Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
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Product
IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Product
Meters For Contact Angle And Surface Tension
SURFTENS HL
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Optik Elektronik Gerätetechnik GmbH
Measuring instrument for contact angle and surface free energy, special solution for semiconductor technology for wafers up to 300 mm.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Dicing And Lapping Systems
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In semiconductor fabrication, clean die separation and smooth surfaces can make all the difference. While these steps might come late in the process, they play a major role in how well a device ultimately performs. Dicing and lapping bring the necessary level of precision to cut wafers into individual dies and polish surfaces so everything fits, functions and holds up the way it should in real world scenarios.
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Product
330 System
NSX
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With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Product
Probecard testers
MANAGER
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Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
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Product
Cryogenic Probe Station
FWPX
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Lake Shore’s FWPX probe station is designed for researchers who require large-size wafer probing. The FWPX accommodates wafers up to 102 mm (4 in) in diameter and can be modified to accept up to 152 mm (6 in) wafers. This general-purpose probe station is designed for researchers or engineers conducting material characterization tests over large samples. It is also an effective unit for measuring organic materials.
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Product
Discrete Devices High-speed Testing System
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QT-6000 discrete device high-speed testing machine is suitable for testing small and medium-power diodes, transistors, field effect transistors and other products and wafers. It can expand built-in capacitance testing (DC+CAP), EAS, VC, pA modules, as well as external LCR (ultra high precision capacitance testing), Scanbox, etc. The machine can be used for FT mass production testing or laboratory testing.
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Product
Four-Point Probe
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Materials Development Corporation
Materials Development Corporation offers the complete line of Four Point Probe systems from AIT. Systems are available to measue up to 12" diameter (300 mm) wafers as well as specialty systems for Photovoltaic wafers and substrates. For more information on these systems, contact MDC.
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Product
Epi Thickness & Composition System
Element
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The Element system is the tool of record for wafer suppliers for high speed impurity mapping and epi thickness measurement. It is the only tool on the market with the unique combination of transmission and reflection based technology. This system is the industry standard for dielectric monitoring.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Benchtop Discrete Component Tester
Imapact 7BT
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The 7BT Benchtop Discrete Component Tester is designed to test small signal and power semiconductor components in both single and multi-device packages or hybrids.. The 7BT automatic test system can be used in all test applications including incoming inspection, wafer probe, QC, engineering, production, final test, and high reliability.
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Product
Silicon heavy-doped Tweezer Tester
HS-MRTT
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Mini resistivity tweezer tester is used to check heavy-dope silicon. adaptable for little granular material, little broken IC Wafer and other little silicon material. When the resistivity is lower than the set value, it will make alarm.
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Product
Wafer Probe Loadboards/PIB
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DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Product
Semiconductor & Flat Panel Display Inspection Microscopes
MX63 / MX63L
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The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you need to tailor the system to your application. These ergonomic and user-friendly microscopes help increase throughput while keeping inspectors comfortable while they do their work. Combined with OLYMPUS Stream image analysis software, your entire workflow, from observation to report creation, can be simplified.
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Product
Pressure Switches
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Whitman controls offers the most diverse selection of pressure switches in the industry. Our diverse line of switches are used across a wide range of applications including blowers, generator sets, off-road vehicles, compressors, wafer ovens, process equipment, flow control devices, pumps, wastewater, heating and cooling systems, and numerous other applications across industries.
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Product
Wafer-Level Parametric Test
test
Wafer-level reliability engineers need to reduce test time without sacrificing measurement quality and accuracy.
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Product
Bond Tester for Wafers 2 - 12 inch
Sigma W12
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Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Product
Patterning Simulation
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KLA’s patterning simulation systems use advanced models to explore critical-feature designs, manufacturability and process-limited yield of proposed lithography and patterning technologies. Our patterning simulation software allows researchers to evaluate advanced patterning technologies, such as EUV lithography and multiple patterning techniques, without the time and expense of printing hundreds of test wafers using experimental materials and prototype process equipment.
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Product
Translating process images into significant tool-defect reduction
Trans-Imager
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Real-time, tool-specific defectivity data. Now there is a way to monitor defectivity on individual processing tools – automatically – in real-time. Microtronic’s new Trans-Imager software module is able to take high-resolution images directly from your processing equipment and immediately detect and displaymacro wafer defects – transferring all of that information into our powerful and long-proven ProcessGuard software which provides a wealth of defect management and analysis. This new capability is called ProcessGuard Xtensis (PGX) because it extends the power of ProcessGuard software to fab tools that previously had no way to detect defects. This provides an important new stream of defect data.
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Product
Superlattice Doping / ALD Services
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Alacron, Inc. is capable of processing sensor wafers on a contract basis to produce backside illuminated wafers sensitive in the UV and soft X-Ray region with an array of anti-reflective coatings based on licensed patented, (US 8,395,243 and US 8,680,637), technology from Jet Propulsion Laboratory (JPL).
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Product
Metrology System
IVS
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The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Product
Memory Test System
T5230
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T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Product
Sorters
Spartan™
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The unified wafer management system gives the Spartan™ Sorter the minimum scale and complexity required to accomplish its core job – to move wafers as cleanly and as quickly as possible. The Spartan Sorter offers improved reliability and maximized efficiency, while delivering industry-leading cleanliness with the lowest particle levels.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Product
ESD Test System
58154 Series
Test System
ESD (Electrostatic Discharge) Test Systems are PXI/PCI controlled module to simulate electrostatic discharge pulse during electronic device testing. The 58154 series offer both ESD STM5.1-2001-Human Body Model and ESD STM5.2-1999-Machine Model. The user friendly software offers programmable and flexible features, such as sampling test on a wafer, ESD model, ESD pulse polarity, ESD pulse interval in a sequence, and automatic testing function.
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Product
Wafer Analyzer
RAMANdrive
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RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
