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3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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High Speed Solder Paste Inspection
VisionPro HSi
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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High-speed 3D Solder Inspection Machine
YSi-SP
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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3D Inline Solder Paste Inspection System
TROI 7700 SERIES
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
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Solder Paste Printers
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Solder Paste Wetting Tester
SP-2
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
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3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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SparkFun Solder-able Breadboard
Large
This is the Large SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our full-size breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Solderability Tester
ZHX-35
Shanghai Dean Electrical Co., Ltd
Executive standard: GB/T4074.4-2008/IEC60851-4; Inspection standard: JB/T4279.14-2008Used to detect the self-solderability of enameled round wires and wire harness;Set variable temperature range and automatically maintain constant temperature;Under mechanical driven, samples would be withdrawn by the action of automatic insertion and lateral movement, free from vibration and noise;
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3D Software
Geomagic Control X
Combined with the powerful and highly precise Artec 3D scanners, Geomagic Control X is a fantastic solution for anyone looking for speed, accuracy and a large variety of tools to choose from. Easily get the data required for extensive quality control in no time at all with Artec’s advanced 3D scanning solutions. Acquire precise measurements and carry out inspection and data analysis on the spot, using Geomagic Control X and an Artec 3D handheld scanner. Compare 3D scans to the reference CAD model to minimise assembly flaws and increase productivity.
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Precise 3D Profilometry
µscan
Using the NanoFocus µscan technology, you can measure up to 100 times faster than with conventional probe systems. Various µscan sensors are available for the different application areas. The optical profilometers of the µscan series are suitable for the fast scanning of surface profiles with precision in the low nanometer range.
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3D Profile Sensor
Z-Trak2
Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Macro Inspection
High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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3D Helmet Coil
With the 3D Helmholtz coil system, 3-dimensional magnetic field vectors can be generated. By superimposition, it is possible to create a field-free space or an artificial earth magnetic field vector inside the coil arrangement. The coil arrangement was developed for the calibration of magnetic field sensors.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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IPC Inspection
Customers of MASER Engineering that are designing electronic products and thereby using bare and assembled Printed Circuit Boards (PCB's) are interested in the manufacturing quality of the PCB and assembling quality of the PCBA.
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Concrete Inspection
Concrete structures are normally constructed using steel reinforcement and Elcometer offers Concrete Covermeters and Rebar Locators to either measure the depth of concrete over the rebar or simply to detect the rebar under the surface. Half-cell versions of the Covermeter can be used to assess the probability that corrosion is taking place on the rebar. Test Hammers are used to assess the surface hardness of cured concrete and Elcometer offers several moisture meters that can be used to determine if the structure is sufficiently dry for coating.
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3D Printer Laboratory
Trialon’s commitment to providing 3D printing services is second to none. Our facility is equipped with state-of-the-art 3D printers that create accurate plastic prototype and end user parts.
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FieldMaster 3D
Field analyzer for low-frequency fields, selective and wide-band measurement simultaneously on all three axes. The sensor plates have a high-quality GOLDSCHICHTUNG, so that the calibration is guaranteed as long as possible despite harmful environmental influences.
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Sapphire 3D Microscope
WDI-2000
The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
