DIMM
Dual In-line Memory Module.
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Product
8GB SO-DIMM DDR5-4800 262Pin 1GX16 1.1V
AQD-SD5V8GN48-SC
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Samsung Original Chip, Dual 32-bit Subchannels, Increased Banks and Burst Length, DDR5 4.8GT/s, Same-Bank Refresh.
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Product
Test Adapter
Ramcheck 72 Pro
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Our latest addition to the RAMCHECK memory tester provides needed support for testing 72-pin SO DIMM modules used in older laptop computers. The RAMCHECK memory tester automatically detects the presence of the RC 72 Pro adapter
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Product
SO-DIMM DDR Memory
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Extend operating temperatures of memory with Advantech. We offer industrial grade SO-DDR 400 memory with 30μ" gold plating connector (200 pin) supporting 2.5v operating voltage and wide operating temperature ranges from 0 ~ 95℃ (32 ~ 203℉).
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Product
ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DVI-D And HDMI
IMB502
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*LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3, Pentium® & Celeron® processor (Kaby Lake/Skylake)*Four 288-pin DDR4-2400/2133/1866 DIMM for up to 64GB of memory*VGA, DVI-D and HDMI with triple-view supported*5 SATA-600 with RAID 0/1/5/10*6 USB 3.0 and 7 USB 2.0
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Product
Boundary-Scan DIMM Socket Tester
ScanDIMM
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Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Product
4U AI GPU Edge Server
AXE-7400SR
MEC Server
ADLINK's AI Edge Server AXE-7400SR series can be equipped with various acceleration cards according to application needs. The flexible and diverse combinations can meet the various changes in smart manufacturing applications, including GPU cards, motion control cards, IO cards, and image capture cards. AXE-7400SR features a single 4th Gen Intel® Xeon® Scalable Processor, 8x DDR5 DIMMs at 4800MT/s (8 channels, 1DPC), and supports up to 5x full-height PCIe slots for GPU/FPGA accelerator cards. Additionally, it includes a BMC with AST2600, IPMI v2.0/Redfish compliant, a dust-proof design, and a short chassis, making it suitable for factory and automation environments.
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Product
JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
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The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Product
DRAM SO-DIMM DDR4 Memory
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Improve performance up to 50% (compared to SO-DDR3.) with Advantech! We offer industrial grade SO-DDR4 2666/2400/2133 memory with 30μ" gold plating connector (260 pin) featuring 1.2v low operating voltage with faster burst accesses.
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Product
DRAM DDR2 Memory
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Enable better electrical performance and speed (compared to DDR) with Advantech. We offers DDR2 800/667 memory with 30μ" gold plating connector (240 pin) featuring 1.8v operating voltage and better bandwidth. With rigorous reliability, vibration tests, and 0 ~ 85℃ (32 ~ 185℉) wide operating temperature range, our certified DIMM are fully suitable for enterprise, embedded, automotive, data centers, and networking applications.
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Product
16GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
Interposer
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Memory Tester
SP3000
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CST is proud to offer a portable stand alone and affordable memory tester, combining DIMM and SODIMM testing capability all on the same universal base unit with optional easy plug-on test adapters.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
32GB SO-DIMM DDR5-4800 262Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-SD5V32GN48-SB
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Samsung Original Chip, Dual 32-bit Subchannels, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
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Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
Test Adapter
Ramcheck 100
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This addition to the RAMCHECK memory tester provides needed support for testing of SDRAM and standard EDO/FPM DRAM 100-pin SO DIMM modules at an affordable price.
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Product
S.O. DIMM Converter
DDR 200-pin
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The RAMCHECK DDR 200-Pin Converter is a perfect low-cost solution for testing modern laptop DDR memory. The converter plugs directly into the 184-pin RAMCHECK DDR main adapter, providing you with fast, convenient testing capabilities
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
Motherboard
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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Product
ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™ Processor, Intel® Q370, USB 3.1 Gen2, SATA 3.0, Dual LAN, VGA, DisplayPort, DVI-D, And HDMI
IMB520
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The IMB520 is powered by the LGA1151 socket 8th generation Intel® Core™ i7/i5/i3, Pentium® or Celeron® processor (code name: Coffee Lake) with the Intel® Q370 chipset. The ATX motherboard supports four 288-pin DDR4-2666/2400 DIMMs with up to 64GB of system memory. The Intel® Coffee Lake-based IMB520 is a performance-driven motherboard that is expandable, feature-rich and versatile to help facilitate quick deployment. The brand new IMB520 is an ideal solution for automation, transportation, retail, medical and other Industrial IoT-related applications. The IMB520 provides one PCIe x16 slot, four PCIe x4 slots, one PCIe x1 slot and one PCI slot for frame grabbers, motion control cards and edge-based data acquisition cards, making it an ideal solution for machine vision and industrial automation application. It also has two USB 3.1 Gen 2 and four USB 3.1 Gen 1 ports for faster data transfer. In addition, the industrial-grade ATX motherboard is integrated with the Intel® HD Graphics for superb visual performance. Up to three independent displays are available from DisplayPort, DVI-D, HDMI, and VGA.
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 and Xeon E3-1200 v5/v6 Processors
IMB-M43-C236
Motherboard
The IMB-M43-C236 is ADLINK's ATX industrial motherboard, supporting the 6th/7th Generation Intel Core and Xeon E3-1200 v5/v6 processor in the LGA1151 package, and the Intel C236 Express chipset, the IMB-M43-C236 supports such high-speed data transfer interfaces as PCIe3.0, USB 3.0 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz ECC or non-ECC memory up to 64 GB in four DIMM slots.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
Memory Module
Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
16GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V16GR56-SB
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SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
32GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V32GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
DDC (Dual DIMM Carrier) DIOS Adaptor
JT 2702/DDC
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The JT2702 Digital 256 channel JTAG I/O module. JT2702/DDC (Dual DIMM Carrier) is a DIMM DIOS accessory product. It is typically used in custom test adapters or fixtures where a large number of digital I/O channels are required with a minimum space overhead.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
Memory Module
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V32GR56-SB
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
DRAM Memory Module DDR3 Memory
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Deliver stable memory technology with Advantech! We offers DDR3 1866/1600/1333 memory with 30μ" gold plating connector (240 pin) featuring 1.35v/1.5v low operating voltage and better bandwidth. With rigorous reliability, vibration tests, and 0 ~ 95℃ (32 ~ 203℉) wide operating temperature range, our certified DIMM is suitable for edge computing, enterprise, embedded, automotive, data centers, and networking applications.
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Product
1U Rackmount Platform For Network Application With Intel® Atom® C3000 Processor. Ideal For Data Center Deployments.
FWA-2012
Platform
Intel Atom® C3000, up to 16 Cores2 x DDR4 DIMM slots, up to 64GB6 x GbE RJ-45 with 2 pairs of of LAN bypassIntel® QAT with up to 20G crypto support1 x internal 2.5" SATA HDD/SSD, 1 x internal 3.5" SATA HDD1 x Advantech network module expansion
