LGA
IC packaging designed to fit on an array of sockets or SMT soldered.
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Product
XYZ Color Sensor
AS7261
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Calibrated XYZ color sensor provides complete, integrated platform for handheld color analyzers, color calibration and mobile analysis devices. Tri-stimulus XYZ realized by silicon interference filters. UART or I²C slave digital Interface. 16-bit ADC with digital access. Programmable LED drivers. 20-pin LGA package 4.5mm x 4.7mm x 2.5mm, with built-in aperture. Compact true-color sensing. Applications; Color/CCT sensing, Fluid or reagent analysis, Color point comparison, Display calibration.
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Product
Compact Fanless AMR/MMR Controller System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-760
Controller
High-performance computing powered by Intel® 12th/13th/14th Gen Core™ i CPUFanless design ensures reliable operation in environments up to 60°CIsolated DIO, CANbus and Serial ports guarantee for industrial communicationContact 8KV/Air 15KV IV level ESD protection , ClassB for EMI design, best choice for industrial environment3 Ethernet and 4 USB3.2 (5Gbps) for Camera and Lidar connectionIndustrial WiFi design enables fast roaming at 36msCompact size ensures easy installation for AMR/MMRBuilt on Ubuntu 22.04 and Advantech Edge Linux, with ROS2 package readinessROS2 package enhances industrial automation capabilities including EtherCAT and Modbus node support
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Product
LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI
ASMB-976
Server Board
- LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor- DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory- 4 x PCIe x16 and 7 x PCIe x8- Intel® X550 dual 10GbE ports- Ten SATA3 and two M.2 connectors (SATA/PCIe compatible)- 0 ~ 40 °C ( 32 ~ 104 °F) ambient operating temperature range
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
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- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Product
Dual LGA 3647-P0 Intel® Xeon® Scalable Proprietary Server Board with 12 DDR4, 4 PCIe x16 + 1 PCIe x8+4 PCIe x4, 14 SATA3.0, 8 USB3.0, Dual 10GbE, IPMI
ASMB-975
Server Board
- Proprietary server board with dual Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 1.5TB, support Intel Optane DC Persistent Memory- 14 SATA3.0 connectors (including two M.2 2242)- Four PCIe x16 slots (Gen3) for double-deck cards- Intel® X557-AT2 dual 10GbE ports- 0 ~ 40 °C ambient operating temperature range
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Product
LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 5 PCIe x8 or 2 PCIe x16 and 1 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-815
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- ATX server board with Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Five PCIe x8 or two PCIe x16 and 1 PCIe x8- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 60 °C ambient operating temperature range
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
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- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI
ASMB-816
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- LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor- DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory- Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1- Intel® X550 dual 10GbE ports- Eight SATA 3 and one M.2 connectors (SATA/PCIe compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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Product
Up Converters
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Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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Product
Stamped Spring Pin Sockets
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Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Product
Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Product
Compact Fanless System With 8th/9th Gen Intel® Core™ I CPU Socket (LGA 1151)
MIC-770
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Intel® 8th/9th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q370/H310 chipsetWide operating temperature (-10 ~ 50 °C), 9 ~ 36 VDC input power range2 x GigaLAN, 2 x USB 3.1 and 6 x USB 3.02 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, and 1 x mSATASupports 2 x LAN, isolation COMs, and 32-bit GPIO modulesSupports Advantech i-ModulesSupports Advantech SUSIAccess and embedded software APIsVGA and HDMI™ output (The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.)
