Wafer Probers
bring the wafer in contact with the set of wafer probes.
See Also: Probers, Wafer, Flying Probes, Thermal Chucks
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Product
Wafer Thickness, TTV, Bow and Warpage
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ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
Micro Probers
Flying Fixture
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Yamaha Fine Technologies Co., Ltd.
Industry-standard testing machines for electronic circuit boards achieving high productivity and contact accuracy simultaneously. The pass rate and throughput greatly affect the productivity in the electrical testing process of circuit substrates. While improving both of these has proven difficult using the existing fixture method or flying method, Yamaha's Flying Fixture™ method has solved this.
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Product
Inline Wafer Testing
IL-800
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Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Single Wafer Transfer Tools
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Single Wafer Transfer Tools
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Product
Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
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The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
Ambient Temperature Vacuum Wafer Chucks
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6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Product
Wafer Test Solutions
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Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Product
Portable Wafer Probe Station
PS-5026B
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High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Product
Ultrasonic Wafer Scanner
AutoWafer
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Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
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Product
Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Product
Probe Needles for Wafer Sort and Test Applications
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Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
BT Imagine New wafer Thickness System
IS-T1
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Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
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The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Product
Equipment Front End Module Wafer Handler
Sigma EFEM
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Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Wafer Thickness Measuring System
WT-425
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Contact type can measure any materials within 0.2 µm (2 σ at 20℃ ±1℃). The wafer floats positions while measurement points change and it does not damage even thin wafers. Best for the process control of compound wafers and oxide wafers. (SiC, GaN, LT, Sapphire and Bonded Wafers)
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Product
Wafer Probe Test System
STI3000
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The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
