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Computational Fluid Dynamics
qualitative and quantative simulation of fluid mechanics.
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Multiphysics Computational Fluid Dynamics (CFD) Simulation & Analysis
STAR-CCM+
Siemens Digital Industries Software
STAR-CCM+ is a stand-alone simulation solution for computational fluid dynamics (CFD), computational solid mechanics (CSM), heat transfer, particle dynamics, reacting flow, electrochemistry, electromagnetics, acoustics and rheology. STAR-CCM+ delivers accurate and efficient simulation technologies through a single integrated user interface and automated workflows. This facilitates the analysis and exploration of complex real-world problems.
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Fluids
Computational Fluid Dynamics (CFD) Simulation Software. Ansys computational fluid dynamics (CFD) products are for engineers who need to make better, faster decisions. Our CFD simulation products have been validated and are highly regarded for their superior computing power and accurate results. Reduce development time and efforts while improving your product’s performance and safety.
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Basic Heating Module
Microwave heating analysis including loads rotation and translation, frequency tuning, heat flow and material parameters modification as a function of dissipated power. QW-BHM (Basic Heating Module) for QuickWave 3D provides a novel regime of operating the FDTD solver: the possibility of simulating microwave heating problems.The software has been prepared to work in sophisticated regimes, modelling rotation and movement of the heated load(s) even along complicated trajectories, etc. Transfer of the heat generated by electromagnetic fields can be modelled with external or internal Heat Transfer Module or by coupling QuickWave 3D simulations to external computational fluid dynamics packages.
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Computational Fluid Dynamics
CFD
Computational Fluid Dynamics analysis is a value-added service from Teledyne Cormon that predicts pipeline flow and sand particle behavior for specific project scopes, allowing asset integrity teams to understand the optimal placement for erosion and corrosion monitoring probes.
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Testing & Measurement Services
Delserro Engineering Solutions
Delserro Engineering Solutions is your complete source forHALT/HASS, Accelerated Life Testing, Environmental Testing, Lead Free Solder Joint Reliability Testing, Linear andNon-Linear FEA, Computational Fluid Dynamics (CFD)
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Simulation
From structural analysis and computational fluid dynamics to injection molding simulation and advanced, cloud-enabled capabilities powered by Abaqus, SOLIDWORKS® and 3DEXPERIENCE® Works Simulation provide integrated analysis tools for every designer, engineer, and analyst.
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Fluids And Thermal
Whether you’re an analyst performing advanced computational fluid dynamics (CFD) modeling or a design engineer who quickly needs to understand fluid or thermal effects on a design proposal, Altair offers a complete line of tools to support your project. From detailed component analysis to full systems performance, Altair provides a range of scalable solvers under Altair CFD™, as well as robust pre- and post-processing software for CFD.
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COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
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COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Enclosed Fanless Industrial Embedded Computer with NXP® i.MX8M Application Processor
SYS-444Q
The SYS-444Q is a rugged enclosed fanless embedded computer system with NXP’s i.MX8M industrial application processor with quad-core Arm Cortex®-A53 for low-power processing. This rugged system has dual Ethernet, industrial I/O, expansion options, TPM 2.0 hardware security, and options for wireless connectivity. The processor supports industry-leading video processing along with an M4 microcontroller for real-time subsystems making it an ideal fit for industrial IoT applications requiring highly reliable performance in harsh conditions such as digital signage, industrial automation, energy management, building automation, and others.
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OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
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Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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SMARC® 2.1 Short Size Module With NXP I.MX95
LEC-IMX95
ADLINK LEC-IMX95, based on the powerful NXP i.MX95 (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) processor with an integrated ISP and eIQ Neutron Neural Processing Unit (NPU) operating at up to 2 TOPS., is the latest SMARC revision 2.1 compliant module. It combines power-efficient high-performance compute, immersive Arm® Mali™-powered 3D graphics, innovative NXP NPU accelerator for machine learning, and high-speed data processing with safety and security features.
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Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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Value Family 9th Generation Intel® Core™ i7/i5/i3 & 8th Gen Celeron® Processor-Based Embedded Fanless Computer
MVP-5100 Series
ADLINK MVP-5100 Series of fanless embedded computing platforms, incorporating the 9th Generation Intel® Core™ processor, is optimized for edge computing applications. The MVP-5100 Series consolidates high performance computing, scalable function and I/lO enhancements, and industrial-grade reliability onto a compact fanless platform, providing reliable long-time operation for performance-critical applications in industrial automation, logistics, transportation, and smart city segments.
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COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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COM-HPC Server Type Modules
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
