Alignment
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Product
Nanopositioner
P-616 NanoCube
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Physik Instrumente GmbH & Co. KG
Compact Parallel-Kinematic Piezo System for Nanopositioning and Fiber Alignment. In a parallel-kinematic multi-axis system, all actuators act directly on a single motion platform. This means that all axes can be designed with identical dynamic properties, which reduces the moved mass considerably. Further advantages: It is possible to make the parallel-kinematic system more compact than serial stacked or nested systems. The errors and masses of each individual axis do not accumulate.
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Product
Bi-Directional Alignment Laser
LA-01MB-AK
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These bi-directional alignment lasers allow Quick & Easy adjustment of optical experiments and optical sets.
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Product
Alignment Pin Replacement Kit, G2/G6/G10, Receiver
310118000
Receiver
This kit contains parts/ tools needed to replace missing or damaged alignment/ dowel pins on the G2, G6, or G10 receiver: 2 alignment/ dowel pins Loctite primer Loctite adhesive Dimension blockInstructions for replacement can be found in G2/G6/G10 user manual.
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Product
Core Fusion Splicer with Dual Observation
STC-OFS701H
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Shanghai Stone Communication tech Co., Ltd
The smallest Core to core fusion splicer with dual observation Weight 1.2kg only 3.5 inch TFT color LCD monitor with X & Y view simultaneously Fiber core can be displayed clearly with large magnification Alignment mode: Core, cladding and manual alignment 9 seconds splice time and 30 seconds heat time Friendly operation interface and smart menu Operation with Max wind velocity of 15m/s Operation with max 5000m above sea level Typical 120 cycles with battery
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Product
CMOS Image Sensor
CIS
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CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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Product
Active Alignment Assembly & Test Platform
Test Platform
Quickly deliver flawless camera & LiDAR modules, MEMS devices, die based sensors, LED and laser-based headlights and other high-end products with a supremely accurate standardized platform.
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Product
Laser Alignment
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Laser beams are tracing a perfect straight propagating line. A special unique instrument was developed to monitor the direction and position of this laser beam, creating a cornerstone device for alignment. Typical applicationns are mechanical straightness and alignment, calibration articulated arms, accurate positioning, and many more. To facilitate unrestricted movement of the AlignMeter family a built-in wireless system was developed.
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Product
Optical Fusion Slicers
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ShinewayTech Optical Fusion Splicers - Ribbon, Clad Alignment & Core Alignment Splicers.
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Product
Multiphoton FLIM System
DCS-120 MP
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*Multiphoton FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*Excitation by Ti:Sa Laser*Two Non-Descanned Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage*Laser Control via SPCM Software
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Product
Automatic Test System
Star-Rec
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Test entire HDI panel at once, or step & repeat in the "feed" direction. Fastest BGA Strip test system available. Star-Rec comes standard with: * loader * board cleaner * CCD Camera Alignment * electrical test section * fail and pass re-stackers * Board Marker
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Product
Vibration and Alignment
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When vibration increases beyond normal levels, it may be a sign of alignment issues or source of trouble and you need fast and actionable answers. Fluke Vibration Testing and Laser Shaft Alignment Equipment and Systems were designed specifically for maintenance professionals who need to quickly perform vibration analysis and evaluate alignment to understand the root cause of equipment condition.
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Product
Gross Alignment Funnel / Enhanced Latch Indicator (GAF/ELI)
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A wet-mate connector system designed to optimize ROV mating efficiency, the Gross Alignment Funnel (GAF) can be used in conjunction with the Enhanced Latching Indicator (ELI) to overcome severe approach angles of ROV connectors during mating. In conditions with low visibility and heavy current, the system aids in aligning the mating halves and providing a clear visual indicator when a successful mate occurs. Easily installed on an existing Nautilus or Rolling Seal bulkhead mounted connector, the system reduces ROV operator variability, resulting in faster mating and demating operations.
