Sockets
receive conductors.
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Product
Package Probe
Test Socket
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Jigs for testing the electrical characteristics of devices in the final testing stage after LSI package assembly.To match the increasingly high functionality of LSIs for communications and networks, such as mobile phones and mobile devices, we provide two types of test sockets: The "J-Contacts" series suited for high-frequency, high-performance devices, and the "BeeContacts" series, spring probes with a unique structure that delivers excellent contact stability.
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Product
Detector, Metal, Power, Stud
72-6792
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*Electronically locates hidden cables gas and water pipes*Traces hidden ceiling joists and wall studs*Senses presence of mains power withut touching live wires*Locates breaks in circuits and cables*Identifies faulty plugs switches and sockets*Incorporates audio signal and indicator light
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Product
M-Module Carrier for CompactPCI (3U)
i3000
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The i3000 M-module Carrier for CompactPCI features a 3U form factor CompactPCI gateway to the M-module interface. One M-module mounting socket is provided by this carrier. This carrier can be used in temperatures from -40°/+85°C. The M-module interface of the i3000 complies to the M-module Specification ANSI/VITA 12-1996. The interface features A8, A24, D16 and D32 access types.
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Product
PCIe 4.0 Protocol Analyzer
Summit T48
Protocol Analyzer
Teledyne LeCroy’s Summit™ T48 joins the Summit™ T416 as the second protocol analyzer to be released in its family of tools supporting the PCIe 4.0 architecture. The new Summit™ T48 protocol analyzer based on the PCIe 4.0 specification supports up to 16GT/s and up to x8 lane width for protocol analysis. Companies that are interested in testing PCIe 4.0 based I/O cards such as Storage Controllers, Ethernet, Fibre Channel, Infiniband, and others will now be able to get all of the protocol analyzer debugging features they need, while being able to better manage their costs. SSD storage applications will also benefit from the integrated support for SSD bus protocols such as PCIe/ NVMe/ SMBus/ NVMe-MI/ TCG and others. When combined with Teledyne LeCroy’s Summit™ Z416 protocol exerciser, the Summit™ T48 will provide a deeper understanding of test results on a variety of test configurations. Teledyne LeCroy’s wide range of high speed interposers and probes provide full flexibility and connectivity to CEM and other form factor sockets on system boards as well as solder down and mid-bus probes.
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Product
Embedded Transceivers
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Embedded transceivers are chip-sized components based on 850 nm VCSELs and offer bandwidth up to 300 Gbps for short reach applications (<300 m). These transceivers can be soldered or socketed to a printed circuit board and are well suited for small, compact systems requiring high I/O density, low power, and small space. Many of these transceivers have been qualified to operate in harsh environments, such as the ones found in space, and aerospace and defense applications.
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Product
DDR
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These sockets are designed for standard DDR & GDDR type devices, including the newer configurations.
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Product
GFCI Socket Tester
ST120
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The Fluke ST120 GFCI Socket Tester checks that each wire in the outlet is properly connected to the building's electrical system. Via the bright LEDs and included chart, you can quickly and easily verify the wiring of an outlet. Able to identify several common wiring errors, including reversed phase and neutral wires and an open ground, the ST120 will give you confidence on your next job.
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Product
Inverter Socket
Series 6621
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Inverter Sockets. Inverted configuration allows the socket to be wave soldered on the component side of the PCB and the device socketed through a window on the solder side of the PCB. Available on .600 [15.24] centers. Consult factory for other sizes.
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Product
Automotive Contactor
Pad Series
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Johnstech International Corporation
Automotive Contactor is just the product you’re looking for! This Xtreme Temperature (XT™) capable product is designed to maximize your test results, regardless of your tri-temp testing objectives! Even if you are not testing outside the temperature limits of standard Contactors and sockets, the robust design of the XT™ Contactor provides additional design margin and certainly satisfies even your roadmap requirements.
