Alignment
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Product
Radar Systems / Millimeter Wave Radar / Micro Wave Radar
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KEYCOM develops various radars for versatile applications based on its knowledge and expertise on millimeter wave and microwave technologies. KEYCOM’s product line of radars includes Radar Test Systems (RTS) to evaluate distance accuracy or output, Radar Alignment Systems (RAS) to help you adjust the alignment of radars, and Radar Cross Section (RCS) measurement systems to measure RCS of such radar targets as aircraft, ships and automobiles.
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Product
Inspection & Alignment Services
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As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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Product
High-Speed & High-Precision Alignment for Display Metrology
LMK Position
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TechnoTeam Bildverarbeitung GmbH
The LMK Position is a photometric robotic system combining LMK-based machine vision with the high precision and flexible movements of a 6-axis Denso VS industrial robot and, optionally, a JETI specbos spectroradiometer. It allows effective and cost-efficient accompanying measurements during research and development tasks and rapid small-series product testing of all kinds of display systems.
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Product
Mask Alignment Systems
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EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner product generations to augment this core lithography technology.
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Product
Cladding Alignment Splicer
95EA
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OFS-95EA optical fiber fusion splicer is designed with high-speed image processing technology and special precision-positioning technology. It will automatically finish the whole fiber fusion process in 9 seconds by fast mode, and splice loss is lower than 0.02dB for single mode fiber. 3.5-inch LCD, dual CMOS monitors, X and Y axis separately display or simultaneously display, thus different fusion stages can be showed clearly. It is compatible with ITU-T SM/MM/DS/NZDS/ED fiber, and is equipped with 4-in-1 holders and SOC adapter.
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Product
Laser Beam Alignment
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The alignment product line provides full solutions for applications such as: alignment of laser cavities, straightness measurement, machine alignment, wide-bed printers alignment and others. The AlignMeter system simultaneously measures incoming laser beam position (in µm) and angle (in µRad).It is a powerful compact device perfect for alignment monitoring, for testing the drift, centration and beam alignment relative to the outer housing or tube.
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Product
Fiber Alignment
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Fiber alignment tools are essential for taking precise measurements at high speed. The PK product portfolio features many of the industry’s best-performing tools for aligning single fibers, multi-fiber subunits, connectorized assemblies, and multicore fibers.
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Product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
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QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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Product
Multiphoton FLIM System
DCS-120 MP
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*Multiphoton FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*Excitation by Ti:Sa Laser*Two Non-Descanned Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage*Laser Control via SPCM Software
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Product
Calibration Tools
ICAC-3G software
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PLURA ICAC (Intelligent Connection for Alignment & Calibration) Freeware Tool was created, engineered and utilized to calibrate multiple color related elements in all Plura 3G monitors automatically using recommended color probes.
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Product
Bi-Directional Alignment Laser
LA-01MB-AK
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These bi-directional alignment lasers allow Quick & Easy adjustment of optical experiments and optical sets.
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Product
ADAS Tools
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This 12.7-inch wireless touchscreen tablet comes replete with all the functionality expected in an advanced diagnostic and service tablet including the ability read and erase codes, view Freeze Frame and view and graph Live Data, perform Active Tests and perform coding and adaptions, plus it includes ADAS calibration and Wheel Alignment software.
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Product
Confocal FLIM for Macroscopic Objects
DCS-120 Macro
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*FLIM of Macroscopic Objects*Scan Field Up to 15 mm Diameter*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Tuneable Excitation by Super-Continuum Laser with AOTF*Two Fully Parallel Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
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Product
Headlight Alignment Testing Technology
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Maschinenbau Haldenwang GmbH & Co. KG.
See and be seen: The headlight adjustment test technology provides the user with information about the horizontal and vertical adjustment of vehicle headlights and their intensity. With the help of the headlight alignment test technology, the headlights can be adjusted, taking legal or manufacturer-specific requirements into account.
