Lithography
nano fabrication of circuitry.
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Product
DUV Lithography Systems
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ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
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Product
Automated Measurement System
EVG®40NT
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The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
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Product
Laser Head
5517CL
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The Keysight 5517CL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Option 009 allows a larger angular range of measurement by providing a 9 mm beam diameter for use with three-axis interferometers. Please contact Keysight for custom requirements.
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Product
IDA Electrodes
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Interdigitated Array (IDA) electrode is an electrode developed for electrochemical measurements to be performed in a very small quantity of the sample. IDA electrode could be applied for the detection and reaction analysis of the compounds in a small quantity of the sample. IDA electrode is a microelectrode pattern fabricated by using the lithography technology. The Electrodes are composed of 65 pairs. In each one of the pair has a function of the oxidation and reduction electrodes.
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Product
Nanoimprint Lithography
NIL
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EVG is the market-leading supplier of nanoimprint lithography (NIL) equipment and integration processes. EVG pioneered and mastered NIL from a research approach more than 15 years ago, to implementation in volume production on various substrate sizes from 2 inch compound semiconductor wafers to 300 mm wafers and even on large-area panels. NIL is the most promising and cost-effective process for generating nanometer-scale-resolution patterns for a variety of commercial applications in bioMEMS, microfluidics, electronics and, most recently, various diffractive optical elements.
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Product
Reticle/Mask Particle Remover
RP-1
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The RP-1 automatically removes particles from the reticle/mask by air (or N2) and vacuum suction. Routinely removing the particles before the lithography process extends the replacement cycle of the pellicle and cleaning cycle of the mask, thereby contributing to a reduction in running costs.
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Product
2-26.5 GHz Traveling Wave Amplifier
1GG7-8045
Amplifier
The 1GG7-8045 is a broadband GaAs MMIC Traveling Wave Amplifier designed for high output power and moderate gain over the full 2 to 26.5 GHz frequency range. Seven MESFET cascode stages provide a flat gain response, making the 1GG7-8045 an ideal wideband power block. Ebeam lithography is used to produce gate lengths of ~0.3 mm. The 1GG7-8045 incorporates advanced MBE technology, TiPtAu gate metallization, silicon nitride passivation, and polyimide for scratch protection.
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Product
Electron Beam Lithography System
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Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.
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Product
Breakthrough compressors for the GDSII and MEBES formats
GDZip + MEZip
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Recognizing the challenge to transfer, manipulate, and store the exponentially-increasing size of IC design files, Solution-Soft has developed gdzip and mezip, breakthrough compressors for the GDSII and MEBES formats used by the industry. The MEBES format is the most commonly used format for electron beam lithography and photomask production. The GDSII stream is the standard exchange format between the design world and the mask shops.
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Product
UV Meters
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OAI’s UV Measurement Instrumentation are the standard for Semiconductor Lithography, MEMS, Sensors, Microfluidics, UV Curing, 3-D Printing, Sterilization, Water Purification and Solar/PVC industries. For over 45 years our meters have earned a reputation for accuracy, repeatability and dependability. We offer full calibration and support services worldwide.
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Product
Nanostructuring
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AMO offers a highly flexible process-platform for the fabrication of nanostructures. We have a broad range of lithography techniques that can be flexibly combined with each other – including interference lithography. Each lithography technique is tailored to a specific pattern-transfer process and can be used on a wide range of substrates. In addition, we have developed an advanced nanoimprint lithography process that can transfer e-beam-defined patterns to large areas in a cost-effective manner.
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Product
UV-NIL / SmartNIL® Systems
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EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL), including different single-step imprinting systems, large-area imprinters as well as step-and-repeat systems for efficient master fabrication. Besides soft UV-NIL, EVG offers its proprietary SmartNIL technology with multiple-use polymer stamp technology. The efficient and robust SmartNIL process provides high pattern fidelity, highly uniform patterned layers and minimum residual layers, combined with easy scalability in wafer size and production volume. EVG´s SmartNIL redeems the long-term promise of nanoimprinting being a high-performance, low-cost and volume-capable manufacturing technology for mass production of micro- and nanoscale structures.
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Product
Laser Head
5517C
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The Keysight 5517C is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Option 009 allows a larger angular range of measurement by providing a 9 mm beam diameter for use with three-axis interferometers. Please contact Keysight for custom requirements.
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Product
Advanced Node Solution
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A major new challenge at 20nm/14nm is the requirement for extra masks (double patterning technology, or DPT) to make existing lithography work at this advanced node. Read 20 questions on 20nm - a Q&A document.
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Product
EUV Lithography Systems
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Using extreme ultraviolet (EUV) light, our NXE and EXE systems deliver high-resolution lithography and make mass production of the world’s most advanced microchips possible
