Filter Results By:
Products
Applications
Manufacturers
3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
-
product
3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
-
product
5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
-
product
Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
-
product
Dual Projection 3D In-Line Solder Inspection System
KY8030-2
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
-
product
3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
-
product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
-
product
3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
-
product
Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
-
product
Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
-
product
SPI Isolators
SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
-
product
3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
-
product
3D AOI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
-
product
3D Scanner
Artec Leo
The first 3D scanner to offer onboard automatic processing, Artec Leo is able to provide the most intuitive workflow, making 3D scanning as easy as taking a video. As you scan your object, see the 3D replica being built in real time on Leo’s touch panel screen. Rotate the 3D model, check if you have captured all areas, and fill in any parts you may have missed.
-
product
SPI | AOI | AXI
Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
-
product
3D Audio Servers
GoldSeries
AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
-
product
3D AOI Series
MV-9
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
-
product
3D Optical Profiler
Nexview™ NX2
Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
-
product
3D Scanner
Artec Space Spider
A new and enhanced precision instrument for CAD users and engineers, Artec Space Spider is a high-resolution 3D scanner based on blue light technology. It is perfect for capturing small objects or intricate details of large industrial objects in high resolution, with steadfast accuracy and brilliant color. The scanner’s ability to render complex geometry, sharp edges and thin ribs sets our technology apart. It is an ideal industrial 3D scanner for high resolution capturing of objects such as molding parts, PCBs, keys, coins or even a human ear, followed by the export of the final 3D model to CAD software.
-
product
3D Imaging Sensor
The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
-
product
3D Inspection Service
The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
-
product
3D Scanner
Artec Eva Lite
Eva Lite is the budget version of the bestselling white light Artec Eva 3D scanner. It features the same accuracy specs, but with reduced functionality: Eva Lite has geometry only tracking and capture. As a result, this affordable 3D scanner can be used for making high quality textureless 3D scans when scanning geometrically rich objects, such as the human body.
-
product
3D Bead Inspection
Increasing demands for product quality and, as a result, high-quality adhesive bonds are becoming ever more important in the automotive industry. With RTVision.3d from QUISS, it is now possible not only to measure the width, position, and continuity of the bead application but also its height. This provides insights into the applied material volume.
-
product
3D Microscope
BVM-5006
BVM-5006 Electric 3D Microscope features the quality optical system, high resolution, large field of view, high zoom ratio, novel design and one-up technology, easy and automatic operations. Includes: Motorized zooming, motorized observation angle for changing and optional motorized focusing. The speed can be adjusted while changing observation angle. With the angle attachment, the microscope can realize 3D image effects for observing the components and deep holes. The LED lights can generate high brightness. Theoretically the service life of LED lights can reach 20,000 hours. The LED lights with area control function can illuminate from different angles for convenient multi-angle inspections. The M-N3D Microscope can be widely used in micro-electronics, automated monitoring and testing industries. By selecting the appropriate objectives and video couplers, different magnification, field of view and depth of field can be acquired. Digital and Analog video systems can meet the different users' demands.
-
-
product
High-Resolution 3D Seismic Solution
PIKSEL
PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
-
product
3D Scanners
Pro
Capable of scanning objects of different shapes and sizes by changing the scanner's field of view (FOV). Due to the use of the structured light technology, professional RangeVision 3D scanners provide highly detailed scans of any type of object, from jewelry to large automobiles, with accuracy up to 0.018 mm and resolution up to 0.03 mm.
-
product
3D AOI Series
MV-6 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
-
product
Simple 3D Measurement & Inspection
XG-X Series Vision System
Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
-
product
3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
-
product
3D Sensor
C6 Series
The new 3D C6 series by AT is built on a novel sensor platform that supports the latest industrial standard GigE Vision/GenICam 3D at 1 Gbit/s. These new laser profilers offer an impressive combination of extremely fast and highly precise resolution, reaching up to 4,096 points per profile, a profile speed of up to 200 kHz, and high dynamic range 3D image capture. They are available as compact sensors, MCS, and 3D cameras.
