3D
three dimensions.
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Product
Articulating Measuring Arms
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Aberlink 3D measurement software can be retrofitted to a huge range of portable measuring arms, including Faro, Romer, Cimcore and others.
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Product
High Performance 9 kHz - 1200 MHz SDR
CloudSDR
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The CloudSDR''s remote mode also offers a variable width spectrum analyzer with adjustable spans up to 10 MHz wide. The spectrum information update rate can be adjusted up to 10 Hz or turned off to limit the bandwidth utilization. In addition, the built-in squelch can be used to limit data transmission when no signals are present. Wideband spectrum analyzer mode offers 56 MHz wide spectral captures in both 2D, 3D and waterfall formats.
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Product
Borehole 3D Geophones
GFA 50/100
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3D borehole geo-phone is realized with 3x high sensitive geophones (nat.freq.10 Hz- 1 vertical and 2 horizontal sensors) oriented according to a triad of orthogonal Cartesian axes XYZ. Delivered with a cleat assembly to sustain its weight at the requested depth (GFA cable is graduated in meters), this borehole geophone has a pneumatic-mechanical clamping system.
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Product
DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
Motion Controller
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Product
Bottom-up and Top-down 3D Modular AOI
SpectorBOX
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With up to 9 cameras per side (18 total), it is designed to inspect PCB’s inside solder frames from the heavy duty conveyor system suitable for assemblies up to 5kg. Inspection of PCBs without solder frames is also possible. The PowerSpector 550BTL handles PCBs with a maximum dimension of up to 550x550mm (21.6”). The PowerSpector 350BTL is designed for medium Size PCB’s up to 350x250mm (13.8″x9.8″).
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Product
Portable Metrology‑Grade 3D Scanner
Black Series
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The HandySCAN 3D | BLACK Series delivers accurate, high-resolution and repeatable results, regardless of the measurement setup quality and no matter the user experience. Featuring dynamic referencing, both the scanner and part can move during measurement and still provide an accurate and high‑quality scan.
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Product
Partial Discharge Expert Diagnostic and Location System
PDExpert
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Power Monitoring and Diagnostic Technology Ltd.
The PDExpert is PMDT's third level of Partial Discharge (PD) Expert Diagnostic and Location System. It is a powerful, portable, multi-channel system of impeccable design used to analyze and pinpoint PD signals coming from a power asset within centimeters while the power system is energized. The system consists of UHF, AE, HFCT and ultrasonic sensors, one advanced UHF/PD signal processing unit, one oscilloscope, filters and other accessories.The system employs ultra-high speed data acquisition and advanced digital signal processing technologies, compares the UHF, AE and HFCT signals of different frequency ranges to determine if it is PD or noise, and locates the source in power assets accurately by utilizing Acoustic-Electromagnetic Combination Location Technique, time Difference of Signals' Arrivals (TDOA), and 3D Positioning Technology.
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Product
Solid Edge
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Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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Product
USB 3.0 Stereo Vision Camera
Tara
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Tara is a UVC- compliant 3D Stereo camera based on MT9V024 stereo sensor from ON Semiconductor which supports WVGA((2*752)x480) at 60fps over USB 3.0 in uncompressed format. This Stereo camera provides two synchronized sensor frame data interleaved side by side to the host machine over USB 3.0 interface.
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Product
Optical Profilometers
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Profilm3D® and Zeta™ optical profilometers provide fast, easy, non-contact solutions for 3D surface topography measurements. Our portfolio of optical profilers supports a variety of measurement techniques, including white light interferometry, True Color imaging and ZDot™ confocal grid structured illumination. KLA Instruments can help guide you to the right optical profiler solution for your unique needs.
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Product
Eyepiece-less Stereo Microscopes
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Vision Engineering’s eyepiece-less stereo microscopes are better for users and for business. Their ergonomic design lets the operator sit back in a comfortable position, and the expanded pupil technology delivers an enhanced 3D view of the subject. The relaxed natural posture makes it easy and to work with tools and to manipulate the subject. Greater comfort and ease of use directly translate into greater productivity and quality.
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Product
Sensors
3D Fiber Probe
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Ultra high precision 3D measurements2D image processing combined with a laser distance sensorSelf illumination modeLowest contact force of 1 µNProbe sphere diameters from 0.040 mm to 0.250 mmControl and evaluation software for fully automatic measurements
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
PCIe Color Industrial Camera
CMOSIS CMV4000
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2K camera Applications: In-situ optical inspection camera, fast process capturing, e.g. Golf club swings, Intelligent Transportation Systems (ITS), Open road tolling and Traffic monitoring, Industrial Automation, Machine Vision, Facial Recognition, Motion Capture, Automotive crash testing, OCR/ OCV, 3D scanning, Robotic Arms, Material and Life science Microscopy, Ophthalmology and Retinal imaging, Medical Imaging, Flat panel inspection, Dental, Kiosks, Security, Biometrics
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Product
Smart 3D Scanner For Education And Hobby At An Affordable Price
NEO
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Allows you to easily scan objects for further 3D printing
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Product
Raman Imaging & High Resolution Spectrometer
LabRAM Odyssey
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Special 50 years anniversary series: true confocal Raman microscope enabling the most detailed images and analyses to be obtained with speed and confidence. Ideally suited for both micro and macro measurements, it offers advanced confocal imaging capabilities in 2D and 3D. With guaranteed high performance and intuitive simplicity, the LabRAM Odyssey™ is the ultimate instrument for Raman spectroscopy, widely used for standard Raman analysis, PhotoLuminescence (PL), Tip Enhanced Raman Spectroscopy (TERS) and other hybrid methods.
