Deep Packet Inspection
check to examine data within a packet. Also known as: DPI
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
Thickness and Flaw Inspection
NORTEC 600
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Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Product
Non-Destructive Inspection Equipment
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Non-destructive inspection means that various materials such as metal are "without damaging the object, knowing the presence or absence of scratches on the surface or inside and the degree of scratches, and passing the object against standards such as standards.
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Product
Entry-level X-ray Inspection System
X-eye 5100 Series
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100kV ~ 130kV Micro-focus Closed tube and high-definition Flat Panel Detector are installed and high-resolution image can be gained.Customer convenience is primarily considered in operation and maintenance of the product.Customization is available because it is specially designed to be add up any necessary functions depends on customer needs with reasonable prices.
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Product
3D Automated Optical Inspection Systems
New 3Di Series
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To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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Product
Fiber Optic Inspection
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Optical Wavelength Laboratories
A dependable connector endface inspection scope is a vital part of any fiber optic professional’s tool kit. Inspecting patch cord connector endfaces before attaching them to equipment or patch panels saves time and effort, and ensures a clean, quality connection. These 400x video inspection scopes allow users to view connector endfaces on a PC or laptop screen, preventing harmful invisible light from entering the users eye, and ensuring maximum eye protection.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Product
Digital Automated Interferometer for Surface Inspection
DAISI
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DAISI (Digital Automated Interferometer for Surface Inspection) achieves the high workability and repeatability with the features such as auto-focus function, auto-calibration function and auto connector fixing system.
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Product
3D Inspection Service
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The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Product
Defect Inspection System
F30
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The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Product
Visual Visual Inspection Device
IP-3000
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Our visual visual inspection device Inspection Pro IP-3000 is an inspection device that quickly and accurately inspects the mounting board, which is constantly evolving, and judge whether it is good or bad without omission.
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Product
Deep Learning Accelerators
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ADLINK’s Deep Learning Accelerators provide GPU- and VPU-accelerated inferencing with embedded, small, and standard form factors. ADLINK’s Deep Learning Accelerators offer high performance, power efficiency and longevity support required of AI applications at the edge, delivering actionable insights at the right place at the right time for industrial automation, transportation, smart city, military and aerospace applications and more.
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Product
Automated X-ray Inspection (AXI)
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Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
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Product
Automated Optical Inspection (AOI)
TR7700 SIII 3D
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TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Product
Automated Optical Inspection System
506
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We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Product
Solar Power Plant Inspection Service
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We provide various performance/safety tests including insulation resistance measurement, ground resistance measurement as well as string I-V inspection, EL inspection, and IR inspection using thermography. We provide services of pre-operation voluntary test and pre-operation self check, mandated by revision of FIT scheme in 2017 for solar plants of 500kW – 2,000kW.
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Product
Sensor for Filament Inspection
EyeFI
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EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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Product
Automatic Flight Inspection System
AT-920DG
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Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
Iris Power Robotic Inspection Vehicle
RIV800
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The Iris Power RIV800 Robotic Inspection Vehicle and Camera System, allows a visual inspection of the generator stator and rotor, including checking the air vents for debris, with or without removing the rotor. The robotic inspection vehicle also provides an automated means of EL CID electromagnetic core imperfection detection testing and SWA stator wedge analyzer testing.
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Product
3D Inspection Software
Metrolog X4
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Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Product
X5C Compact X-Ray Inspection
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Designed with packed convenience food, ready meals and small packaged goods in mind, the X5C is LOMA's smallest X-ray system available, with a machine length of 1000 mm and offers excellent Critical Control Point (CCP) protection in the smallest footprint possible - and manufactured under LOMA's Designed to Survive philosophy to provide one of the toughest systems on the market.
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
Rack Extender Kit, 9025TR, 1.5" Deep
310113494
Rack Exntender
The Rack Mount Extender Block Kit is used for mounting to racks with recessed mounting rails recessed more than 1.” It is made of aluminum with a black anodized finish. NOTE: Used only with slide mounted 9025TR Receivers.
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Product
In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
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X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Product
Borescopes & Inspection Cameras
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Triplett Test Equipment & Tools
Is an inspection camera with a detachable wireless 3.5" color display. It features 4x digital zoom, water resistant 8mm camera with 3.5ft cable, and 4 adjustable white LEDs for illumination.The wireless display detaches from the handle for additional freedom in viewing, and internal magnets will conveniently mount it to steel surfaces. With the included Micro SD card you can save snapshots and live video. Saved files can be viewed on the LCD screen or downloaded to a computer via the USB port.
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Product
Automated Optical Inspection System
AOI Series
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Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
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Product
X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Product
X-Ray Inspection System
MX1
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Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
