ASIC
Application Specific Integrated Circuits are application specific custom made ICs.
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Product
Inductive Proximity Sensors
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Millions of inductive proximity sensors are currently in use in virtually all industries. They detect metal objects without contact, and are characterized by a long service life and extreme ruggedness. With the latest ASIC technology, SICK's sensors offer the ultimate in precision and reliability. SICK can provide the right solution to meet your requirements every time – from cylindrical or rectangular standard sensors with single, double or triple operating distance, to special sensors for explosive zones and harsh environments. Our sensors are the intelligent, reliable route to implementing industry-specific and customized solutions to any task involving automation.
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Product
Digital Fiber Sensor
FX-500 Ver.2
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Panasonic Industrial Devices Sales Company of America
Thanks to its new “application-specific integrated circuit” (ASIC), Panasonic can solve applications with Fiber Optic Sensors that were previously impossible. Not only can the FX-500 Series reach a response time of 25µs while providing extremely accurate detection, integrated logic functions save you money because external controllers are no longer needed for normal applications and threshold tracking and self-diagnostic functions save time for maintenance. Moreover, the reliability of the detection has increased by 75% compared to that of previous models.
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Product
Oscilloscope
RTP
Oscilloscope
The R&S®RTP high-performance oscilloscope combines high-class signal integrity with a fast acquisition rate. Customized frontend ASICs and realtime processing hardware enable highly accurate measurements with unprecedented speed in a compact form factor.
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Product
Component Test and Analysis Laboratories
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The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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Product
I/O Expanders and Level Translators
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ST’s Xpander family of general-purpose input/output port expanders are used to interface digital ASICs via a two-line bidirectional bus (I²C) . ST’s dual-supply level translators are used as interface between multi-voltage chipsets and system I/Os, ranging from 5.5 V down to 1.2 V.
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Product
The Intel® RealSense™ Depth Sensing Portfolio
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Intel® RealSense™ offers a range of stereo vision cameras and modules, supported by an extensive open-source SDK. The D400 product line helps you ensure that you can add robust three-dimensional vision capability to your products or systems. The cameras feature an integrated ASIC that performs real-time depth calculation directly on the camera, saving you processing resources on the host system. The SDK allows you to further tune the depth data stream to your needs.
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Product
Mixed Signal Tester
STI9000
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The STI9000 is a mixed signal ATE used for testing ASIC and MEMS products. Each STI9000 test instrument fits into a small tester mainframe and contains multi-functional analog and digital test resources.
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Product
Universal PMICs
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PowerArchitect™ design and configuration software speeds development and significantly reduces overall time-to-market compared to legacy analog power solutions. An I²C interface and multiple GPIO pins ensure easy system integration. Configurable warning and fault levels, fault behavior and power up and down sequencing ensure any load can be properly powered and protected. The power system design can be completed with confidence long before the final revision of the SoC or ASIC is available.
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Product
VME Master - DAQ and Detector Interface
VX1394
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The VX1394 board features a radiation hard 4.8 Gbps SERDES ASIC, which, in connection to a rad-hard optical transceiver implements a newer generation optical links for many detector readout systems. The ASIC performs data transmission, trigger distribution and clock forwarding towards the front-end electronics in the crate.
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Product
PCI Express 5 Base Specification Receiver Test Automation
N5991PB5A
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The N5991PB5A is the receiver test automation software for bit error ratio testers, allowing you to test and characterize PCI Express 5.0 ASICs
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Product
Analyze RTL
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ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
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Product
Digital Oscilloscope
MSO/DS7000
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The MSO/DS7000 series digital oscilloscope is a mid-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Product
Microelectronic Services
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Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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Product
Pressure Sensors
ESCP-MIS1 Sensor
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ES Systems has developed a series of medium isolated pressure sensors suitable for applications with harsh environmental conditions where resistance to corrosive fluids or gases is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS ASIC for the signal conditioning. The MEMS pressure sensor dies are underpinned by ES’s innovative microfabrication process for silicon capacitive sensors.
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Product
Network Switches
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Our switch fabric modules provide full service switching through hardware accelerating ASICs from leading device makers including Mellanox or may be software defined for upgradability. These high bandwidth switches include system management capabilities including full compliance with VITA 46.11.
