Bump
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Light and Energy Meter
Model 659
UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
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IC Test Services
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Pneumatic Vertical Shock Test System
KRD11 series
KRD11 series pneumatic vertical shock test system is featured with advanced design, high degree of automation and reliability, simple operation and convenient maintenance. The system meets the requirements of both shock and bump test, can perform conventional half-sine wave, post-peak sawtooth wave, trapezoid wave and other waveform shock tests.
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Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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ArgoBot Kit
ROB-00001
The ArgoBot Full Kit is a fully assembled robot and controls development platform. It is based on the Digilent chipKIT WF32(TM), a WiFi enabled development platform, and configured for LabVIEW targeting. Most importantly ArgoBot was designed with FIRST Robotics Competition teams in the front of our minds! Named after the FRC Team 1756 mascot, Argos, the ArgoBot development platform includes a fully-assembled, ready to drive mini WiFi enabled robot (about 8" x 5" x 4"), as well as tons of FRC controls tutorials and example code (LabVIEW VIs). Features included on the ArgoBot will look very familiar to anyone who has worked with National Instruments products (Compact RIO and RoboRIO) in the past. This includes three 5V Digital I/O modules (with jumpered pull-ups), three 5V analog inputs, and an I2C header. Example VIs have been streamlined to enable a 1-click configuration style to accelerate your development process. We also added a 2-channel motor driver that is used to supply the ArgoBot drive motors. Our ultimate goal is that everything you can build, control or implement on ArgoBot can be easily leveraged on your FRC bot! Complimenting its many electrical features, ArgoBot is easy to work with and easy to maintain. The chassis is a polycarbonate (the extremely tough stuff that is easy to drill and modify but easily takes bumps and bruises without cracking) case that is fully intact - meaning that ArgoBot doesn't just come with a case... it is a case! Clean-up and organization is simple - just close the case and turn off the power switch.
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Stellar 4000 Bondtester
STELLAR 4000 is the platform of choice for all manually operated pull and shear production bond testing. Configure as a simple bond wire pull tester, or upgrade for ball shear, die shear, bump pull, and tweezer pull testing.
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C-Band Separate Dispersion Compensation Raman Fiber Amplifier
DRA5228/F
Hangzhou Huatai Optic Tech. Co., Ltd.
Raman Fiber Amplifier (RFA) utilizes the optic gain in the Stimulated Raman Scattering (SRS) in the optical fiber and realizes the amplification of the signal optic. FRA, with very low equivalent noise and a wide gain scope, can further widen the gain bandwidth by adopting multi-wavelength optical bump, which represents the development direction of the new optical fiber amplifier.
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Vibration Testing System
Torontech is now offering Vibration Test Systems, Shock Test Systems, Bump Test Systems, Drop Tester, and Packaging Transportation Simulators.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
