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Product
PCI Express (PCIe) 5.0 and Compute Express Link (CXL) Protocol Analyzer
Summit T516
Protocol Analyzer
The Summit T516 is targeted at high-speed PCI Express 5.0 and CXL I/O-based applications such as workstation, desktop, graphics, storage, and network card applications.
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Product
PCI Express (PCIe) 5.0 and Compute Express Link (CXL) Protocol Analyze
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Your product description goes here.
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Product
Compute Express Link (CXL)
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Compute Express Link (CXL) is a new high-speed CPU-to-Device and CPU-to-Memory interconnect designed to accelerate next-generation data center performance. CXL technology maintains memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. This permits users to simply focus on target workloads as opposed to the redundant memory management hardware in their accelerators. CXL is based on a PCI Express 5.0 Physical layer with speeds up to 32GT/s. Teledyne LeCroy provides protocol analysis test equipment to support development and debug of CXL based devices.
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Product
PCI Express 5.0 and Compute Express Link Protocol Exerciser
Summit Z516
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The Summit Z516 is a PCIe 5.0 and CXL protocol traffic generation test tool used for critical test and verification intended to assist engineers in developing and improving the reliability of their systems. The Summit Z516 can emulate PCI Express 5.0 and CXL root complexes or device endpoints, allowing new designs to be tested against corner case issues.
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Product
MXI-Express Cable, Gen 2 x8, Copper, 5m
782317-05
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
MXI-Express Cable, Gen 1 x1, Copper, 1m
779500-01
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
PXIe-8398, Gen 3, x16 PXI Remote Control Module
784178-01
MXI Express
PXIe, Gen 3, x16 PXI Remote Control Module—The PXIe-8398 enables control of a PXI Express chassis from an external host, such as a desktop PC, rackmount controller, or a separate master chassis. Using a Gen 3 x16 PCI Express link, the PXIe-8398 provides up to 16 GB/s of data transfer between the chassis and host over a copper cable connection.
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Product
MXI-Express Cable, Gen 1 x1, Fiber Optic, 200m
778959-200
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
MXI-Express Cable with Communication Levels up to Gen 3 x8
781042-100
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
PXIe System Module: Single Port (x8), Gen 3
M9022A
PXI Express Module
The M9022A is a PXIe System Module and is installed in the system slot of a PXIe chassis. When combined with an appropriate host adapter, it will provide a high data BW connection between the host PC and the chassis. The module can also be used with an M9037A PXIe embedded controller to interconnect two chassis in a multi-chassis system.
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Product
Compact PCI-Express/PXI-Express Module
ACE1553-3U-x-DS
PXI Express Module
The ACE1553-3U-x-DS is a member of AIM’s new family of compact PCI-Express/PXI-Express modules for analyzing, simulating, monitoring and testing MIL-STD-1553A/B databuses providing 1 or 2 dual redundant bus streams.
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Product
ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
Computer on Module
The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Product
6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
Industrial Computer
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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Product
MXI-Express Cable, Gen 1 x4, Copper, 3m
779725-03
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
Computer on Module
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
SAE AS5643 Mil-FireWire PXI Express Test & Simulation Instrument
HSSUB-6120
PXI Express Module
Avionics Interface Technologies
Highest density capability available in an AS5643 3U PXI Express, single slot instrument - Four (4) FireWire nodes, each with three (3) ports - Apps provide high-level (AS5643) and low-level (1394) access, while accommodating end-user customization - S100, S200, S400, S800 transfer rates - Support all Nodes operating concurrently at 800 Mbps - Independent transformer coupling for each port - Eight (8) standard PXI backplane triggers - Industry standard Texas Instruments IEEE 1394b Chipset - ANSI C (typical), C++/C#/LabVIEW
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Product
OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
Computer on Module
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
Computer on Module
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
PCIe Gen3 x8 FMC Module
PXI Express Module
VITA 57.1 FMC HPC ConnectorPCIe Gen3/Gen2/Gen1 x8 Slot (upto 64Gbps)Single module supports both PCIe Root Port & EndpointM.2 Key-M NVMe slot with PCIe Gen3 x2 interface & SATA3.0 interfaceMIPI DSI & CSI Connector through LVDS IOs32Kb-EEPROM
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
Computer on Module
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
Computer on Module
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
COM Express Type 6 Development Kit
COM Express Type 6 Starter Kit Plus
Computer on Module
The Type 6 Starter Kit Plus consists of a COM Express Type 6 module with ATX size Type 6 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for DDI adapter card that convert DDI signal to DP or HDMI signal, one PCI Express graphics x16 slot, one PCI Express x4 slot, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB3.0/2.0, Gigabit LAN and Super I/O. All necessary cables are included.
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Product
SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
Computer on Module
- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
SMARC Module
LEC-MTK-I1200
Computer on Module
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Product
2.5” Pico-ITX (MI/O-Ultra) Single Board Computers
Single Board Computer
Advantech's 2.5" Pico-ITX (MI/O-Ultra) single board computer (SBC) measure 100 x 72 mm and feature REAR I/O, fanless operation, small form factor(SFF), compact and ultra slim design, extended temperature range, and low power consumption.
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Product
Intel® Celeron J1900 & Atom™ E3825/ E3845, 3.5" SBC
MIO-5850
Single Board Computer
Intel® Celeron J1900 & Atom™ E3825/E3845, DDR3L-1333MHz 2/4GB on boardDirectX11, OpenGL3.2, OpenCL1.2, Dual display: HDMI, VGA, LVDSCPU bottom up design for system integration and rugged design for variable automation factory environments3 Intel i210 GbE, rich I/O: 4COM, SATA, USB3.0, SMBus/I2C, 16 bit GPIO, full-size Mini PCIe/M.2 E Key, half size mSATA, 12-24V Power input, SIM Card holder, CANBUS with IsolationSupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
MXE-1500 Series
Industrial Computer
The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
Computer on Module
LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
