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Test Sockets
provide electro mechano connection between DUT and ATE in hand testing applications.
See Also: BGA Test Sockets, Burn-In Sockets
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Test Sockets
Non Standard
Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Test Sockets
QFN/QFP
For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Test Sockets
BGA/LGA
There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Test Sockets
MEMS Device
Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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High Performance Chipscale Test Sockets
SC
Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Off-Set Kelvin Test Sockets
This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Custom Test Sockets
RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Test Socket
Contact Pitch Sizes 0.3mm, 0.4mm, 0.5mm, 0.65mm, 0.8mm, 1.0mm (custom pitches available)•Bandwidth < -1 dB through 65GHz•Current Carrying Capabilities 1 - 4 Amps•Pin Contact DC Resistance 10 - 30 mΩ•Environmental -40°C to +150°C•Self Inductance 0.14nH – 0.36nH•Mutual Inductance 0.12nH – 0.32nH•Typical Contact Force 12 – 35 grams/pin•Contact Compliance 75 µm – 200 µm•Custom Cooling Options Available
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Test Contactor/Probe Head
Hydra
Engineered for excellence and efficiency, Hydra™ spring probe series offers precision, reliability, and standardized semiconductor test interface.Designed to be best-in-class at a competitive price point, Hydra is optimized to maximize your operational efficiency. Hydra is built to withstand demanding high-volume manufacturing test environments with its robust and durable design.With a common test-height, Hydra offers the ability to mix and match power, RF, and Kelvin probes within the same test socket. In addition, Hydra streamlines inventory management with fewer probe part numbers to manage and shorter lead times.
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Multi-purpose Tester
DEL-101
Standard Electric Works Co., Ltd
● Mains wiring polarity check.● ELCB/RCD testing.● Measuring ear for line current.● Measuring ear for leakage current.● Helps calculate insulation resistance.● Helps calculate power consumption.● Helps fault finding of standing earth fault.● Fused main adapter.● Appliance testing (with the aid of a clamp meter).● Fused appliance socket.● No batteries required.● HRC fuse inside.● Fused, color-coded universal test sockets.● Universal mains IEC Lead.
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Test Sockets
Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Boundary-Scan DIMM Socket Tester
ScanDIMM
Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Interface Solutions
Cohu is the market leader in semiconductor test sockets and has 50+ years of semiconductor test expertise providing optimal test contactor and probe pin solutions for every type of application and challenge, using innovative and sophisticated R&D methods.We offer a full suite of test contactors that provide the electrical interface between the tester and the semiconductor device presented by the test handler; optimizes signal performance via an array of consumable probe pins.
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Test Sockets
socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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High Speed Thermal Printer
6041
• RS232C serial interface via a 6-pole RJ12 socket• Tested to comply with FCC Standards• Designed for use with Associated Model 6044 and similar devices• Four AA Batteries included• Imported
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Fixture Design
TestEdge offers quick, cost effective test fixture design services for low-speed, full-speed, and high-speed devices. Based on our experience in developing high performance test fixtures for a wide variety of devices, test sockets, and tester platforms, we provide a premium quality test and engineering validation environment for everything from high power (40W) to high pin count to high speed ECL to high speed SerDes (3.25Gb) devices.
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Film Frame Test Handler
4170-IH
High throughput ・High withstand load, and high thrust table ・Expansion of the strip attachment area ：260(L) X 300(W) [Withinφ300mm for WLCSP]・LOT control by barcode/2D code reader ・Easy device type exchange only test socket and display screen setting・Auto-cleaning function unit is installed to clean the socket at any desired timing.・8/12 inches ring conversion ・S2/S8 regulation compliance・SEMI G85 compliance・SECS/GEM compliance
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Universal Test Socket Receptacle
Series 6556
Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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USB SOCKET TESTER
MDPPTSTUSB
*Provides the user with a simple way to test a USB socket on a vehicle*Mini probe will light up when 4.4V - 5.25V is detected
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Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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Socket Probes
A lot of companies build test sockets. But only our test sockets are populated with our own proprietary probe technology, developed internally. This assures you that when you purchase one of our test sockets, you are using the most advanced interconnect available.
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Grypper G35 / G40
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Test Socket Lids
For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
