Sockets
receive conductors.
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Product
Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Product
Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Product
Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Product
BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Product
Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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Product
Test Sockets
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Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Product
Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Product
Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
Test Sockets
MEMS Device
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Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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Product
Evaluation Modules And Sockets
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Figaro USA offers a wide range of evaluation modules and sockets for test use.
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Product
Test Socket Lids
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For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
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Product
Ethernet To Modbus RTU Interfaces
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ICS's Ethernet to Modbus Interfaces provide Modbus TCP/IP to Modbus RTU serial conversion and Raw Socket (Telnet) to control Modbus RTU Slave Devices. Available in small Minibox™ and OEM board formats. OEM board has Ethernet, GPIB and USB interface ports. All Interfaces include the VXI-11 protocol for use with: LINUX, UNIX, SunOS, Apple OS X, HP-UX, IBM-AIX and Windows 2K or later Windows systems.
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Product
Industrial Connectors / Han®
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Rugged, rectangular, heavy-duty plugs and sockets used to reliably transmit power, signal, and data in harsh industrial settings, enabling modular machine setups with easy connect/disconnect for power, data, and even pneumatics in one compact system.
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Product
Package Probe
Test Socket
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Jigs for testing the electrical characteristics of devices in the final testing stage after LSI package assembly.To match the increasingly high functionality of LSIs for communications and networks, such as mobile phones and mobile devices, we provide two types of test sockets: The "J-Contacts" series suited for high-frequency, high-performance devices, and the "BeeContacts" series, spring probes with a unique structure that delivers excellent contact stability.
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Product
COM Express Type 10 Starter Kit Plus
COM Express Type 10 Starter Kit Plus
Software Development Kit
The COM Express Type 10 nanoX Starter Kit Plus consists of a COM Express Type 10 core module reference carrier board that provides two PCIe Mini Card slots, 2 RJ-45 LAN ports, 2x USB 3.0, 2x USB 2.0, 1x USB client, 2x DB-9 COM, 1x SD card socket, and Mic/Linein/ Line-out. ADLINK also provides additional development tools including a verified 10.1" LVDS panel (optional), power supply, thermal solution and cabling accessories.
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Product
Fibre Channel Test & Simulation Interface for PCI-X
PCI-X-FC4
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Avionics Interface Technologies
Supports Point-to-Point, Switched Fabric, and Arbitrated Loop topologies - Two independent Fibre Channel ports - Two SFP sockets accept fiber or copper transceivers - Each port supports 1, 2, and 4 Gbps speeds - Comprehensive decoding of FC-1, FC-2, and Upper Layer Protocol (ULP) frames - Full Error Injection and Detection - IRIG-B Time Code Encoder/Decoder for Data Correlation - In-line Port Configuration for Transparent AnalyzerSupports multiple ULPs including FC-AE-ASM, FC-AE-RDMA, FC-AE-1553, and FC-AV - Compatible with AIT’s fcXplorer GUI Bus Analyzer Software
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Product
Polyphase Socket Tester
K-281
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Knopp’s K-281 Polyphase Socket Tester is designed to detect backfeed conditions, grounds, short circuits and wiring errors in either a 120/240, 120/208 or 277/480 volt meter socket. It is equipped with high intensity Power Lights and Fault Lights to show whether or not the meter is safe to set. The Polyphase Socket Tester also comes with a heavy duty handle for quick and easy installation.
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Product
8.25mm (0.32") Digit Height
DPM 2AS-BL
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The DPM 2AS-BL is an ultra-miniature 31/2 digit LCD voltmeter with 8.25mm (0.32") digit height and LED backlighting. It features a negative rail generator which enables the meter to measure a signal referenced to its own power supply GND. The meter plugs directly into a SIL socket or can be snapped into a panel. Connection to the meter is via two rows of pins
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Product
PICMG 1.3 Half-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, SATA3, USB 3.0, DVI-I/LVDS And Dual LANs
SHB230
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The SHB230 is high-performing PICMG 1.3 half-size single board computer.The SHB230 based on the Intel® Q87 PCH is designed to support 4th Generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Haswell/Haswell Refresh) in the LGA1150 socket.The slot CPU card is equipped with two DDR3-1333/1600 SO-DIMM sockets with up to 16 GB memory capacity to meet customers needs.The PICMG 1.3 specification brings advantages of PCI Express to this single board computer that offers four PCIe x1 or one PCIe x4, and one PCIe x16 routed to the backplane.The onboard two SATA interfaces support RAID 0/1 functions to ensure reliable storage for multiple applications.Utilizing with the latest Intel® technologies, this PICMG 1.3 system host board is an ideal solution for DVR, medical equipment, industrial automation, process control, and network security market.
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Product
M-Module Carrier for VMEbus (6U)
i4000
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The i4000 is a 6U form factor M-module carrier for the VMEbus and forms the basis of a flexible I/O system. It offers the user a means of integrating a mix of M-modules in a VMEbus system. Four M-module mounting sockets are provided by this carrier.The interrupt controller on the i4000 has an interrupt vector register for each M-module interface.
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Product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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Product
Kelvin Test Contactor
cCompact
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cCompact™ test contactor offers a reduced site-to-site pitch concept enables high parallel test for power applications on strip test and pick and place handler platforms.Featuring compact Kelvin footprint with outstanding CRES stability by Denmark pin material. Automotive temperature range -60°C to +175°C. Integrated Socket Air-distribution.
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PXI/PXIe Power Relay Module, 25xSPST, 5 Amp, 50-pin SGMC Connector, With Interlock
42-153-003-HI
Relay
The 40/42-153-003-HI is a PXI/PXIe high density power relay module with 25xSPST switches rated at 5A and includes the hardware interlock option. User connection is via a 50-pin SGMC male connector, hardware interlock is via a 4-pin 00 series socket (mating plug is supplied).
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Product
2U Rackmount Network Appliance Platform With Dual LGA3647 Socket Intel® Xeon® Scalable Processors, Intel® C621 (Purley) And Up To 66 LAN
NA860
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The NA860 offers a perfect mixture of performance, flexibility, and durability with server-class dual LGA3647 socket Intel® Xeon® Scalable processors and Intel® C621 chipset (codename: Purley). It is robust and highly reliable for use in a wide range of network applications such as SDN, NGFW, IDS, IPS, UTM, etc. Designed with flexibility in mind, the 2U rackmount network computing system is capable of managing numerous connected computers through an integration of up to eight expandable NIC modules which support a maximum of 66 LAN ports. These NIC modules feature support for copper, fiber, bypass, 1G/10G/40G Ethernet speeds, and hardware acceleration. The NA860 comes with twelve high-capacity DDR4-2400 R-DIMM slots with up to 384GB non-buffer non-ECC/ECC memory. Moreover, there are two hot-swappable 2.5-inch SATA HDD trays, one mSATA slot and one optional 3.5-inch SATA HDD tray for sufficient storage. Two PCIe x8 expansion slots are available for add-in cards.
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Product
Socket with Collet Contacts
Correct-A-Chip
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Correct-A-Chip with Collet Contacts. Correct-A-Chip technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