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Product
Rad Hard Power
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Renesas' radiation hardened (rad hard) power products achieve the stringent voltage accuracy required of FPGAs, ASICs, microprocessors, and microcontrollers used in space and harsh environment applications. Our solutions enable regulation accuracy over input voltage, load current variation, switching noise, and large load transients and have proven highly reliable within mixed radiation exposure rates and other harsh environment variants.
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Product
ASICs
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ams has been creating unique ASIC (Application Specific Integrated Circuit) solutions in partnership with customers for over 30 years. We enable our partners to create highly differentiated products that are smarter, safer, easier to use and more eco-friendly. Our various industry experts in automotive, industry, medical and smart building are looking forward to talk to you and to define the solution which will exactly fit your needs.
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Product
SparkFun Qwiic MicroPressure Sensor
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The SparkFun Qwiic MicroPressure Sensor is a miniature breakout equipped with Honeywell's 25psi piezoresistive silicon pressure sensor. This MicroPressure Sensor offers a calibrated and compensated pressure sensing range of 60mbar to 2.5bar, easy to read 24 bit digital I2C output, and can be calibrated and compensated over a specific temperature range for sensor offset, sensitivity, temperature effects, and non-linearity using an on-board Application Specific Integrated Circuit (ASIC). With its ultra-low power consumption and Qwiic ports, you've got yourself a power packed little sensor!
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Product
Audio MEMS Sensors
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An audio MEMS sensor is an electro-acoustic transducer housing a sensor (MEMS) and an application-specific integrated circuit (ASIC) in a single package.
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Product
ARM Development Studio 5
DS-5
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ARM DS-5 is the tool-chain of choice for software developers who want to fully realize the benefits of the ARM Architecture. Comprising features such as the best-in-class ARM Compiler, powerful OS-aware debugger, system-wide performance analyzer, and real-time system simulator, DS-5 is an integrated development environment that assists engineers in delivering optimized and robust software for ARM processor-based ASICs and ASSPs.
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Product
3U VPX Flash Storage Module
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Curtiss-Wright Defense Solutions
The 3U VPX (VITA 46 and 48.2) Flash Storage Module (FSM) provides high-performance, high-capacity, solid-state SATA storage with AES-256 bit encryption using an Application Specific Integrated Circuit (ASIC) that is FIPS-140-2 validated (Certification #1472). The 1" pitch conduction-cooled solid state storage device utilizes high reliability SLC NAND flash designed for the most demanding application.
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Product
Digital Solutions
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Dexter's Digital Detectors and Temperature Sensor Modules (TSM's) are based on Dexter's superior silicon thermopile technology and incorporate an ASIC that provides a cost effective front end for reading out the detector output. The digital solutions include pre-amplification, A/D, multi-plexing and SMBus communications. Additionaly, the SMBus can accommodate communications with up to 100 digital products. Our digital solutions are housed in industry standard TO-5/TO-39 packages.
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Product
Complete IP Module
Scan Ring Linker SRL
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The Scan Ring Linker SRLTM - is a complete IP module that can be easily embedded into a CPLD, FPGA or ASIC on a PCB to reduce the complexities and costs of designing 1149.1 (JTAG) test infrastructure for designs that use multiple scan rings. The SRL IP module links any number of scan rings (secondary scan paths) into a single high-speed test bus, which permits devices on secondary scan chains to be independently tested and configured through a single 1149.1 external interface.
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Product
GRIDSCAN 5000
Hydrogen Series
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The H2scan GRIDSCAN 5000 Hydrogen Sensor pairs a high performance ASIC to H2scan’s field-proven solid-state hydrogen sensor. This stand-alone sensor system has been designed to provide precision hydrogen measurement, at a lower cost for the high-volume OEM or utilities. No calibrations or maintenance is needed for up to 10 years, and the GRIDSCAN 5000 is the lowest cost by thousands to any other available hydrogen DGA system. H2scan is the only company in the industry that can state retail sales of over 15,000 sensor systems worldwide with no after sale calibrations performed since 2012.
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Product
Digital Oscilloscope
MSO8000
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The MSO8000 series digital oscilloscope is a mid- to high-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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Product
CompuScope GPU CUDA Processing
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Performing real-time digital signal processing (DSP) routines such as Fast Fourier Transform (FFT), Signal Averaging, Finite Impulse Response (FIR) Filtering, Digital Down Conversion (DDC) and more have traditionally required the use of dedicated DSP processors, Field Programmable Gate Arrays (FPGAs), or Application Specific Integrated Circuits (ASICs).
