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Wafer Failure Analysis
Defines the failure mode and then through additional testing determine it's cause.
See Also: Wafer, Wafer Thickness, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Failure Analysis
MicroINSPECT 300FA
The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Destructive Physical Analysis & Failure Analysis
DPACI's component analysis laboratory performs major analytical functions, such as destructive physical analysis, failure analysis, counterfeit analysis, and material analysis on components & devices. Our destructive physical analysis techniques are performed in accordance with standards and methods used in most military and space program requirements. Solutions for difficult production problems are resolved through our failure analysis procedures.
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Failure Analysis Services
Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis And Magnetic Imaging Services
Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Benchmark, Competitive and Failure Analysis
Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Failure Analysis – Materials
Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Failure Analysis Services
BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer Prober
Prexa
The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Wafer Probers
Full Automatic Wafer Prober. Semi Automatic Wafer Prober. High Current Probe Block. 6-inch Manual Prober. 8-inch Manual Prober. 12-inch Manual Prober.
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Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. It provides process and design feedback to determine the root cause of any failures. Time-to-data for the FA Engineer is a critical measurement and SemiProbe’s Probe System for Life ® (PS4L) is ideally suited to excel in this application. All key components are interchangeable, making it easy to switch between individual die, wafers, and packaged parts.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Portable Wafer Probe Station
PS-5026B
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Gas Analysis
HPR-20 EGA
The Hiden HPR-20 EGA gas analysis system is configured for continuous analysis of evolved gases and vapours from thermogravimetric analysers, TGA.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Sematech Analysis and SEMI Standards Analysis
Rocky Mountain Laboratories, Inc.
Rocky Mountain Laboratories, Inc. provides SEMI Standards analyses that conform to the following SEMATECH and SEMI Standards for testing of passivated 316L stainless steel components being considered for installation into a high-purity gas distribution system:SEMASPEC #90120401B-STD (SEM Analysis)SEMASPEC #90120402B-STD (EDS Analysis)SEMASPEC #90120403B-STD (XPS Analysis)SEMASPEC #91060573B-STD (Auger (AES) Analysis)SEMI F60-0306 (based on F60-0301) (XPS Analysis)SEMI F72-1102 (Auger (AES) Analysis)
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Signal Analysis
Cross-Correlation Analysis
The software is used for correlation analysis of signals coming from the input channels of FFT spectrum analyzers in real time or recorded time realization view mode, as well as for viewing various correlation characteristics of signals. Correlation analysis is a set of methods based on the mathematical correlation theory and is used for detecting the correlation dependence between two random attributes or factors. For solving a number of diagnostic tasks, cross-correlation analysis of signals in two or more control points distributed across space is often used.
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Acoustic Analysis
Noise is increasingly the subject of new regulations for the protection of human health and safety as well as for improving the environment in general. As well as sound levels, the perceived sound quality of products from washing machines to vehicles is often an important part of the customer buying decision so must be considered during product development. m+p Analyzer for noise and vibration measurement and analysis provides a full range of capability for these applications. Real-time fractional octave filters satisfy all acoustic applications from simple sound pressure, sound power for equipment legislative requirements, intensity mapping to isolate sources to sound quality metrics for product refinement.
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Signal Analysis
Synchronous Accumulation (Order Analysis)
Order analysis is one of the most convenient and efficient methods for diagnostics and balancing of rotating mechanisms and transmission gears. With an RPM sensor and a vibration sensor, it is possible to study the time characteristics of gear vibration signals. It is a well-known fact that a signal from a vibration sensor is affected by signals from other sources. To tune out from the disturbing signals, the synchronous signal accumulation method is used. For each shaft rotation, the RPM sensor provides a rotation mark. This signal serves as a triggering strobe for the vibration sensor signal sweeping. The obtained signal sweeps are combined. All the sources of the signals related to the shaft frequency (frequency of rotation) are accumulated and increased in the accumulator linearly proportionally to the N number of rotations. All other signals that are not correlated with the shaft frequency are accumulated proportionally to N1/2 and in case of a greater number of averagings, the useful signal exceeds the interference level.
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Surface Analysis
A UHV surface analysis system for thin film depth profilingMeasures the surface composition of the first few nanometers and/or micrometers depth of solid samples.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Image Analysis
In today's demanding environment where quality assurance is an everyday requirement Aprotec have sought to find present day retrofit solutions that compliment fully functional older machinery.
