Alignment
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
725-Watt (28VDC input) DC/DC Converter, SOSA™ Aligned, 3U VPX
VPX55HS
DC Converter
NAI’s VPX55HS-31 is NAI's latest +28 VDC Input, VPX DC/DC Converter. The VPX55HS was developed in alignment of the SOSA™ Technical Standard and is capable of handling up to 725 Watts of output power. It plugs directly into a standard 3U VPX chassis with a VITA 62 1.0” power supply slot. This off-the-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.
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Product
Virtex UltraScale+ HBM FPGA Processor - SOSA Aligned 3U VPX
Model 5586
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- Jade 5585 and 5586 FAQ- Co-processor for distributed FPGA processing tasks- High-Bandwidth Memory (HBM) delivers 20x more memory bandwidth than traditional DDR4 solutions- Board interfaces: 1 GigE, 10 GigE, 40 GigE, dual 100 GigE and PCIe- High-bandwidth memory, FPGA logic and DSP density make this board a single-slot 3U VPX proessing powerhouse- Features Xilinx Virtex UltraScale+ HBM FPGAs- 10 GigE Interface and 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 46, VITA 48.11, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled- Navigation Design Suite for software and custom IP development
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Product
Tabletop Mask Aligner
Model 200
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The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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Product
FlexVNX+ Test And Development Platform Aligned To SOSA And VITA 90 Standards
39S08VPX98Y2VAN
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Elma’s all-new FlexVNX+ Test and Development chassis is the next generation portable test platform designed to accelerate development and test of VNX+ plug-in cards (PICs) aligned to The Open Group® SOSA™ Technical Standard and VITA 90.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
