Filter Results By:
Products
Applications
Manufacturers
Solder Ball
-
product
Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
-
product
Socket Accessories (SMT Options)
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
-
product
Grypper G35 / G40
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
-
product
BGA SMT Adapters
Giga-snaP™
Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
-
product
Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
-
product
Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
-
product
Grypper "Y"
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
-
product
Solder Test Pallet
WaveRIDER® NL 2
The wave soldering process is one of the most challenging procedures to set up. The ECD WaveRIDER NL 2 greatly simplifies wave solder set up and ensures perfect repeatability, time after time. Board recipe preheat temperatures, conveyor speed, wave height, contact times and parallelism are all measured and monitored using the WaveRIDER NL 2 process pallet.
-
product
Solderability Tester
LBT210
Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
-
product
Reflow Soldering Machines
Shenzhen Leadsmt Technology Co.,Ltd
Used to attach surface-mount components to printed circuit boards (PCBs). It involves applying solder paste to specific locations on a PCB, placing the components on the paste, and then heating the assembly in a reflow oven.
-
product
Ball Pressure Tester
CX-Q02
Shenzhen Chuangxin Instruments Co., Ltd.
IEC60695 Ball Pressure Tester is used for testing parts of non-metallic materials for resistance to heat.
-
product
Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
-
product
SparkFun Solder-able Breadboard
This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
-
product
SparkFun Solder-able Breadboard
This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
-
product
Solder Paste Printers
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
-
product
High-speed 3D Solder Inspection Machine
YSi-SP
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
-
product
Solder Cup Connector Kit
Y1139A
Used to build custom cables for 34921/23/25/31/32/33/37/38 –50-pin Dsub female – 125 V
-
product
SparkFun Solder-able Breadboard
Large
This is the Large SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our full-size breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
-
product
Open-Frame Collet Socket with Solder Tail Pins
Series 518
Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
-
product
68-Pin Micro-D Male Solder Bucket With Backshell
40-962B-068-SB-M
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
-
product
160-Pin DIN41612 Connector, Solder Pin, Male
40-960-160-M
Suitable for users to create their own cable assemblies, this product can be supplied with or without the backshell. For applications in LXI products where 4 connectors are used in a horizontal row if the user requires all connectors to have a second fixing then the connector can be fitted with an optional screwlock assembly.
-
product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Used to solder Mini Coax Solder Sleeve contacts.
-
product
Ball Pressure Test
Premier Electrosystems' Ball Pressure Test is used to determine dimensional stability under stress at elevated temperatures. It analyses the relationship between the degree of deformation and the temperature when the test specimen is subjected to a constant load.
-
product
37-Pin D-Type Male Solder Pin HV
40-960-037-M-HV
This connector is designed to allow users to directly terminate cables with soldered connections.
-
product
Replacement Solder Tip Leadset for Use with D420/620
Dx20-SI-HiTEMP
The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.
-
product
Solder Cup Connector Kit
Y1142A
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
-
product
Heavy Load Ball Screw with Caged Ball Structur
HBN
Heavy Load Ball Screw with Caged Ball Structure. Heavy load ball screws with the caged ball structure (HBN model) drastically improve the rated load compared to the conventional products by utilizing the optimum internal structure for use in heavy load condition. In this model, the caged ball structure is adopted between balls to eliminate collisions and mutual frictions of the balls and improve the lubricant maintenance. This modification brings about a longer lifetime under heavy load conditions.
-
product
68-Pin SCSI Micro-D Female Solder Bucket
40-962-068-SB-F
This connector is designed to allow users to directly terminate with soldered connections to the 68-Pin SCSI Style Micro D connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
-
product
Solder Cup Connector Kit
Y1141A
Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
-
product
Ball Pressure Test Device
ZBP-T
Made up by the related item according to IEC60695, IEC884-1, GB/T5169.21-2006, GB4706.1-2005, GB2099.1-2008, etc. • R = 2.5mm Pressure: 20N • Base with thermocouple hole • Material: 304 stainless steel
