Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
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Probe Cards
LCD Driver
LCD Driver devices are utilized in some of the most popular high definition tech products such as LCD televisions, high functioning smart phones and tablets.
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Cantilever Probe Cards
Venture
Nidec SV Probe’s VentureTM line of cantilever probe cards represents the finest epoxy technology on the market and are perfect for logic testing. The Venture line includes an extensive array of cantilever cards, single to multi-die for a variety of test systems. Other capabilities include: • 3K Points • Pad Pitches as Tight as 35µm • Up to 32 DUTsContact your Nidec SV Probe sales representative to determine which VentureTM product is right for your testing application.
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Probe Cards
Ceramic Blades
SV TCL offers a variety of ceramic blades and blade probe cards. We have patented ceramic microstrip blade probes available in low leakage and low capacitance for optimal signal transference, while SV TCL's blade cards are ideal for parametric and RF testing.
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Cryogenic 4K Probe Cards
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe cards as well as DUT probing solutions. These Cryogenic probe cards have all the benefits of Celadon’s Crash Resistant™ probe technology but with the ability to probe as cold as humanly possible. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovate custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cable-out designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Vertical Probe Cards
B3
The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
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Probe Cards
These cards are compatible with WLCSP and can be customized according to pin positions. They can be used for a pitch of up to 180 μm. We are developing a product for a pitch of 150 μm, to be compatible with narrower pitches.
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Generic Probe Cards, PIB's, and Loadboards
Test Spectrum can provide generic Probe Cards, Probe Interface Boards (PIB), and loadboards. Choose from existing configurations already designed, or a generic test board for your specific tester configuration can be designed quickly.Teradyne J750 Probe Card and PIB; Teradyne Integra Flex PIB; Teradyne Ultra Flex PIB; Teradyne Catalyst PIB; Credence Quartet PIB (Probe Interface Board); Advantest 93K 1024 PIB
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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PCIe Carrier For PMC And PrPMC
PCI104
The PCI104 is a PCIe carrier for PCI Mezzanine Cards (PMC) or Processor PCI Mezzanine Cards (PrPMC). The PCI104 carrier allows simplified testing of PMC/PrPMCs and their associated PMC I/O Modules (PIMs) by using a PC environment during board development or deployment. The PCI104 can also reduce the costs of manufacturing PMC/PrPMCs by allowing manufacturers to use off-the-shelf PCs for functional testing. The PCI104 converts the PCIe x4 edge connection to PCI-X via a PCIe to PCI-X bridge. The trace lengths to the PMC/PrPMCare kept to a minimum so the PMC/PrPMC can run with a133MHz PCI-X clock speed. The J4 connector of the installed PMC/PrPMC is routed to a 96-pin DIN connector per theVITA-35 specification. The PCIe to PCI-X bridge can run in either transparent or non-transparent mode and can also operate in forward or reverse mode. The PCI104 has a fan mounted on the board to cool the PMC/PrPMC. The fan can easily be removed for testing and probing of hosted card.
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Probe Card Analyzers
PB6500
The Probilt PB6500 has many features that make it the ideal analyzer for all probe card technologies, including the latest probe tip geometries being used to test leading edge semiconductor devices. Its excellent electrical measurement capability and the ability to drive relays on any channel make it the best tool for probe cards with complex circuits and relays on the PCB.
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Complete Power Analysis System
PK3564
PK3564 complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, and 1-year deluxe warranty.
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Probecard testers
MANAGER
Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
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Advanced Probe Card / V type
VC Series
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
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Production Parametric Probe Card
VC20TM Fab
*Maximum channel count: 48*Tester platforms: Keysight 4062, 4072, 4080, Keithley S600, S530, Rack and Stack configurations.*Minimum Pad Size: 30ux30u (tunable scrub)*Contact Resistance: less than 1 ohm*Temperature range: -65C to 200C*Leakage: Less than 5 femto Amps per volt. If you require faster settling time*Repairable*Lifetime Performance: Production customers are experiencing 10M+ million touchdowns on Aluminum and Copper pads. Few to no rebuilds due to pobe wear
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Cantilever Probe Cards
Cantilever Probe Cards are based on the approved epoxy ring design. The probe-needles are precisely arranged the required pattern to ensure proper contact on the pads.
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High-Speed Trimming System
LSR-3230
* no fixture or probe cards on top side * 2, 4, and 6 wire test capability * touch screen operation * high performance DC electrical tester * high throughput - low running cost
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Motherboards
ITC currently manufactures over 100 different motherboard types, including interfaces to all major brands and types of testers. Additionally, ITC has the ability to quickly design and manufacture motherboards for any new tester interface including custom probe cards.
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
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Osprey Probe Card
The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design. The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.
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Probe Card
VC20E Series
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Cost-Effective ATE System
PRO RACK ATE
Qmax Test Technologies Pvt. Ltd.
Pro-Rack is a cost effective ATE System, which comes with Modular Structure provision option to improvise and enhance much instrumentation based on the user’s requirements. Basically it is designed to cater to the needs of PCB test and repair depots, keeping in mind the changing PCB technology and the challenges in testing them off-line. It can provide complete PCB test and diagnostic functions for any kind of PCB including the latest very high density complex PCBs with high pin count PQFP, FPGA VLSI chips. AC /DC parametric tests enables testing of the DC parametric of device pins on the edge connector for input bias current, Fan out capacity ,Tri-state leakage currents, AC parametric measurements such as Input / Output Propagation delay Rise time / Fall time to further enhance fault coverage. Pro-Rack is designed with VPC Mass Interconnect adapter with 16 bit fixture ID interface to the UUT through simple clips and probes or through card edge or through a bed of nail test fixture.
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Complete Power Analysis System
PK3564-PRO
PK3564-PRO complete Power Analysis System includes PS3550 Power Analyzer, AC charger, Quick-Start manual, deluxe voltage leads, four eFX6000 flexible current probes, SD memory card, CAS3 hard-shell carrying case, PSM-A Software, Mini Line-to-DC Converter, Bluetooth Adapter, USB Communications Cable, and 1-year deluxe warranty.
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Vertical Space Transformers
ST
The Space Transformer (ST) is an integral part of the probe card, utilized between the probe head and the PCB. Nidec SV Probe provides a wide variety of space transformation options including: • WST™ (Wired Space Transformer) • MST™ (Modular Space Transformer) • MLC (Multi-Layer Ceramic) • MLO/Mini-PCB (Multi-Layered Organic) • Multi-Site MLO Reflow of Package Substrate • MLC with MLTF to 50µm PitchOne of the main priorities for Nidec SV Probe is the internal development and manufacture of our own probe card components. We now offer in-house manufactured space transformer technologies with shorter lead time and competitive pricing. Contact your sales representative to learn more about our internally manufactured STs or any of our other ST technologies.
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CMOS Image Sensor
CIS
CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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Probe Card
VC20E Lab
*20 millimeter ceramic probe card*Optimized for DC parametric test, modeling and characterization, and single site WLR*Can be quickly installed using an interface tool into various interfaces and takes minimal storage space on the test floor*Effective operating temperature range from -65° to 200° C*Leakage as low as 5fA/V. If you require faster settling time, click here*Can be configured with up to 48 probes
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LED Probes for testing
Advanced Probing Systems, Inc.
Probe Needles are used for the fabrication of most probe cards, however there exist applications for which these materials may not be appropriate, e.g., hubrid device and gold pad probing.
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Metrology
SV TCL also has the capability to emulate the testing environment with our probe card analyzers including newly installed direct dock analyzers in the United States, Taiwan and Vietnam. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
