Integration
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Passive Component Integration - PXIe
Passive Series
The Passive PXIe module is a highly customizable PXIe module that can integrate the passive components of your choice.We can customize the Passive module with a wide range of passive components: WDM couplers, splitters, circulators, band-pass filters, PM beamsplitters, MUX, DeMUX and more.Our spec sheet contains a selection of popular configurations.Please contact us to discuss your specific requirements at sales@quantifiphotonics.com.
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Passive Component Integration - MATRIQ
The Passive is a highly customizable benchtop accessory that can integrate the passive components of your choice for convenient storage and integration into your test set up.We can customize the Passive module with a wide range of passive components: WDM couplers, splitters, circulators, band-pass filters, PM beamsplitters, MUX, DeMUX and more.Our spec sheet contains a selection of popular configurations.Please contact us to discuss your specific requirements at sales@quantifiphotonics.com.
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Systems Integration & Test
Watring Technologies, Inc. is an experienced, diversified high technology company proficient in total system integration services including test & evaluation, custom tooling design, and automated hardware validation and verification. We give customers access to a sole- source, multi-disciplinary staff of specialists offering turn-key solutions.
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Test Systems Integration
Highly flexible test solutions that are cost effective offering basic tests that easily adapts to high product volumes and complicated tests. Mobile computer based test stations provide a wide variety of test solutions at efficient costs.
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SSFDR Software Integration Rig
MS 1112
Software Integration Rig (SIR) is an Industrial PC based system is used to test the SSFDR (Solid State Flight Data Recorder) of SU30 Aircraft. SIR is a PXI based test platform and it is used to test independent and integrated software tests of the SSFDR.
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Integration of Flash / Controller Programming
Flash or microcontroller programming can be integrated in a wide variety of ways, depending on the type and scope of the application.
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ATE System Integration
Cyth Systems is a Systems Integration Company specializing in Automated Test (ATE), Embedded Controls, and Machine Vision. Our skilled and experienced team uses their natural talent for problem-solving to create solutions in a wide range of industries. We build our solutions starting with the National Instruments (NI) platforms including LabVIEW and PXI, and by adding best-in class sensors and components.
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IJTAG IP Integration Environment
Tessent IJTAG
To manage the complex requirements of testing a heterogeneous set of embedded IP, the industry developed IEEE P1687 (IJTAG). It standardizes a language for describing the IP interface and how IPs are connected to each other. It also introduces a language that defines how patterns that operate or test the IP are to be described. IEEE P1687 draws a clear line between what must be covered by the standard and what is better left to the ingenuity of the tool developers.
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Wafer Auto Line Integration
The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Integration Tool Suite
TurboDFT
TurboDFT contains a suite of very useful and powerful DFT integration tools. TurboDFT allows users to automatically integrate and stitch DFT cores, whether they are created using DFT tools from SynTest or other vendors
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Passive Component Integration
Integrate passive optical components of your choice such as WDM couplers, splitters, band-pass filters, PM beamsplitters and circulators. PXIe and benchtop models support SMF, MMF and PMF.
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Systems Integration (SIL) Lab Data Acquisition
Bloomy’s SIL data system allows testing and simulation of every system component on the aircraft. The functionality of these complex integrated systems are fully tested, debugged, and verified safely in the lab prior to flight testing. This reduces cost and schedule for new aircraft. Bloomy has applied its expertise to multiple SILs.
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Integration Test
We test the interfaces between the functions and modules and the time dependence between the different functions to ensure that they meet the specification determines by the Classification Tree Method (CTM)
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ESI(Electronics Systems Integration Unit)
MS 2004
The ESI subsystem provides platform interfaces like Gyro and on board Radar Blanking. This unit receives Analog and Digital GYRO inputs from ship and pre- trigger pulses from on board radars of the ship. This unit measures and provides the ship heading data to VARUNA ESM system. It also provides Heading, Roll and Pitch data to the ECM system. This unit also generates band wise composite ESM Rx. Blanking gates and provides all the required interfaces to ESM receiver, ECM System and System Controller units.
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System Integration
The provision of a basket of services for Auditoriums such as audio-visual systems, stage lighting, stage rigging, building control systems, communication systems and information technology systems. A proper understanding of the various disciplines involved is the key to successfully integrating the diverse component parts. The final solution must perform as one unit with a high degree of simplicity to the end-user. The result will be a solution that, while extremely complex, appears simple, logical and easy to use. Sri Comm has successfully designed, installed and commissioned several projects of this nature.
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Process Systems And Integration
For 50 years, Anton Paar has been pushing the limits in process sensor technologies, providing superior products in the fields of density, viscosity, O2, CO2, and refractive index measurement for a wide range of industries, including the beverage, chemical and petroleum industries. Now Anton Paar extends its product portfolio by offering complete process engineering solutions.