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Product
Fiber End-face Interferometer
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Anfkom International Co.,Limited
1.Automatic MeasurementSANA2 is equipped with the locking handle sensing unit to monitor the device locking status. To further simplify the testing process, the instrument can start the measurement once the device to be tested is fully locked. Operator can also click the button aside the locking handle to trigger the measurement.2.0~12° APC Angle Auto TuningBenefit with the unique fixture design, SANA2 can tune the APC angle precisely from 0°to 12°automatically, meeting any special requirement on APC angle setting.3.Simple and User Friendly Interfaces and Excellent 3D ImagesThe software of A 2 is simple and user friendly, you can change the language within the software. It provide many endface rebuild method such as 3D, 2D, plot to assist the engineers about the process. The test reports and data are generated automatically for analyzing and tracing.4.Auto Centering ImagesSANA2 has auto centering image function that can find the fiber and makes it to center automatically within one click.No mouse drag or hardware adjustment is needed.5.Cleave Angle Measurement
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Product
Automated Optical Inspection (AOI)
TR7700 SIII 3D
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TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Product
Electrical Tomography Software
Res3dinv
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In areas with complex geology, there is no substitute for a fully 3D surveys. The arrays supported include Pole-Pole, Pole-Dipole, inline Dipole-Dipole, equatorial Dipole-Dipole, Wenner-Schlumberger and also non-conventional arrays.RES3DINV uses the smoothness-constrained least squared inversion technique to produce a 3D model of the subsurface starting from the data of apparent resistivity.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
PDS Bar Sweep Survey Software
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Teledyne PDS Bar Sweep supports different ways to monitor your leveling operation. Teledyne RESON provides the software as well as the sensors to accompany the system.Teledyne PDS visualizes the bar in top, profile, and 3D views indicating where the leveling has taken place. The position and depth of the bar is logged to a digital terrain model (DTM) which is color-coded for depth. It is possible to display a design depth in the profile views, indicating whether the bar has to be lowered or hoisted.
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Product
H/E fieldmeter
ESM-100
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The 3D H/E fieldmeter ESM-100 is a patented, unique hand held measuring instrument. It can easily measure electric and magnetic alternating fields simultaneously, independent of their direction, and at one point. With this piece of equipment it is possible for anybody, to carry out quick, professional and error-free measurements, right from the beginning
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Product
PCIe Mono Industrial Camera
CMOSIS CMV2000
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2K camera Applications: In-situ optical inspection camera, fast process capturing, e.g. Golf club swings, Intelligent Transportation Systems (ITS), Open road tolling and Traffic monitoring, Industrial Automation, Machine Vision, Facial Recognition, Motion Capture, Automotive crash testing, OCR/ OCV, 3D scanning, Robotic Arms, Material and Life science Microscopy, Ophthalmology and Retinal imaging, Medical Imaging, Flat panel inspection, Dental, Kiosks, Security, Biometrics
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Product
Permanent Bonding Systems
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The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
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Product
Make Your 3D Control Smarter
VALUE ADDED SOLUTIONS
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At Metrologic Group, we always seek to be a problem-solver for industrial manufacturers and quality assurance professionals. That is why, we continuously develop improvements of our software and complementary solutions to respond or even outreach customer expectations.
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Product
SMARC
ROM-5720
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Advantech ROM-5720 SMARC 2.0/2.1 Computer-on-Module is powered by NXP i.MX8M SOC which includes dual and quad-core Arm Cortex-A53 processors in combination with one Cortex-M4 real time processor and the Vivante GC7000 Lite 3D graphics engine. It provides USB3.0, two Gigabit Ethernet, two MIPI-CSI, PCI Express, and HDMI2.0 up to 4096 x 2160 at 60 Hz and MIPI-DSI for embedded applications. It's the ideal solution for transportation, infotainment, vending, Medical.
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Product
PDS Multibeam Survey and Processing/Charting
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Teledyne PDS for Multibeam Surveys provides the functionality for survey planning, data acquisition, data processing, editing, volume calculations and chart production. This turnkey solution offers the surveyor and helmsman a strong tool to carry out the multibeam survey efficiently. Progress is shown real time in top, profile, and 3D views using a color-coded digital terrain model (DTM). Various filter settings can be applied to the multibeam data online, thus providing real-time data processing. Quality control displays reassure the operators that the data is of the desired quality.
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Product
Vibration Analyzer
DigivibeMX® M30
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DigivibeMX® M30 System is the Vibration Analyzer, Dynamic Balancer and Data Collector with more functions in the market. From simple Vibration analysis to complex 3D ODS vibration simulations, DigivibeMX® M30 is the best tool for predictive analysis and diagnosis for your machinery.
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Product
3D Antennas
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A 3D capable printing technology designed to create printed electronics directly on 3D surfaces using modern software controlled digital process.