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Product
Confocal FLIM for Macroscopic Objects
DCS-120 Macro
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*FLIM of Macroscopic Objects*Scan Field Up to 15 mm Diameter*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Tuneable Excitation by Super-Continuum Laser with AOTF*Two Fully Parallel Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
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Product
Laser Shaft Allignment Tools
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PRÜFTECHNIK Condition Monitoring GmbH
A laser alignment system is the most efficient way to align rotating machinery shafts. Using an adaptive alignment system instead of conventional alignment tools saves you time and money, increases machine availability, prolongs service life and maintenance intervals, and lowers power consumption. Alignment tools from PRUFTECHNIK adapt to virtually any asset, situation, or user skill level.
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Product
Cladding Alignment Splicer
95EA
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OFS-95EA optical fiber fusion splicer is designed with high-speed image processing technology and special precision-positioning technology. It will automatically finish the whole fiber fusion process in 9 seconds by fast mode, and splice loss is lower than 0.02dB for single mode fiber. 3.5-inch LCD, dual CMOS monitors, X and Y axis separately display or simultaneously display, thus different fusion stages can be showed clearly. It is compatible with ITU-T SM/MM/DS/NZDS/ED fiber, and is equipped with 4-in-1 holders and SOC adapter.
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Product
Plane Mirror Reflector
10724A
Retroreflector
The Keysight 10724A reflector is used with the Keysight 10706A, 10706B, 10715A and 10716A interferometers for single-axis measurements. It can also be used with the Keysight 10737L/R Compact Three-Axis Interferometers. Alignment hardware is included.
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Product
TCoE Setup
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Alignment of the QA strategy to your business goals is critical to ensure that the QA enterprise is able to deliver on the dynamic expectations of the business. While the quality of your applications is an essential metric for the QA enterprise, it also needs to focus on continuous improvement and to be ready for future technologies. At TestingXperts, we help you transform your QA to a next-gen organization by setting up a Testing Center of Excellence (TCoE).
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
Radar Cross Section (RCS) Measurement and Evaluation System
XRC
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KEYCOM develops various radars for versatile applications based on its knowledge and expertise on millimeter wave and microwave technologies. KEYCOM’s product line of radars includes Radar Test Systems (RTS) to evaluate distance accuracy or output, Radar Alignment Systems (RAS) to help you adjust the alignment of radars, and Radar Cross Section (RCS) measurement systems to measure RCS of such radar targets as aircraft, ships and automobiles.
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Product
Single Fiber Aligner
1100
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The 1100 Single Fiber Aligner uses patented fiber alignment concepts to produce virtually instantaneous temporary couplings for OTDR, dispersion, or any other optical fiber or component test that requires a fiber-to-fiber connection. It delivers low loss, low reflectance couplings on the first try virtually every time, without the need for test instrument feedback. As a result, temporary coupling times are minimized and manufacturing costs are reduced without compromising product quality.
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Product
Custom Solutions for Mask Aligners
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OAI offers custom designed solutions built to your unique specification.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
Tabletop Mask Aligner
Model 200
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The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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Product
DUV Mask Aligner
Model 200E
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OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm Excimer Lamp as the UV light source. It is used for Biotechnology Processing.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
Bare Fiber Aligner
1120
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The Photon Kinetics 1120 Bare Fiber Aligner makes it possible to reduce test setup time to seconds, thereby reducing overall testing cost. Just strip the fiber, scribe and break it (or use a more precise fiber cleaver, if desired) and then insert the prepared end into the 1120. In an instant, the fiber is coupled to your OTDR or chromatic dispersion test system with low optical loss and low reflectance. The 1120's compact, ergonomic industrial design is well-suited for low to moderate volume fiber and cable testing applications where automated fiber alignment systems are less economical. It is particularly useful as part of an in-process or finished cable test station employing either the 8000i or 8000 OTDR, and the OASYS.net OTDR Automation Software.
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Product
Virtex UltraScale+ HBM FPGA Processor - SOSA Aligned 3U VPX
Model 5586
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- Jade 5585 and 5586 FAQ- Co-processor for distributed FPGA processing tasks- High-Bandwidth Memory (HBM) delivers 20x more memory bandwidth than traditional DDR4 solutions- Board interfaces: 1 GigE, 10 GigE, 40 GigE, dual 100 GigE and PCIe- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX proessing powerhouse- Features Xilinx Virtex UltraScale+ HBM FPGAs- 10 GigE Interface and 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled- Navigation Design Suite for software and custom IP development
