Chucks
Hold DUTs in place.
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Product
Fully Automatic Rubber Tensile Testing System
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Compactly Integrating Functions Required for Quality Control of Rubber Shimadzu Fully-Automatic Tensile Testing System This system provides full automation, from measurement of specimen dimensions, supply to the testing machine, and fixing of chucks to measurement of extension between standard lines and data processing. The system can be used for continuous nighttime testing, which helps save labor costs.
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Product
Pneumatic Non-Shift Wedge Grips
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Pneumatic non-shift wedge grips have an open-front design and use one-touch chucking by foot operation to provide simple specimen mounting. These grips are suitable for tensile testing materials such as plastics and metals.
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Product
Probe Station
EPS300
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Reasonable price and compact design. - Sellectable chuck size : 4inch, 6inch, 8inch when ordering probe station. - Hot chuck can be installed. Temp range: RT ~ 300°C - Hot and cool chuck from 0 °C ~ 300 °C can be provided.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
Probe Station
EPS1000
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Reasonable price and compact design. - Sellectable chuck size : 4inch, 6inch, 8inch when ordering probe station. - Hot chuck can be installed. Temp range: RT ~ 300°C - Hot and cool chuck from 0 °C ~ 300 °C can be provided. - Maximum pcs of manipulators can be installed on the base unit of probe
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Product
Vacuum Chuck Temperature Controlled Test Stations
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These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Product
TLP Probe Arm Kit
TPA-95
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High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
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Product
Wafer Back Side Cooling System
GR-300 Series
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The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Product
Thermal Chuck Systems
A-Series
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Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
