Bump
-
Product
Bump Test Machine
-
Labtone Test Equipment Co., LTD
Bump test systems for electrical products repeating impact testing during transportation
-
Product
Pneumatic Bump Test Machine
KRD20 series
-
The KRD20 series pneumatic bump test machine replaces the traditional mechanical cam-type crash bench and is suitable for repeated impacts on electronic components, equipment and other electrical and electronic products during transportation or working.
-
Product
Auto Bump/Calibration Station
PS500
-
Teledyne Gas & Flame Detection
To provide accurate performance and results, the PS500 has to be properly used and maintained. The Auto Bump & Calibration Station (ABC) provides bump testing, calibration and data management options and is compact, robust and intuitive to use.Two versions of the ABC are available allowing either a single gas cylinder or up to three cylinders to be connected. Additionally, a special three cylinder version is available for reactive gases.
-
Product
Mini Bump Probe F07537S030P300HP
1167099
-
The Mini Bump Probe F07537S030P300HP (item number 1167099) is designed for precise contacting of very small, densely spaced mini bumps on printed circuit boards. Its tip style 37 (4-point crown stepped) with a tip diameter of only 0.3 mm focuses the contact on the individual bump and reduces the risk of touching adjacent structures at the same time. With a pitch of 1.90 mm / 75 mil and 300 cN spring force, F07537S030P300HP combines a compact contact geometry with defined mechanical loading. The continuous-current rating is 4 A. In this P/HP version, Progressive Coating and increased spring preload work together so that F07537S030P300HP is suited to difficult contacting conditions involving OSP, flux residues or contaminated test points.
-
Product
Shock/Bump Multifunctional Tester
DP-201
-
King Design Industrial Co., Ltd.
Shock or bump test mainly simulate the impact effects of product and its components encountered in usage and transit process. Through standard and high-reproducibility instant energy exchange, you can analyze the product ability to tolerate the strong external stress and the degradation of structural weaknesses to quickly obtain the data of structure strength, anti-shock appearance and anti-drop. Shock tester is one of destructive experiments, and do destructive test on the product to evaluate the product reliability and monitor the consistency of production line.
-
Product
Compact Bump Gas Solution
Eco Bump
-
Teledyne Gas & Flame Detection
Importantly, bump testing is the only way to validate that gas detectors will respond to gas and trigger user alarms.Simplified configuration (no software).Measuring only 7.2” (180mm) in height (including the push button regulator), the pocket-sized EcoBump can easily be stored and transported with minimal shipping costs.With 5.5L of bump gas capacity, EcoBump provides approx. 250 bump tests from a single cylinder making it our most cost effective bump solution.
-
Product
Pneumatic Vertical Shock Test System
KRD11 series
-
KRD11 series pneumatic vertical shock test system is featured with advanced design, high degree of automation and reliability, simple operation and convenient maintenance. The system meets the requirements of both shock and bump test, can perform conventional half-sine wave, post-peak sawtooth wave, trapezoid wave and other waveform shock tests.
-
Product
C-Band Separate Dispersion Compensation Raman Fiber Amplifier
DRA5228/F
-
Hangzhou Huatai Optic Tech. Co., Ltd.
Raman Fiber Amplifier (RFA) utilizes the optic gain in the Stimulated Raman Scattering (SRS) in the optical fiber and realizes the amplification of the signal optic. FRA, with very low equivalent noise and a wide gain scope, can further widen the gain bandwidth by adopting multi-wavelength optical bump, which represents the development direction of the new optical fiber amplifier.
-
Product
Wafer Thickness Measurement System
MPT1000
-
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
-
Product
Light and Energy Meter
Model 659
-
UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
-
Product
Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
-
* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
-
Product
Light and Energy Meter
Model 656
-
OAI Model 656 Meter is designed for use with all mask aligners and flood exposure systems. For over 45 years, OAI is a world leader in UV Light & Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries.
-
Product
Copper Pillar Bump
-
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
-
Product
IC Test Services
-
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
-
Product
Stellar 4000 Bondtester
-
STELLAR 4000 is the platform of choice for all manually operated pull and shear production bond testing. Configure as a simple bond wire pull tester, or upgrade for ball shear, die shear, bump pull, and tweezer pull testing.
-
Product
G3 System
Dragonfly
-
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
-
Product
Fine Pitch Double Plunger Probe FP650D2901B035G030L057
1131051
-
The Fine Pitch Double Plunger Probe FP650D2901B035G030L057 (item number 1131051) is designed for precise contacting where installation space is limited. Tip style 29 (4-point crown) targets FP650D2901B035G030L057 at solder bumps and pads; Fine Pitch Probes are used, among other applications, in semiconductor final test, WLCSP solutions, MEMS and micro-PCB testing. In FP650D2901B035G030L057, the double-plunger design provides spring-loaded contacting on both sides and can compensate for mechanical tolerances in compact interfaces. Key design data for FP650D2901B035G030L057 includes pitch 0.8 mm / 31 mil, spring force 30 cN, continuous current 4 A.
