BGA Inspection
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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PosiTector Inspection Kits
PosiTector Inspection Kits contain a PosiTector gage body (Standard or Advanced) and 3 probes – coating thickness, environmental and surface profile, as well as, accessories in a convenient hard shell carrying case.
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Automated Surface Inspection for Glossy Components
Flawlessly glossy surfaces are among the most important quality features of many premium products. The smallest surface defects immediately have a degrading effect on the product. The result: disappointed end customers or buyers. At the same time, reflective surfaces are often very sensitive and a challenge for optical metrology. A manual inspection is tedious, expensive, and ultimately always governed by subjective decision criteria. During production, faulty painting or coating processes can cause high scrap rates. Defects that are not detected even during the final inspection can lead to expensive complaints and, in the worst case, to the loss of the customer. Only an efficient, automated surface inspection achieves the highest quality at acceptable costs.
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Universal Paint Inspection Gauge
The byko-cut universal is a multi-purpose paint testing instrument that measures paint coating thickness, paint adhesion, and coating hardness.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Can Inspection
Whether they are 14oz cans, 28oz cans, 12oz bottles, or some other size or format – they typically all look fine, as they fly by on your production line or sit on pallets ready to go out to customers. The challenge is, most companies have some kind of sealing issue at some point. Tops go on crooked, lids don’t seal, vacuums don’t set right – and it’s nearly impossible to tell by physical or visual inspection.
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Inspects MEMS and Wafer Level Devices
NorCom 2020-WL
The NorCom 2020-WL is specifically designed for wafer-level inspection and leak tests up to 1000 devices per cycle. The system can inspect up to an 8” wafer on or off a saw frame. It is designed to test MEMS and other wafer level devices that have a cavity.
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2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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Fiber Optic Inspection Microscope
80761
The Miller 400x Microscope helps inspect fiber optic connectors quickly and easily. Its ergonomic design and built-in features make it ideal for field and lab use. The microscope features a pressure-activated on/off switch, focusing wheel, eyepiece, auxiliary white LED light source rated for 100,000 hours, adapter tip for inserting ferrule and battery compartment. Includes 2.5mm universal adapter cap and zipper case.
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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E-beam Metrology And Inspection
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Appearance Inspection
We perform quality assurance agency of customers' important products through inspection.
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Optical Inspection Machine
3D AOI
3D AOI latest optical inspection machine 1. No part dead angle, 4-way projection, complete measurement 2. Part height measurement, accurate measurement of defects 3. Multi-piece inspection without additional program 4. DLP digital projection, program editable height measurement
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Entry Level GPR System for Concrete Inspection
StructureScan Mini LT
Geophysical Survey Systems, Inc.
The StructureScan™ Mini is GSSI’s all-in-one GPR system for concrete inspection. This handheld system locates rebar, conduits, post-tension cables, voids and can be used to determine concrete slab thickness in real-time.
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Manual & Automatic Inspection systems
Manual and Automatic inspection systems mounted on vehicles such as motortruck, van, railway testing wagons etc. Operation is either on the move or during a stop. Ideal for inspecting transmission and distribution lines and for electric transportation.
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Complete Non-Contact Inspection System For OLED/TFT/LTPS
GX3/GX7
*Fastest*Workable to large panel as well as fine pattern of medium-small panel*Workable to large mother glass of every generation*Possible to dock width Repair Machine
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Luminescence Defect Inspection System
INSPECTRA® PL Series
This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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(AOI) Automated Optical Inspection Systems
For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Magnetic Particle Inspection Systems for Non-Destructive Testing (NDT)
VERIFY SURFACE AND SUBSURFACE STRUCTURAL INTEGRITY IN: Industrial Crankshafts, Ferrous Parts, Aircraft Components, Landing Gear Components.
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Foreign Matter Inspection Device For FPDs
HS-930
By adopting our original optical technology, we achieve an inspection speed of about 30% up (compared to HS-830). Improved the front / back judging ability to thin substrates.
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X-ray Inspection Of PCB Boards And More
The RTX Series
Glenbrook’s RTX Series of modular, real-time systems include models designed to meet a variety of production requirements including circuit board components. Numerous options make it easy to customize any RTX model to your specific application. All hardware and software elements are fully compatible to ensure the continued value of your equipment.
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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Laser Sherography NDT Sensor for Post-Production Quality Control or In-Field Component Inspections
FlawExplorer
The FlawExplorer is a laser shearography NDT sensor designed to be used for post-production quality control applications or in-field (in-service) component inspections. Depending on the application, the sensor can be configured with thermal or vacuum (partial) excitation systems and may also be automated. It incorporates the very latest in phase-shifting technology delivering accurate and reliable measurement results through clear and sharp imaging with sub-micrometer displacement resolution.
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Customized Electrical Test Optical Inspection
Landrex Technologies Co., Ltd.
Customized Electrical Test Optical Inspection
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DDR4 BGA Interposers, DDR4 DRAM X16 Packages
N2115A
The N2115A DDR4 BGA Interposers are soldered in between the DRAM and PC board or DIMM raw card where the DRAM would normally be soldered. They are designed with the PCB or DIMM foot print on the bottom side and the DRAM footprint on the top side. The signals from the memory controller chip and DRAM are then passed directly to the top side of the BGA probe adapter where they can be accessed with the oscilloscope probes.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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X-ray and CT Inspection Systems
YXLON X-ray and CT systems come in many different configurations. We've developed a Product Finder to help narrow your search for the system that best meets your needs. Can't find what you're looking for? Our specialists will customize a system to your exact specifications. Contact us today for more information.
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PDP Driver/Function Inspection System
SRV
*Greatly Reduced Testing Tact Time*Cutting-Edge Inspection*Easy Operation
