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3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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SPI Isolators
SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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3D Software
Geomagic Control X
Combined with the powerful and highly precise Artec 3D scanners, Geomagic Control X is a fantastic solution for anyone looking for speed, accuracy and a large variety of tools to choose from. Easily get the data required for extensive quality control in no time at all with Artec’s advanced 3D scanning solutions. Acquire precise measurements and carry out inspection and data analysis on the spot, using Geomagic Control X and an Artec 3D handheld scanner. Compare 3D scans to the reference CAD model to minimise assembly flaws and increase productivity.
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Precise 3D Profilometry
µscan
Using the NanoFocus µscan technology, you can measure up to 100 times faster than with conventional probe systems. Various µscan sensors are available for the different application areas. The optical profilometers of the µscan series are suitable for the fast scanning of surface profiles with precision in the low nanometer range.
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3D Profile Sensor
Z-Trak2
Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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3D Helmet Coil
With the 3D Helmholtz coil system, 3-dimensional magnetic field vectors can be generated. By superimposition, it is possible to create a field-free space or an artificial earth magnetic field vector inside the coil arrangement. The coil arrangement was developed for the calibration of magnetic field sensors.
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3D Printer Laboratory
Trialon’s commitment to providing 3D printing services is second to none. Our facility is equipped with state-of-the-art 3D printers that create accurate plastic prototype and end user parts.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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FieldMaster 3D
Field analyzer for low-frequency fields, selective and wide-band measurement simultaneously on all three axes. The sensor plates have a high-quality GOLDSCHICHTUNG, so that the calibration is guaranteed as long as possible despite harmful environmental influences.
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Sapphire 3D Microscope
WDI-2000
The Sapphire 3D Microscope: HS-WDI-2000 was designed with high quality lighting parts and a good optical system design,can get a very clear image.with the digital camera,it can provide the image in time, widely used in LED,Solar,SEMI…
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3D CT AXI
PCB manufacturers can enjoy comprehensive, high-speed inspection with Omron’s revolutionary technology that reliably captures defects in hidden areas.
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SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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3D Metrology Solutions
SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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3D Sensing
The rapidly growing field of 3D sensing is currently addressed by the following 3D camera technologies: stereoscopic imaging, time-of-flight (ToF) sensing, and structured light.
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Open eVision 3D Studio
Ease the configuration and the setup of a laser triangulation scanner using the Coaxlink Quad 3D-LLESimplify the calibration procedureDisplay interactive Depth Maps, 3D Point Clouds and ZmapsFree of charge
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3D AOI Series
MV-6 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Relay Test Set Type SP-I
Supreme Instrument Laboratories
Supreme make relay testing set is designed for site testing of protective relays which simulate in common fault conditions under which a protective relay will be called into positive function. Periodic field testing is the best way of ensuring the integrity of the protective relays. We offer our relay testing set with specific testing capacity to suit different group of protective relays. The testing set operates on single phase 230 V, A.C. 50Hz. Supply.
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Economy 3D Scanners
Cost-effective 3D scanners with high-end technology, provide you with 3D scanning capabilities to fit within your budge
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3D Scanner
peel 3
peel 3 can handle any application in: aftermarket & tuning, AR, VR & digital content, education, heritage preservation and art, product design, healthcare, and MRO and engineering.
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3D Software
Geomagic Wrap
Geomagic Wrap 2017 delivers a new and improved 3D scan-to-model workflow. From expanded file format support to manipulating texture maps for bringing your printed parts to life, the 3D scan data toolbox of Geomagic Wrap provides a wealth of possibilities.
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Borehole 3D Geophones
GFA 50/100
3D borehole geo-phone is realized with 3x high sensitive geophones (nat.freq.10 Hz- 1 vertical and 2 horizontal sensors) oriented according to a triad of orthogonal Cartesian axes XYZ. Delivered with a cleat assembly to sustain its weight at the requested depth (GFA cable is graduated in meters), this borehole geophone has a pneumatic-mechanical clamping system.
