Sockets
receive conductors.
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Product
Smart Sockets
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Ironwood Electronics extended its high performance socket product line with smart features. Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter. Our sockets can be integrated with electronics counter into the compression mechanism of the socket lid. A push button is exposed on the compression plate. Every time a chip is compressed, push button is actuated which in turn activates the electronic circuitry inside the lid. These activations are counted by the counter IC and displayed in LCD. Let’s say a contact element is rated for 2K insertions. After 2K insertions, this contact element will be replaced by new contact element. Now, the counter has to start the counting from the beginning. To achieve this function, a reset option is included in the electronics circuitry. When reset is actuated, LCD display will go to “0”.
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BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Product
GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
4G Concurrent Device Programmer for PC /USB (4 sockets)
ProMax 4G
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ProMax is the most innovative and cost effective 4- or 8-gang programming solution on the market. ProMax supports a wide variety of programmable devices. Its state-of-the-art technology and high-speed programming algorithms optimize throughput, reliability and yields.
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Dual Intel® Xeon® E5-2600 v3 Family 40G Ethernet AdvancedTCA® Processor Blade
aTCA-9710
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- Two Intel® Xeon® processor E5-2600 v3 family (12C/24T)- 16 memory sockets support DDR4-2133 REG/ECC VLP RDIMM up to 256 GB- Intel® C612 PCH- Dual Intel® XL710-AM2 40GBASE-KR4 Fabric Interface channels- Support Intel® DPDK and Node Manager 3.0
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3.5” Embedded SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, LVDS, HDMI, 2 GbE LANs And Audio
CAPA313
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The CAPA313 is powered by the Intel® Pentium® processor N4200 or Intel® Celeron® processor N3350 (codename: Apollo Lake). This 3.5" embedded board was designed for operational stability in harsh environments with a wide operating temperature range from -20°C to +70°C. It offers a wide range DC input of 12V to 24 for various industrial environments. It also comes with rich I/O connectors, stunning graphical performance and an emphasis on expandability. In addition to one 204-pin DDR3L-1867 SO-DIMM socket supporting system memory up to 8GB, the CAPA313 has one PCI Expess Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connection. The compact-size embedded board comes with one RS-232/422/485, one RS-232, two USB 2.0, four USB 3.0, eight-channel digital I/O, audio, LVDS, HDMI, VGA (optional) and dual Gigabit LANs with Intel® i211AT Ethernet controller. It also features one SATA-600 socket and one mSATA interface for storage devices. To ensure reliable operation, the 3.5” embedded SBC supports watchdog timer and hardware monitoring features.
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Product
PXI/PXIe Power Relay Module, 16xSPDT, 5 Amp, 50-Pin D-type Connector, With Interlock
42-158-103-HI
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The 40/42-158-103-HI is a PXI/PXIe high density power relay module with 16xSPDT switches rated at 5A and includes the hardware interlock option. User connection is via a 50-pin D-type male connector, hardware interlock is via a 4-pin 00 series socket (mating plug is supplied).
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Product
Kelvin Test Contactor
cCompact
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cCompact™ test contactor offers a reduced site-to-site pitch concept enables high parallel test for power applications on strip test and pick and place handler platforms.Featuring compact Kelvin footprint with outstanding CRES stability by Denmark pin material. Automotive temperature range -60°C to +175°C. Integrated Socket Air-distribution.
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Breakout Box for Easy Access to PXI-501 Functions
PXI-501 ACS-001
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The PXI-501 ACS-001 is an extension for the PXI-501. It provides 4mm sockets do directly connect a DUT to the PXI-501 source and measurement functionallity. It’s especially recommended for laboratory environments and debugging purpose.
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Product
3 Digit LED Voltmeter
DPM 340
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The DPM 340 is a 3 digit LED voltmeter with 8mm (0.31") digit height. It features 200mV d.c. full scale reading, auto-zero and auto-polarity. The meter plugs directly into a SIL socket or can be snapped into a panel. Connection to the meter is via a single row of pins
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Product
Products for High-Frequency Measurement
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This product range includes passive high-frequency test probes and accessories as well as touch-protected BNC plug connectors, insulated BNC panel-mount sockets, leads with RG58 or RG59 cable, adapters and converters. Our test probes are suitable for use in CAT III- and CAT IV environments (Measurement Categories), such as the analysis of house and building installations with mains analysis/mains monitoring devices. Our high-frequency accessories are designed with clearance and creepage distances in accordance with IEC/EN 61010-031.
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Socket Phone
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Design for phone device test and system verify.Phone device: CPU,flash,baseband,LPDDR,power IC.etcPitch range from 0.30 to 1.27mmKey material: PEI,Peek,Torlon,PPS.etcContact with top pogo pin
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Robust Din-rail Fanless Embedded System With RISC-based (iMX-287) Processor 4 COM, 2 CAN Bus And DIO
rBOX610
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The rBOX610 din-rail fanless embedded system utilizes the low power RISC-based module (iMX-287) processor and is designed to withstand temperatures ranging from -40°C to +70°C for using in extreme operating environment and industrial automation applications. The rBOX610 box PC features 4 RS-232/422/485 serial ports, dual LANs, 4 digital input channels,4 digital output channels, 2 CAN bus and 1 eMMC onboard 4 GB & 1 x SDHC socket for storage expansion (easy to access) in a compact, IP40 protected, industrial-strength robust case. Two power paths input minimize the risk of data loss in the event of a single power failure. Its vertical din-rail form factor makes it easy to install the system in a small cabinet. Due to the RISC-based architecture, rBOX610 will not generate a lot of heat while being operated. The ready-to-run rBOX610 is specially designed for remote control/monitoring management applications like unmanned control room, industrial machine, automatic parking lot, traffic cabinet and more.
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COM Express Type 2 Basic Module With Intel® Celeron® Processor J1900/N2807
CEM841
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The CEM841 computer on module is based on the ultra-low power Intel® Celeron® processor J1900/N2807 which provides impressive CPU and graphics performance improvements. The CEM841 is equipped with double deck DDR3L SO-DIMM sockets supporting system memory maximum up to 8 GB. Coming with 8 PCI Express lanes, the power efficient system module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs and HMI and industrial automation controllers.