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PXI Integration Platform
ATS-3100
The new ATS-3100 enables you to rise above the module level and shift your focus to the sophisticated test solution you’re actually building. Simply add your instruments, software, and customization to create a complete solution. Or, if you're short on time or resources, ask Astronics Test Systems to do the finishing work for you.
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System Integration Services
Systems integration services to meet a wide variety of industrial needs. It includes the following key expertise: Desktop, Embedded Simulation and Real-time system, Data Acquisition and Report generation/extraction, Factory automation, Testing, Control and Monitoring system, Vision inspection, Equipment calibration, Special purpose machine, and many more.
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MMIs for Test and System Integration
Laying out a custom PCB is too time consuming and costly for most rush projects. Pulse Research Lab has developed Mini Modular Instruments ™ to provide cost effective solutions to the most common engineering challenges.
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Systems Integration for Circuit Card Assembly
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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24-Channel Digital I/O With Digital Integration Features On PCI Express Mini Card
mPCIe-DIO-24A
The mPCIe-DIO-24A is a type F1 PCI Express Mini Card (mPCIe) and optional cable assembly (D-Sub 37-pin Male connector) designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program. This also allows for simple and trouble-free migration from other ACCES PCI and PCI Express digital I/O cards, but also provides for advanced features enabled by the onboard FPGA logic.
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Time Delay and Integration (TDI) Line Scan Camera
Piranha HS
The Piranha HS cameras provide an alternative to traditional line scan imaging. They enable you to meet the line rates and responsivity necessary for your high performance applications and allow you to reduce the number of cameras in your system. When you use fewer cameras, you use fewer framegrabbers, lenses, computers and cables. The Piranha HS family delivers the lowest price/pixel TDI system solution ever offered by Teledyne DALSA. Lighting costs can also be reduced. With TDI imaging, you can use LED lights, helping you to optimize system up-time and productivity.
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In-Circuit Tester Integration
The benefits of boundary-scan are noticed in all phases of a product life cycle. By coupling the power of Corelis boundary-scan tools with an In-Circuit Tester (ICT), a complete, integrated solution is available that offers the best advantages of both technologies.Boundary-scan operates as the perfect companion to ICT. Boundary-scan is capable of testing areas of printed circuit board assemblies that are difficult to access due to physical space constraints and loss of physical access, which is often due to fine pitch components such as Ball Grid Array (BGA) devices. Conversely, the ICT is able to check the non-boundary-scan compatible portion of the unit under test (UUT) such as analog.
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Integration Spheres
Offers a wide range of integration spheres (0.25m to 3 m diameter) and spectrometer options, application-specific modules as well.
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Hydrogen Solutions for OEM Integration
H2scan’s breakthrough hydrogen sensing technology is available for integration into your product as an OEM assembly. Various options are available ranging from just a hydrogen sensor sub-assembly to a full-up product assembly.
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Dual Digital Aquisition System For Charge Integration And Pulse Shape Discrimination
DT5790
The DT5790 operates upon the DPP-PSD firmware, specially developed for Charge Integration and Pulse Shape Discrimination. DPP-PSD is based on an advanced on line Digital Dual Gate Charge Integration allowing an effective data analysis even at high count rate. It performs input signal baseline calculation, self-triggering and double-gate charge integration with programmable parameters, double integration of both prompt and total charge for Pulse Shape Discrimination and pedestal subtraction for energy calculation.
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Test Systems & Sub-systems Development and Integration
Research, development and the production of electronic test equipment, systems and subsystems for the industrial, scientific, and defense markets.
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Highly Integrated Optical Inspection
BOA
BOA is a highly integrated optical inspection tool for controlling quality and increasing productivity. It comprises all the elements of an industrial machine vision system in a tiny smart camera style package.
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Multi-Protocol Wireless Application Networking System with Open, Integrated, Secure & Scalable System for Data Aggregation & Viewing
Ion
Jacobs’ vendor agnostic architecture was designed and implemented with the goal of an open Industrial Internet of Things (IoT) solution. ion© adapts and applies technology that enables our customers to gain efficiencies and savings, through connecting our client’s sites then collecting and displaying data in a unified interface. This provides custom insights to our clients, empowering them to ensure safety and respond quickly. The Jacobs ion© solution has been operationally deployed for over a decade and enables innovative approaches for data accuracy, data timeliness, and safety — greatly improving information flow and productivity.
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Integrated Bonding Systems
EVG offers fully integrated and highly automated production systems for wafer bonding processes. A maximum level of automation and process integration opens the door to large-scale manufacturing and guarantees a proven transition of processes from R&D stage to production.