-
Product
X-ray Inspection Performance
MXI Quadra 7
-
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
-
Product
Fine Pitch Double Plunger Probe FP300D2901B016G019L032
1023004
-
The Fine Pitch Double Plunger Probe FP300D2901B016G019L032 (item number 1023004) is designed for precise contacting where installation space is limited. Tip style 29 (4-point crown) targets FP300D2901B016G019L032 at solder bumps and pads; Fine Pitch Probes are used, among other applications, in semiconductor final test, WLCSP solutions, MEMS and micro-PCB testing. In FP300D2901B016G019L032, the double-plunger design provides spring-loaded contacting on both sides and can compensate for mechanical tolerances in compact interfaces. Key design data for FP300D2901B016G019L032 includes pitch 0.4 mm / 16 mil, spring force 19 cN, continuous current 1.4 A.
-
Product
Vibration Testing System
-
Torontech is now offering Vibration Test Systems, Shock Test Systems, Bump Test Systems, Drop Tester, and Packaging Transportation Simulators.
-
Product
Scanning Acoustic Microscope
Pulse2
-
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
-
Product
Advanced Packaging & TSV
FilmTek 2000M TSV
-
Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
-
Product
330 System
NSX
-
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
-
Product
ArgoBot Kit
ROB-00001
-
The ArgoBot Full Kit is a fully assembled robot and controls development platform. It is based on the Digilent chipKIT WF32(TM), a WiFi enabled development platform, and configured for LabVIEW targeting. Most importantly ArgoBot was designed with FIRST Robotics Competition teams in the front of our minds! Named after the FRC Team 1756 mascot, Argos, the ArgoBot development platform includes a fully-assembled, ready to drive mini WiFi enabled robot (about 8" x 5" x 4"), as well as tons of FRC controls tutorials and example code (LabVIEW VIs). Features included on the ArgoBot will look very familiar to anyone who has worked with National Instruments products (Compact RIO and RoboRIO) in the past. This includes three 5V Digital I/O modules (with jumpered pull-ups), three 5V analog inputs, and an I2C header. Example VIs have been streamlined to enable a 1-click configuration style to accelerate your development process. We also added a 2-channel motor driver that is used to supply the ArgoBot drive motors. Our ultimate goal is that everything you can build, control or implement on ArgoBot can be easily leveraged on your FRC bot! Complimenting its many electrical features, ArgoBot is easy to work with and easy to maintain. The chassis is a polycarbonate (the extremely tough stuff that is easy to drill and modify but easily takes bumps and bruises without cracking) case that is fully intact - meaning that ArgoBot doesn't just come with a case... it is a case! Clean-up and organization is simple - just close the case and turn off the power switch.
-
Product
Bump Tester
KD-163
-
King Design Industrial Co., Ltd.
*Comply with IEC-68-2-29 testing specification(10g/ 16ms、15g/6ms、 40g/6ms、100g/2ms).*Easy installation and simple operation; Low noise; no maintenance required; function holds long.*Well-designed and no resonant-structure, air anti- vibration pad can effectively isolate floor vibration.*Accelerometer adopts repeated measurement and adjustable half-sine wave generator; to control the data is precise.*Magnesium alloy platform is anodized, Servo motor cam to drive, and can adjust the frequency automatically.*The adjustable acceleration value and shock domain is patent design (1ms-13ms).
-
Product
Semiconductor
-
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
-
Product
Wafer & Die Inspection
-
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
-
Product
Environmental Test Chamber
-
Labtone Test Equipment Co., LTD
Environmental test system, Electro-dynamic Shaker, Shock Test Systems, Drop Tester, Bump Test Systems, Combined Environmental Test Systems
-
Product
Nano-focus X-ray Inspection System
X-eye NF120
-
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
-
Product
Shock Test System
-
Labtone Test Equipment Co., LTD
Products are inevitably affected by impact, bump, free fall, tumbling etc. during production, transportation, loading and unloading as well as during the use of the products. All of these are transient excitation on the object, causing the object to produce mechanical characteristics of high speed, acceleration, strain rate instantly. These kind of characteristics are completely different from that in static load, and may cause problems to the object in terms of structural strength and stability and sometimes the object may fail. Therefore, it's necessary to study the effect of impact and reproduce the shock environment, to assess the structural strenghth and performance of the object under shock environment.
