LGA
IC packaging designed to fit on an array of sockets or SMT soldered.
-
Product
Test Socket Based Elastomeric Matrix Connectors
-
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
-
Product
LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI
ASMB-976
-
- LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor- DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory- 4 x PCIe x16 and 7 x PCIe x8- Intel® X550 dual 10GbE ports- Ten SATA3 and two M.2 connectors (SATA/PCIe compatible)- 0 ~ 40 °C ( 32 ~ 104 °F) ambient operating temperature range
-
Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
Industrial Computer
- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
-
Product
43.5W to 66W - Single Output
iBF Series
-
*DOSA Compatible Footprint*2.4-5.5 Vdc, 4.5-14 Vdc Inputs*0.6-3.63 Vdc, 0.7-5.5 Vdc Outputs*Non-Isolated*Excellent Transient Response*LGA or EPC format*No external loop tuning components needed
-
Product
Stamped Spring Pin Sockets
-
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
-
Product
LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI
ASMB-816
-
- LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor- DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory- Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1- Intel® X550 dual 10GbE ports- Eight SATA 3 and one M.2 connectors (SATA/PCIe compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
-
Product
Test Sockets
BGA/LGA
-
There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
