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Product
Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Product
LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Product
K-Band Silicon SATCOM Rx Quad Core IC
AWS-0102
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The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Product
Receivers
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Macom Technology Solutions Holdings Inc.
MACOM's receivers are widely used in point-to-point radio, aerospace and defense, and other broadband communications applications. Operating between the 4.5 - 45 GHz frequency range, our receivers feature an integrated LNA, mixer and LO buffer amplifier onto a single chip. Available in lead-free QFN or SMD packages, our receivers boast excellent noise figure and conversion gain performance.
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Product
High-density Power Drivers
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Gate drivers, FETs and protection circuitry integrated into a single package to drive loads in industrial and home-appliance applications, with increased power density per cm². ST’s high-density power drivers are System in Package (SiP) solutions integrating in compact QFN packages the STDRIVE gate drivers and MOSFET-based power stages, responding to the industrial market trend towards higher levels of integration and lower development costs.
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Product
High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
