Sockets
receive conductors.
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Product
Sockets
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Ironwood Electronics Sockets – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP)– Compressible silver button in polyimide (GT/GTP)– Surface mount adapters for sockets (SF)
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Product
Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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Product
Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Evaluation Modules And Sockets
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Figaro USA offers a wide range of evaluation modules and sockets for test use.
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Product
Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Product
Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Product
Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Product
Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Product
QFN Sockets
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With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Product
High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Product
LGA Sockets
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We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Product
Custom Sockets
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Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Product
Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Product
GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
BGA Sockets
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Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Product
Qualification Hardware & Sockets
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Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include: HTOL Boards (Mother and Daughter cards) Burn-In Boards HAST Boards THB (humidity) Boards Burn-In Modules and frames Dynamic Driver cards (Digital, Analogue and Mixed signal) Back Planes Voltage regulator cards Custom electro-mechanical assemblies DUT Cassettes and test Fixtures
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Product
Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Product
Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Product
Socket with Collet Contacts
Correct-A-Chip
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Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Product
Socket Accessories (SMT Options)
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The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Product
Industrial USB 3.0 Tester
M5615B
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International Microsystems Inc.
The M5615 tester is a 16 Socket Bench top Production and Engineering Tester that supports USB 3.0 Super Speed and USB 2.0 High Speed devices. The tester comes with a built-in PC running a full Linux operating system that tests and copies any USB storage device including USB Hard Drives at super speeds.
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Product
Socket-Tester
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A socket tester is a portable electrical instrument used to test for correct operation and wiring standards on power outlet sockets. It is typically a hand-held instrument that either plugs directly into the socket with pins mounted on the tester or comes equipped with a short lead and plug. Depending on the sophistication of the socket tester, a range of status indications may be returned including disconnected phases, reversed phases, and, in the case of a top end instrument, earth loop impedance. Most testers display test results on an array of light emitting diodes (LEDs), and some also allow for an earth leakage test to be carried out with the push of a button. Socket testers are available for most common industrial and domestic voltages and pin configurations.
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Product
3.5” Embedded SBC With 4th/5th Generation Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® HM86 (Intel® QM87 Optional), LVDS/ VGA/Dual HDMI,Dual LANs And Audio
CAPA881
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The CAPA881 3.5-inch embedded board supports the 22nm 4th generation Intel® Core™ i7/i5/i3 processors (codename: Haswell) with Intel® HM86 or Intel® QM87 chipset (optional). The 3.5-inch single board computer comes with a DDR3L SO-DIMM socket up to 8 GB. The highly integrated 3.5-inch embedded board features high performance, graphics, power efficiency, security, and remote management capabilities (Intel® AMT), making it ideal for a broad range of intelligent systems such as embedded applications, gaming, DSA, DVR, IoT/M2M-related, network computing, and many more.
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Product
Mini-ITX SBC With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® H81, HDMI/VGA/LVDS, Dual LANs And USB 3.0
MANO881
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The MANO881 Mini-ITX motherboard with Intel® H81 Express chipset supports the 4th generation Intel® Core™ and Celeron® (Haswell) processors. This feature-rich Industrial SBC has two sockets for DDR3 system memory of up to 16 GB. The high-performance mini-ITX motherboard MANO881 supports one PCIe x16 slot and integrated with Intel® HD 5000 graphics supports powerful graphic processing and dual-display capability through HDMI, VGA and LVDS interfaces. The outstanding embedded board also includes rich I/O expansions which can help system integrators to develop solutions quickly at a more competitive price. The MANO881 is excellent for in-vehicle PCs, medical imaging and gaming devices, in-flight entertainment systems, industrial automation systems, and other portable devices.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® H110
OPS500-501-H
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The OPS500-501-H is an OPS compliant digital signage player supporting dual displays with 4K at 60Hz resolution. The smart cableless open pluggable digital signage module is powered by the latest 7th/6th generation Intel® Core™ and Celeron® processors (codename: Skylake) with the Intel® H110 chipset, providing outstanding performance at a lower cost. It supports LGA1151 socket-type CPUs to offer greater flexibility for CPU selection. In addition, the OPS signage module has one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB memory capacity. The high-performance OPS500-501-H is a perfect solution for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center, and many more.
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