMANtouch/RAMANforce’s spatial resolution and sensitivity have been highly improved, making it the optimal solution for all applications.
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Dental Surgical Microscopy Solutions
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Dental microsurgery involves the use of magnification and illumination for an enhanced visualization of anatomical details and fine structures. The dental microscope is an essential instrument used in dental procedures and dental surgery, allowing optimal assessment, preservation and maintenance of tooth structure and oral tissue, as well as minimally invasive procedures.
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Light Microscopy
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Materials Evaluation and Engineering
MEE has a variety of light microscopes with magnifications ranging from 5X to 2400X. Each microscope is connected to a camera with digital image capture for subsequent measurements and/or additional image analyses.
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Electronics
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Weidmüller Interface GmbH & Co. KG
Electronics lie at the heart of your automation technology. We give you solutions with intelligence.
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Cross Sections and Metallography
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Rocky Mountain Laboratories, Inc.
Cross sections are prepared by mounting samples in epoxy and then grinding and polishing the mount for imaging in the optical microscope or Scanning Electron Microscopy (SEM). Valuable information from cross sectioning can include: film thicknesses, inclusions, corrosion thickness, dimensional verification, and subsurface defects. Metallographic cross sections are typically etched to reveal the microstructure. Microstructural analysis can provide information about heat treatment history, corrosion susceptibility, as well as undesirable microconstituents.
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Scanning Electron Microscopes
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Our Scanning Electron Microscopes (SEMs) resolve features from the optical regime down to the sub-nanometer length scale.
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Electronics
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The analog electronics enable the linearization of the SQUID characteristics through negative feedback to the SQUID.
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Scanning Electron Microscope
E5620
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The E5620 is a MASK DR-SEM(∗) product for reviewing and classifying ultra-small defects in photomasks and mask blanks. It implements Advantest’s highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations. Compared to the E5610, our predecessor DR-SEM system, the E5620 features a number of improvements designed specifically to target mask requirements for extreme ultraviolet (EUV) lithography.
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Optical Scanning Systems
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that feature high scanning speed and accuracy. Our non-contact 3D scanners are ideal for 3D digitization of physical models, quality control and reverse engineering.
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Scanning Electrochemical Systems
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The VersaSCAN is a single platform capable of providing spatial resolution to both electrochemical and materials-based measurements. Each VersaSCAN is based on a common high-resolution, long-travel, closed-loop positioning system mounted to a vibration-resistant optical base. Different auxiliary pieces are mounted to the positioning system. These ancillary pieces (e.g., an electrometer, piezo vibration unit, or a laser sensor) provide functionality to the positioning system for different scanning probe experiments. VersaSTAT potentiostats and Signal Recovery Lock-in Amplifiers are integrated via ethernet control to make accurate measurements of these small signals.
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Active Scanning Technology
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ZEISS invented scanning in response to the drawbacks of single-point measurement nearly 50 years ago. This game-changing development enables the capture of thousands of data points within just a few seconds for truly reliable tactile quality assurance. It also saves time and money by delivering the high throughput and accurate results that are vital for manufacturing.
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3D Scan Systems
intelliWELD
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The intelliWELD is a 3D scanning unit for remote laser welding applications. While a robot leads the scan system along the processing line, the scan unit ensures the fast and precise positioning of the laser spot.The intelliWELD scan unit allows elimination of complex robot movements and fast repositioning, reducing the repositioning time between the welds to a few milliseconds.
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Microscopy
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Microscopy is the technical field of using microscopes to view objects and areas of objects that cannot be seen with the naked eye. There are three well-known branches of microscopy: optical, electron, and scanning probe microscopy, along with the emerging field of X-ray microscopy.
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Electronic Units
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Electronic units for field installation and mounting rack installation control the actuators. They are fed with 115 or 230 V AC. A local control panel allows for easy basic settings.
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Electronic Dendrometer
CRITERION RD 1000
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F. W. Breithaupt & Sohn GmbH & Co.KG
*BAF: Visually estimates if trees fall in or out of a given plot as related to the specified Basal Area Factor.*In/Out: Internally computes the limiting distance for questionable, borderline trees and determines if they are in or out of the plot.*Diameter: Determines the diameter of a tree at any given height.*Height/Diameter: Provides the ability to determine the height at which a specific diameter occurs.*Raw Inclination: Measures inclination in percent slope.