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Product
LED Type Wafer Alignment Sensor Controller
HD-T1
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Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Product
CMOS Image Sensor
CIS
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CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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Product
Automotive Radar Test ∙ Evaluation
XRE
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KEYCOM develops and manufactures various radar systems to measure and evaluate such functionalities of mass-produced millimeter and microwave radars including in-vehicle radars as transmission power, frequency, antenna beam alignment, distance accuracy, bearing accuracy and receiving accuracy.KEYCOM’s product line includes the Radar Test System (RTS) that measures radar distance accuracy and transmission power, and the Rader Alignment System (RAS) that assists you to adjust the mounting position of the in-vehicle radar.
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Product
Radar Cross Section (RCS) Measurement and Evaluation System
XRC
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KEYCOM develops various radars for versatile applications based on its knowledge and expertise on millimeter wave and microwave technologies. KEYCOM’s product line of radars includes Radar Test Systems (RTS) to evaluate distance accuracy or output, Radar Alignment Systems (RAS) to help you adjust the alignment of radars, and Radar Cross Section (RCS) measurement systems to measure RCS of such radar targets as aircraft, ships and automobiles.
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Product
Fiber Fusion Splicer
KL-300T
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Hangzhou Softel Optic Co., Ltd.
*Core to core alignment by PAS technology (PAS:Profile Alignment System)*Fiber core can be display clearly*Single X or Y view and X & Y view simultaneously*Auto check quality of cleaved end face*Display fiber cleaved and offset angle*Display core and clad offset*5.6 inch TFT color LCD monitor with clear digital image display*USB & VGA interface*Software upgrade via USB interface
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Product
Confocal FLIM System
DCS-120
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*FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Two Fully Confocal Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
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Product
Beam Geometry & Alignment Testing
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Perform quality control testing of your Digital Radiography (DR), Computed Radiography (CR) and Fluoroscopy X-ray systems with ease. Comply with local, state, federal, and governing bodies for digital and traditional analog radiographic imaging technologies.
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Product
Bare Fiber Aligner
1120
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The Photon Kinetics 1120 Bare Fiber Aligner makes it possible to reduce test setup time to seconds, thereby reducing overall testing cost. Just strip the fiber, scribe and break it (or use a more precise fiber cleaver, if desired) and then insert the prepared end into the 1120. In an instant, the fiber is coupled to your OTDR or chromatic dispersion test system with low optical loss and low reflectance. The 1120's compact, ergonomic industrial design is well-suited for low to moderate volume fiber and cable testing applications where automated fiber alignment systems are less economical. It is particularly useful as part of an in-process or finished cable test station employing either the 8000i or 8000 OTDR, and the OASYS.net OTDR Automation Software.
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Product
Large Substrate Mask Aligner
Model 6020
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The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
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Product
MLA 300 Maskless Aligner
MLA 300
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The MLA 300 Maskless Aligner is engineered for high-volume production, delivering exceptional flexibility and precision in the realm of industrial lithography. This innovative tool supports wafers up to 300 x 300 mm and is capable of dynamically adjusting to surface variations, effectively eliminating the need for costly and time-consuming mask production. By employing direct data exposure instead of traditional masks, the MLA 300 provides advanced solutions for complex lithography challenges, including those encountered in advanced packaging, sensor calibration, and MEMS fabrication. With its high throughput of up to 18,000 mm²/min and resolution down to 1.5 μm, it streamlines workflows and integrates seamlessly with manufacturing execution systems (MES), making it the preferred choice for a broad range of applications like microfluidic devices and other cutting-edge technologies.
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Product
3U – 6U SOSA™ Aligned VPX Backplanes
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Using a modular concept based on open standards it is common practice in the civil sector to integrate subsystems components from different manufacturers into a single modular system. The SOSA™ Technical Standard aims at such an interoperability in embedded computing for military applications.
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Product
Front & Backside, Semi-Automatic Mask Aligner
Model 800E
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The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
