Computed Tomography
use of X-rays or ultrasound to scab abd cross section an object.
See Also: Tomography
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Industrial Computed Tomography
TomoScope® XL NC
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Coordinate measuring machine with x-ray tomography for the most stringent requirement with a small cone beam angle
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Product
Industrial Computed Tomography
TomoScope® L
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High Accuracy Multisensor coordinate measuring machine for 3D measurements using the principle of Computed Tomography, in combination with additional sensors (tactile sensor systems, optical sensors)
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Computed Tomography and CT Scanner
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When conventional x-ray images aren’t enough, a diagnosis for soft tissue conditions requires appropriate technology. Whether cross-sectional images are required or entire pictures of internal organs, CT exams and scanning are a vital part of a healthcare or imaging facility.
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Product
Industrial Computed Tomography
TomoScope® XL
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Micro focus X-ray source up to 225 kV (option: 300 kV micro focus tube) Grater range of x-ray detectors Grater range of x-ray detectors
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Industrial Computed Tomography
TomoScope® XS
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Coordinate measuring machine for three-dimensional measurement utilizing computed tomographyFast measurement with high resolution via the next generation transmission tubeReduce measurement time by 90% with OnTheFly TechnologyLow operating costs as a result of the new monoblock designExtremely precise air bearing rotary axis for low measurement uncertaintyLow space requirement thanks to compact designLow weight allows for installation almost anywhereFast amortization through low acquisition costsStandard-compliant calibration for reliable and traceable measurement results, optionally with DAkkS certificateVersatile fields of application such as plastic, metal and multi-material componentsSoftware for 3D real-time reconstruction of workpiece geometries during tomography
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Preclinical Imaging Modalities and Solutions
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Bruker offers advanced preclinical imaging solutions for a broad spectrum of application fields, such as oncology, neurology, cardiology, inflammation, infectious diseases, cancer research, functional and anatomical neuroimaging, orthopedics, cardiac imaging and stroke models. Our range of techniques includes MRI (Magnetic Resonance Imaging) , PET (Positron Emission Tomography), SPECT (Single Photon Emission Computed Tomography) micro-CT (Micro Computed Tomography), optical imaging and magnetic particle (MPI) imaging.
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MXI Computerized Tomography (CT) Option
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The Nordson TEST & INSPECTION µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson TEST & INSPECTION X-ray inspection systems. It uses the superior, sub-micron feature recognition 2D x-ray images, that Nordson TEST & INSPECTION X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. It reduces the number of time-consuming micro-section analyses needed and / or assists in identifying where micro-section preparation and investigation must concentrate. Available with a system order or as retro-fit to suit application and workflow needs.
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Product
CT-PORTABLE
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Computed tomography (CT) has recently gained increasing importance as a non-destructive inspection method for industry. CT enables a quick visualization of a three-dimensional volume model of the external and internal structure of an object, which can also be interpreted by non-experts. So far, however, the acquisition costs and the relatively complicated operation often prevented a widespread introduction of computed tomography systems.
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Industrial CT Scanning Services
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Computed tomography (CT) is also referred to as industrial x ray and industrial imaging. It is an x-ray methodology yielding 3-dimensional (3D) results by placing an object on a rotational stage between an x-ray tube and x ray detector, rotating the object 360 degrees and capturing images at specific intervals—such as every degree or every half degree.
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Product
CT-ALPHA
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The CT-ALPHA system meets the most stringent demands in CT X-ray. With this Computed Tomography system, ProCon X-ray GmbH offers the highest possible flexibility for individual customer requirements.
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Product
Industrial Computed Tomography
TomoScope® XS FOV
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Coordinate measuring machine for three-dimensional measurement according to the principle of computed tomography, Fast measurement in the field of view of the detector without moving axes with high resolution and high power
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Micro-CT for Life Science
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Micro computed tomography is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It really represents 3D microscopy, where very fine scale internal structure of objects is imaged non-destructively. Bruker microtomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the micron level.
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Medical Imaging
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ams offers high-speed, low-noise and low-power sensing solutions that enable manufacturers of Computer Tomography (CT) equipment and digital X-Ray Flat Panel Detectors (FPD) to produce crystal clear images while exposing patients to low doses of radiation. We are taking our leading imaging sensing solutions and expertise forward to achieve an unprecedented level of image accuracy while enhancing convenience and safety for the user.
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Product
Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
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Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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Micro-CT for material science
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Micro computed tomography is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It really represents 3D microscopy, where very fine scale internal structure of objects is imaged non-destructively. Bruker microtomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the sub-micron level.
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Product
Industrial Computed Tomography
TomoScope® S
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In both design and construction, the measuring machine meets the legal requirements for a fully protective device according to x-ray device regulations. Additional safety features have been included over and above the legal requirements.
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Product
CT Inspection System
FF35 CT
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The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
Computer on Module
The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXC-6600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor- Dual SODIMMs for up to 32GB DDR4- Rich I/O: 2x DP++, 1x HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1, 4x USB 2.0- Rich storage: up to 4 internal 2.5" SATA 6 Gb/s ports with RAID 0/1/5/10 support, CFast, M.2 2280
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
Computer on Module
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
Computer on Module
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
Computer on Module
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
Computer on Module
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
Industrial Computer
- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
Industrial Computer
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
SMARC Module
LEC-MTK-I1200
Computer on Module
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