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Product
2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC962-512-FL
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The IPC962-512-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) with the Intel® Q170 chipset. It is equipped with dual DDR4-2133 SO-DIMM slots with up to 32GB system memory. The ultra-compact industrial computer supports two swappable 2.5" HDDs; moreover, it offers flexible expansion options with one I/O module slot and two PCI/PCIe slots. It also has a wide operating temperature range of -10°C to +60°C and a 24VDC (uMin=19V / uMax=30V) power input for severe environments. According to the features above, this rugged IP40 industrial PC is a great choice for a wide variety of Industrial IoT applications including automatic optical inspection, digital signage, motion control, and factory automation.
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Product
JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
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The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Product
Compact Fanless System With 10th Gen Intel® Xeon®/Core™ I CPU Socket (LGA 1200)
MIC-770 V2
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Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipsetWide operating temperature (-10 ~ 60 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1)2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports Advantech i-Modules, FlexIO and iDoor technology, flexible configure additional HDMI, DVI, Comport, DIO, Remote switch IOVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)Microsoft Azure PnP, AWS IoT Greengrass, Ubuntu CertifiedRED Compliance
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Product
Modular TPC - Computing Box Module With Intel® 12th/13th/14th Gen./BTL S Core™ I CPU Socket (LGA1700)
TPC-B620
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High Performance Computing Box powered by Intel® 12th/13th/14th Gen. Core™ i / BTL Core™ S-series CPUs Socket (LGA1700) with fanless design10+ x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR5) support up to 64GB in totalComprehensive I/Os, including 4 x USB, 2 x COM, 3 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x PCIe x4 or PCIe x2, 4 x M.2 (NVMe, SATA, WIFI)Supports Storage via 2 x M.2 2280 SATA SSD (RAID 0/1), 1 x M.2 NVMe SSD (2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
Embedded Platform
ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Product
Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
Compact Fanless AMR/MMR Controller System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-760
Controller
High-performance computing powered by Intel® 12th/13th/14th Gen Core™ i CPUFanless design ensures reliable operation in environments up to 60°CIsolated DIO, CANbus and Serial ports guarantee for industrial communicationContact 8KV/Air 15KV IV level ESD protection , ClassB for EMI design, best choice for industrial environment3 Ethernet and 4 USB3.2 (5Gbps) for Camera and Lidar connectionIndustrial WiFi design enables fast roaming at 36msCompact size ensures easy installation for AMR/MMRBuilt on Ubuntu 22.04 and Advantech Edge Linux, with ROS2 package readinessROS2 package enhances industrial automation capabilities including EtherCAT and Modbus node support
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Product
Compact Fanless System With 8th/9th Gen Intel® Core™ I CPU Socket (LGA 1151)
MIC-770
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Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipsetWide operating temperature (-10 ~ 50 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.02 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports 2 x LAN, isolation COMs, and 32-bit GPIO modulesSupports Advantech i-ModulesSupports Advantech SUSIAccess and embedded software APIsVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3200-CF Series
Embedded Platform
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additiotal Molex 4 pin power cable (12V/1.5A and 5V/2A) support
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3100-CF Series
Embedded Platform
- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM) and 5x Intel® i210-AT
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Product
Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H310 And TPM 2.0
OPS500-520-H
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The OPS500-520-H is powered by the newest 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (code name: Coffee Lake S) with the Intel® H310 chipset. The smart cableless digital signage module has two DDR4-2400 SO-DIMMs for up to 32GB of system memory. Axiomtek's OPS500-520-H supports the LGA1151 socket-type processors offering greater flexibility for CPU selections, which is easily configured to meet various performance requirements. The OPS signage module is connected to OPS-compliant display via a standardized JAE TX-25A plug connector interface which supports DisplayPort, HDMI 2.0, USB 2.0, USB 3.1, audio and UART signals. It also has one M.2 Key E for Wi-Fi modules and one M.2 Key M supporting PCIe, SATA and SSD interfaces for storage. We believe that this new smart cableless open pluggable signage module with simplified installation, maintenance and upgrade can help you develop creative display solutions that increase your sales and improve your customers' experiences. With the enhanced multimedia performance, the Intel® Coffee Lake S-based OPS500-520-H is well suited for a wide range of digital signage applications in retail, transport, entertainment, education, and more.
