Wafer Level Reliability
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Probe Card
VC20E Series
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Probe Card
VC43™/VC43EAF™
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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MPI Automated Probe Systems
MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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WAFER MVM-SEM
E3300 Family
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Reliability Testing
ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse variations between lots, between temperature extremes and during lifetime (often these defects escape ATE). The improvements to products and processes needed to arrive at zero defects cannot be driven by the quantity of Big Data alone, the quality of reliability data is a strategic advantage that only ELES can provide.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Wafer Probers
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Reliable Evaluation of Damping Materials and Composites
Carrousel
Carrousel measures the dynamic vibration properties of coated or non-coated materials. The method is based on the classic "Oberst" procedure where Autoneum has improved both the measurement procedure itself and the mathematical model used to evaluate the results. The Carrousel software automatically calculates the damping loss factor at various conditions and temperatures as well as controlling both the Carrousel apparatus and the all-important temperature when measuring in a temperature chamber.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Level Sensors
Intelligent solutions for level and point level measurementWhether for continuous level measurement, point level measurement or both – SICK offers a wide range of solutions for process engineering, storage, and protection. Based on the installation situation, medium properties, and environmental conditions, SICK provides sensors that ensure efficient processes. As the provider of one of the broadest technology portfolios, SICK brings its knowledge to the forefront.
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Level Monitoring
Magnetic level switches are used for the monitoring and control of liquid level in tanks. These level switches are specifically manufactured to customer specifications. The float switches are manufactured with a hermetically sealed contact which is located within the guide tube. The float sliding on the tube contains a ring magnet which activates the sealed contact in a non-contacting fashion. The sealed contacts are available as SPST (N/O or N/C) or SPDT (N/O + N/C). The float sliding up and down on the guide tube is the only moving part on the M-series magnetic float switches.
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Level Indicators
4B has a wide range of radio frequency (RF), rotary paddle and capacitance point level indicators for detecting high, intermediate, or low levels of liquids, powders and free flowing granular solids stored in tanks, bins, silos or other containers. Certain units can also be used as plug or choke detectors in chutes, conveyors and elevator legs.
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Level Translators
ADI’s level translators offer the most flexible level translation solutions in the industry. The ADG3241 series translators allow direct 3.3 V to 1.8 V translation by means of the innovative SEL pin function while allowing bidirectional data transfer. The ADG3231 series allows wide range 1.65 V to 3.6 V translation and the ADG3308 series allows the industry's widest 1.2 V to 5.5 V up or down translation while permitting bidirectional data transfer.
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Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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Level Measurement
Omega provides contact and non-contact instruments for liquids, and non-contact instruments for solids. Choose from continious measurement or point level measurement with one of our level switches.
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Wafer Probe Test System
STI3000
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
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Laser Diode Reliability Burn-In / Life-Test System
58602
Chroma 58602 is a high density, precision multi source measurement Unit (SMU) module with temperature control and exchangeable interface developed for burn-in, reliability and life test of optoelectronic components including laser diodes, VCSELs, VCSEL Arrays, silicon Photonics, photo-diodes and other similar components.
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Level Measurement
As a market leader in level detection with the largest selection of agency approved level switch technologies, the K-TEK level products line has the proven technology to provide solutions for the most difficult liquids and solids level applications.
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Fluid Level Sensor
The output of the fluid level sensor is a voltage which changes in direct proportion to the level of fluid in the probe. The difference in permittivity between air and the fluid being measured changes the capacitance between the probe's two concentric tubes as the level changes. An RS232 connection to a PC allows the user to calibrate the fluid level and thermal drift compensation. The probe is factory replaceable, allowing the electronics to be re-used should the probe become damaged or if a new probe length is required.
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