Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
-
Product
Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
-
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
-
Product
Probe Cards
LCD Driver
-
LCD Driver devices are utilized in some of the most popular high definition tech products such as LCD televisions, high functioning smart phones and tablets.
-
Product
Cantilever Probe Cards
-
Cantilever Probe Cards are based on the approved epoxy ring design. The probe-needles are precisely arranged the required pattern to ensure proper contact on the pads.
-
Product
Generic Probe Cards, PIB's, and Loadboards
-
Test Spectrum can provide generic Probe Cards, Probe Interface Boards (PIB), and loadboards. Choose from existing configurations already designed, or a generic test board for your specific tester configuration can be designed quickly.Teradyne J750 Probe Card and PIB; Teradyne Integra Flex PIB; Teradyne Ultra Flex PIB; Teradyne Catalyst PIB; Credence Quartet PIB (Probe Interface Board); Advantest 93K 1024 PIB
-
Product
Probe Cards
Ceramic Blades
-
SV TCL offers a variety of ceramic blades and blade probe cards. We have patented ceramic microstrip blade probes available in low leakage and low capacitance for optimal signal transference, while SV TCL's blade cards are ideal for parametric and RF testing.
-
Product
Probe Cards
-
These cards are compatible with WLCSP and can be customized according to pin positions. They can be used for a pitch of up to 180 μm. We are developing a product for a pitch of 150 μm, to be compatible with narrower pitches.
-
Product
Probe Cards
Direct Dock
-
Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
-
Product
Probe Cards
-
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
-
Product
Probe Card Analyzers
PB6500
-
The Probilt PB6500 has many features that make it the ideal analyzer for all probe card technologies, including the latest probe tip geometries being used to test leading edge semiconductor devices. Its excellent electrical measurement capability and the ability to drive relays on any channel make it the best tool for probe cards with complex circuits and relays on the PCB.
-
Product
Complete Power Analysis System
PK3564
-
PK3564 complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, and 1-year deluxe warranty.
-
Product
Osprey Probe Card
-
The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design. The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.
-
Product
Vertical Probe Cards
B3
-
The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
-
Product
Probe Card
VC20E Series
-
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
-
Product
Probe Card Analyzers
PB3600
-
The PB3600 provides the latest techniques in testing and maintaining probe cards. Designed through joint development with many of the world’s largest semiconductor and probe card manufacturers, ITC has produced an ergonomic analyzer with the greatest measurement resolution, highest throughput, most flexibility and still made it easy to use.
-
Product
Probe Holders
Model P7
-
Made from 300 series stainless steel, the P7 probe holders accept all model 407 replaceable probe tips, and are secured with a set screw. When used with the P7 Tool Holder Adapter Arm; “Z” position adjustments are easy, and can accommodate a variety fixtures and probe card holders. Designed for both high temperature (-65 to 300°C) and high electrical isolation measurements.
-
Product
Cantilever Probe Cards
Venture
-
Nidec SV Probe’s VentureTM line of cantilever probe cards represents the finest epoxy technology on the market and are perfect for logic testing. The Venture line includes an extensive array of cantilever cards, single to multi-die for a variety of test systems. Other capabilities include: • 3K Points • Pad Pitches as Tight as 35µm • Up to 32 DUTsContact your Nidec SV Probe sales representative to determine which VentureTM product is right for your testing application.
-
Product
Production Parametric Probe Card
VC20TM Fab
-
*Maximum channel count: 48*Tester platforms: Keysight 4062, 4072, 4080, Keithley S600, S530, Rack and Stack configurations.*Minimum Pad Size: 30ux30u (tunable scrub)*Contact Resistance: less than 1 ohm*Temperature range: -65C to 200C*Leakage: Less than 5 femto Amps per volt. If you require faster settling time*Repairable*Lifetime Performance: Production customers are experiencing 10M+ million touchdowns on Aluminum and Copper pads. Few to no rebuilds due to pobe wear
-
Product
Multisite Probe Card
T300 ButtonTile™
-
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
-
Product
Wafer Testing
Trio Vertical
-
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
-
Product
LED Probes for testing
-
Advanced Probing Systems, Inc.
Probe Needles are used for the fabrication of most probe cards, however there exist applications for which these materials may not be appropriate, e.g., hubrid device and gold pad probing.
-
Product
Enhanced Probe Station
EB Series
-
Comprehensive prober for DC and RF. The EB series contains features to step-up your usability to acquire the accurate data you need from your devices. It has a built in probe card slot.
-
Product
Complete Power Analysis System
PK3564-PRO+
-
PK3564-PRO+ complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, PSM-A Software, Mini Line-to-DC Converter, Bluetooth Adapter, USB Communications Cable, CASW Weather-Resistant Carrying/Operating Case, and 2-year deluxe warranty.
-
Product
Semiconductor Test
-
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
-
Product
Probe Card Analyzers
PB6800
-
The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tip geometries to be captured and accurately measured. Probilt’s PB6800 large measurement chuck allows probe arrays as big as 300 mm in diameter to be touched down without overhanging the chuck surface.
-
Product
Probecard testers
MANAGER
-
Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
-
-
Product
Probe Card Solutions
-
Advanced engineering solutions are required to meet increasing challenges for wafer test, driven by today’s rapid technology acceleration. Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.
-
Product
Probe Card
VC43™/VC43EAF™
-
VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
-
Product
Probe Card
VersaTile™
-
Celadon has reduced the size of a probe card to 28mm with the VersaTile™ with Advanced Cantilever™ technology. The VersaTile™ with Advanced Cantilever™ technology can fit on a conventional 3-hole mount probe positioner for single site probing. The same VersaTile™ with Advanced Cantilever™ technology can be used in a 300mm VersaPlate™ for multi-site probing.
-
Product
Probe Card
Tile-on-Card™
-
Celadon’s uniquely robust and repairable patented probe-in-ceramic crash resistant probe cards reduce maintenance headaches while increasing tester utilization. Celadon’s TOC™ probe cards are known for achieving 10 million+ touch downs before rebuild on test floors worldwide.
